JP2767677B2 - Temporarily fixing memory connector and printed circuit board during reflow - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for temporarily fixing a memory connector to a printed circuit board when a memory connector detachably mounted on a memory of a personal computer or the like is connected to a printed circuit board by reflow soldering. is there.

[0002]

2. Description of the Related Art FIG. 6 shows a conventional memory connector and a temporarily fixed state of a printed circuit board. In the figure, a component mounting plate 1 such as an aluminum plate or a glass epoxy plate is provided with four holes, a clearance hole 22 for the engaging claw 9 of the memory connector 3, a clearance hole 5 for the memory connector 3, and the like. Have been. A printed circuit board 2 is mounted on the component mounting plate 1, and the printed circuit board 2 is connected to two engagement holes 10 for engaging with the memory connector 3, and connected to terminals of the memory connector 3. A connection part (not shown) is provided for this purpose, and solder cream or the like is applied to this connection part by printing. The printed circuit board 2 is temporarily fixed to the plate 1 by the adhesive tape 8 from the back side of the plate 1 at the four holes 4.

This memory connector 3 is provided with a projection 13 at the tip on the head 7 side, and two engaging claws 9 for engaging with the printed circuit board 2 on the leg 11 side. Is provided. The engagement of the engagement claws 9 with the engagement holes 10 formed in the printed circuit board 2 temporarily fixes the memory connector 3 to the printed circuit board 2 in a positioned state. The head 7 side of the memory connector 3 enters the escape hole 5 of the component mounting plate 1 and is in a free state. The memory connector 3 is provided with a plurality of terminals 6 for connecting to a connection portion (not shown) of the printed circuit board 2.

[0004]

However, when the thickness of the printed circuit board 2 is smaller than a predetermined dimension,
When the board 2 is thinner than the engagement portion dimension H of the engagement claw 9 of the memory connector 3, there is vertical play between the engagement claw 9 and the engagement hole 10, and the printed board 2 and the memory connector 3 There is a gap between them. On the other hand, the head 7 of the memory connector 3
Is in a free state after entering the escape hole 5 of the component mounting plate 1 and the head 7 is heavier than the leg 11, so that the connector 3
Of the printed circuit board 2
, The memory connector 3 is placed obliquely. If reflow is performed in this state, the memory connector 3 is soldered in a state where the terminals 6 are lifted while being tilted to the printed circuit board 2, so that the connection between the terminals 6 of the connector 3 and the connection portion of the printed circuit board is poor, There is a problem that soldering failure occurs, and there is a serious problem that soldering yield is poor.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has as its object to provide a temporary connection between a memory connector and a printed circuit board at the time of reflow, in which there is no fear of defective soldering and soldering yield is very good. It is to provide a stopping method.

[0006]

The present invention has the following configuration to solve the above-mentioned problems. That is, according to the present invention, the printed circuit board is temporarily fixed to the surface of the component mounting plate, and the engaging claw on the memory connector side is engaged with the engaging hole on the printed circuit board side to temporarily fix the memory connector on the printed circuit board. In the method of temporarily fixing the memory connector and the printed circuit board at the time of reflow in which the terminals of the memory connector and the printed circuit board are connected by reflow soldering, the component mounting plate is provided with a connector receiving surface for supporting the bottom surface of the memory connector. The memory connector and the printed circuit board are held by clips from both sides of the memory connector, and the bottom surface of the memory connector is forcibly pressed against the connector receiving surface to regulate the memory connector to the correct position with respect to the printed circuit board. The terminal of the memory connector is brought into close contact with the connection portion of the printed circuit board. There.

[0007]

During reflow, the component mounting plate, printed circuit board, and memory connector are held by clips from both sides of the connector, and the bottom surface of the memory connector is forcibly pressed against the connector receiving surface. Thereby, the memory connector can be regulated in a correct posture with respect to the printed circuit board, and the terminals of the memory connector come into close contact with the connection portions of the printed circuit board. When reflow is performed in this state, the connection between the terminal of the memory connector and the printed circuit board is favorably soldered.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. In the description of the present embodiment, the same reference numerals are given to the same names as those in the conventional example, and detailed description thereof will be omitted. FIG. 1 shows a temporary fixing state of the memory connector and the printed circuit board at the time of reflow according to the present embodiment. In the figure, a component mounting plate 1 such as an aluminum plate is provided with two holes 4 for temporarily attaching a printed board 2 with an adhesive tape from the back side of the component mounting plate 1. Also, on the side of the component mounting plate 1 where the memory connector is arranged, a relief hole 5 of the projection 13 on the head 7 side of the memory connector 3, a connector receiving surface 14 supporting the bottom surface of the memory connector 3, and both sides. U-shaped notch hole
15 are provided. The connector receiving surface 14 is formed by cutting or the like on a surface parallel to the printed circuit board 2, and the head 7 of the memory connector 3 is mounted on the receiving surface 14.

