JPH0222140Y2 - - Google Patents
Info
- Publication number
- JPH0222140Y2 JPH0222140Y2 JP1984129929U JP12992984U JPH0222140Y2 JP H0222140 Y2 JPH0222140 Y2 JP H0222140Y2 JP 1984129929 U JP1984129929 U JP 1984129929U JP 12992984 U JP12992984 U JP 12992984U JP H0222140 Y2 JPH0222140 Y2 JP H0222140Y2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- solder
- copper
- iron wire
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 39
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 32
- 229910000679 solder Inorganic materials 0.000 claims description 24
- 229910052742 iron Inorganic materials 0.000 claims description 16
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 229910020220 Pb—Sn Inorganic materials 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000011162 core material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】
［産業上の利用分野］
本考案は、電子部品用リード線材として使用さ
れる銅・亜鉛合金下地半田めつき鉄線に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a copper-zinc alloy base solder-plated iron wire used as a lead wire material for electronic components.
［従来の技術］
従来、鉄線を使用した安価な電子部品用リード
線材として、鉄線の上に下地めつきとしてニツケ
ルめつきを施し、その上に半田（又は錫）めつき
を施した半田めつき鉄線が知られているが、この
下地めつきとしてニツケルめつきを施した半田
（又は錫）めつき鉄線はもともとニツケルめつき
の性質により半田付性が悪いことから、半田めつ
きの厚さをあまり薄くすることができないこと
や、高温での半田付信頼性に不安があるという問
題がある。[Prior art] Conventionally, solder plating is used as an inexpensive lead wire material for electronic components using iron wire, in which nickel plating is applied as a base plating on the iron wire, and then solder (or tin) plating is applied on top of the nickel plating. Iron wire is known, but solder (or tin)-plated iron wire with nickel plating as the base plating originally has poor solderability due to the nature of nickel plating, so the thickness of the solder plating is not too thin. There are problems in that it is impossible to do so, and there are concerns about soldering reliability at high temperatures.
即ち、ある程度以上半田めつきの厚さを薄くす
ると、半田付の際に下地めつきとしてのニツケル
めつきが露出されるので、このニツケルめつきに
より半田がはじかれ、半田付作業が出来なくなる
ことがあるという問題がある。勿論この問題は半
田めつきの厚さを厚くすることにより解決できる
ことであるが、その代わり製品の価格が高くなる
ことになる。 In other words, if the thickness of the solder plating is reduced beyond a certain level, the nickel plating as the base plating will be exposed during soldering, and the solder may be repelled by this nickel plating, making it impossible to perform the soldering work. There is a problem. Of course, this problem can be solved by increasing the thickness of the solder plating, but at the cost of increasing the price of the product.
一方、構造材料としての銅・亜鉛合金は従来か
ら知られているが、電子部品用リード線の分野に
おいて、しかも半田めつき鉄線の下地めつき材料
として、銅・亜鉛合金が使用もしくは検討された
例はこれまでにない。 On the other hand, copper-zinc alloys have long been known as structural materials, but copper-zinc alloys have not been used or considered in the field of lead wires for electronic components, and moreover, as base plating materials for solder-plated iron wires. There has never been an example of this.
［考案が解決しようとする課題］
本考案の目的は、上記に鑑み、半田付の際に下
地めつきが露出されても必要な半田付性を確保で
き、その結果全体として半田めつきの厚さを薄く
することができる、安価で有利な銅・亜鉛合金下
地半田めつき鉄線を提供することにある。[Problem to be solved by the invention] In view of the above, the purpose of the invention is to ensure necessary solderability even if the base plating is exposed during soldering, and as a result, the overall thickness of the solder plating can be reduced. An object of the present invention is to provide an inexpensive and advantageous copper-zinc alloy base solder-plated iron wire that can be made thin.
［課題を解決するための手段］
本考案の要旨は、銅・亜鉛合金を下地めつきと
して施すことにあり、それにより半田付の際に下
地めつきが露出されても必要な半田付性を確保で
き、その結果全体として半田めつきの厚さを薄く
することができるようにしたものである。[Means for solving the problem] The gist of the present invention is to apply a copper-zinc alloy as a base plating, thereby achieving the necessary solderability even if the base plating is exposed during soldering. As a result, the overall thickness of the solder plating can be reduced.
半田めつきの半田としては、例えばPb−Sn，
Pb−Ag，Cd−Sn、低温半田、アルミニウム半
田が使用されるが、普通はPb−Sn半田が使用さ
れる。 Examples of solder for solder plating include Pb-Sn,
Pb-Ag, Cd-Sn, low temperature solder, and aluminum solder are used, but usually Pb-Sn solder is used.
鉄線としては、調質されたものが使用されると
良い。 It is preferable to use tempered iron wire.
調質された鉄線の表面に下地めつきとして銅・
亜