A printed circuit board 2 is mounted on the component mounting plate 1. The printed circuit board 2 has an engaging hole 10 for engaging with the memory connector 3, and a connection with a terminal of the memory connector 3. Connection portion (not shown) is provided,
Solder cream or the like is applied to this connection portion by printing. On this printed circuit board 2, a memory connector 3
Are mounted, the engaging claws 9 on the memory connector 3 side engage with the engaging holes 10 on the printed circuit board 2 side, and the memory connector 3 is positioned and temporarily fixed to the printed circuit board 2. The memory connector 3, the printed circuit board 2, and the component mounting plate 1 are held by connector holding clips 12 from both sides of the memory connector 3, and the bottom surface of the memory connector 3 is connected to the connector receiving surface 14. And the memory connector 3 is in a correct posture with respect to the printed circuit board 2 (a posture in which the memory connector 3 is parallel to the printed circuit board 2).
And the terminals of the memory connector 3 are brought into close contact with the connection portions (not shown) of the printed circuit board 2.

Next, a method of temporarily fixing a memory connector and a printed circuit board at the time of reflow according to this embodiment will be described with reference to FIGS.
It will be described based on. First, the printed circuit board 2 is placed on the component mounting plate 1, and is temporarily fixed with the adhesive tape 8 from the back side of the plate 1 through the hole 4. This printed circuit board 2
As shown in FIG. 2 (a), the memory connector 3 is placed thereon, and the engaging claw 9 on the connector side and the engaging hole 10 on the board side are engaged to temporarily fix the positioning of the memory connector 3. Then, the bottom surface 16 of the memory connector 3 is placed on the connector receiving surface 14,
The protrusion 13 is inserted into the escape hole 5.

In this state, as shown in FIG. 2B, the memory connector 3, the printed circuit board 2, and the component mounting plate 1
In the U-shaped notch hole 15, both sides (both sides) of the memory connector 3 by the connector holding clips 12.
Hold from. As a result, the bottom surface of the memory connector 3 is pressed against the connector receiving surface 14, and the memory connector 3 is regulated in a correct posture with respect to the printed board 2 (that is, the terminals 6 of the memory connector 3 are parallel to the printed board). ,
The terminal 6 of the memory connector 3 is in close contact with the connection portion of the printed circuit board 2.

When reflow is performed in this state, the solder at the connection portion of the printed circuit board 2 melts, and the memory connector 3
Terminal and the connection portion of the printed circuit board 2 are connected in a normal state. FIG. 2C shows a state where the clip 12 is removed after the reflow is completed.

According to the conventional method of temporarily fixing the memory connector 3 and the printed circuit board 2, the soldering yield at the time of reflow is at most 60%.
According to the temporary fixing method of the present embodiment, the soldering yield between the memory connector 3 and the printed circuit board 2 can be made 100%.

According to the present embodiment, the memory connector 3, the printed circuit board 2, and the component mounting plate 1 are held by the clips 12 from both sides of the memory connector 3, and the bottom surface of the memory connector 3 is forced to the connector receiving surface 14. Since the memory connector 3 is press-contacted and regulated in a correct posture with respect to the printed circuit board 2, the memory connector 3 is tilted in a floating state during reflow even when the printed circuit board 2 is thin. As a result, soldering failure can be prevented and soldering yield can be greatly improved.

Further, since the memory connector 3 is fixed in a correct posture parallel to the printed circuit board 2 and the variation in height from the mounting surface of the board 2 to the upper surface of the connector 3 is suppressed, the thickness of the product can be easily controlled. It becomes easy to store in the case. At the same time, since the thickness is uniform, the reliability of the shape and dimensions is improved.

Further, the work of tape-fixing the printed circuit board 2 to the component mounting plate 1 with the adhesive tape 8 can be simplified since only four places in the related art are required.

The present invention is not limited to the above embodiment, but can take various embodiments. For example, in the above embodiment, the connector receiving surface 14 provided on the component mounting plate is formed by cutting so as to be parallel to the printed circuit board 2. However, as shown in FIG. The recess 23 may be formed by inflating the back surface of the plate by press working using a mold, and the recess 23 may be used as the connector receiving surface 14.

As shown in FIG. 4A, a board attaching jig 17 having a board receiving surface 18 into which the printed board 2 is fitted and a plate receiving surface 19 into which the component mounting plate 1 is fitted.
Then, the printed circuit board 2 and the component mounting plate 1 are fitted into the jig 17 to automatically position both the components 1 and 2, and the hole 4 is sealed with the adhesive tape 8 as shown in FIG. Temporarily fix, and remove the substrate 2 and the plate 1 from the jig 17.
As shown in (c), a method of attaching a substrate to be turned over and turned to the front side may be used. This simplifies the work of positioning plate 1 and printed circuit board 2.

Further, as shown in FIG. 5, for example, an aluminum plate as a component mounting plate is pressed to form a mounting portion 21 of the printed circuit board 2 and a receiving surface 14 of the memory connector 3. 1 may be formed, and the temporary fixing method may be simplified using the plate 1. In this case, the substrate attaching jig 17 becomes unnecessary. That is, the printed circuit board 2 is automatically positioned on the plate 1 simply by mounting the printed circuit board 2 on the mounting portion 21 of the component mounting plate 1. Further, only by engaging the engaging claw 9 with the engaging hole 10, the bottom surface 16 of the memory connector 3 is placed parallel to the connector receiving surface 14 and is automatically positioned.

Furthermore, in the above embodiment, the aluminum plate is used for the component mounting plate 1. However, for example, a glass epoxy plate or the like may be used, and if the material is easy to process and can withstand the reflow temperature, The material of the material does not matter.

Further, when the bottom surface 16 of the connector 3 is formed parallel to the printed circuit board 2 as in the above embodiment, the connector receiving surface 14 on the plate side is connected to the connector bottom surface.
For example, if the connector bottom surface 16 is not parallel to the substrate 2 and is tapered due to connector molding or the like, a taper corresponding to the taper of the bottom surface 16 is formed on the connector receiving surface 14. When the connector 3, the board 2 and the plate 1 are held by the clip 12, the terminal 6 is connected to the board 2.
And the terminal 6 comes into close contact with the connection portion.

[0022]

According to the present invention, the memory connector, the printed circuit board, and the component mounting plate are held by clips from both sides of the memory connector, and the bottom surface of the memory connector is forcibly pressed against the connector receiving surface, thereby connecting the memory connector. The configuration is such that the printed circuit board is regulated in the correct posture, so even when the thickness of the printed circuit board is thin during reflow, the memory connector is not tilted and soldered while floating, resulting in poor soldering. Can be prevented,
The soldering yield can be greatly improved.

Further, since the memory connector is fixed to the printed board in a correct posture, and the height variation from the mounting surface of the printed board to the upper surface of the memory connector is suppressed, the thickness of the product can be easily controlled, and the case can be easily controlled. It becomes easy to store in. In addition, since it is fixed in a correct posture, the reliability of the shape and dimensions is improved.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a method of temporarily fixing a memory connector and a printed circuit board according to the present embodiment.

FIG. 2 is an explanatory diagram of working steps of a method for temporarily fixing the memory connector and a printed circuit board.

FIG. 3 is an explanatory view of a component mounting plate having another configuration of the present invention.

FIG. 4 is an explanatory diagram of working steps of a simple temporary fixing method of a printed board and a component mounting plate having another configuration of the present invention.

FIG. 5 is an explanatory view of a component mounting plate having another configuration of the present invention.

FIG. 6 is an explanatory view of a conventional method of temporarily fixing a memory connector and a printed circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Component mounting plate 2 Printed circuit board 3 Memory connector 4 Hole 5 Escape hole 6 Terminal 8 Adhesive tape 9 Engagement claw 10 Engagement hole 12 Connector holding clip 14 Connector receiving surface 15 U-shaped notch hole

Continuation of the front page (56) References JP-A-4-48557 (JP, A) JP-A 62-184682 (JP, U) JP-A 62-43485 (JP, U) JP-A 62-55377 (JP) , U) Shokai Sho 62-42283 (JP, U) Shokai Hei 2-111084 (JP, U) Japanese Patent Publication No. Sho 50-6302 (JP, B1) (58) Fields surveyed (Int. Cl. ⁶ , DB Name) H05K 3/32-3/34

Claims (1)

(57) [Claims] 1. A printed circuit board is temporarily fixed on a surface of a component mounting plate, and an engagement claw on a memory connector side is engaged with an engagement hole on a printed circuit board side to temporarily fix the memory connector on the printed circuit board. In the method for temporarily fixing the memory connector and the printed board at the time of reflow in which the terminals of the memory connector and the printed board are connected by reflow soldering, the component mounting plate is provided with a connector receiving surface for supporting the bottom surface of the memory connector. By holding the memory connector and the printed circuit board with clips from both sides of the memory connector and forcibly pressing the bottom of the memory connector to the connector receiving surface, the memory connector is regulated to the correct posture with respect to the printed circuit board, The terminal of the memory connector is brought into close contact with the connection part of the printed circuit board. Temporary fixing method of memory connector and printed circuit board.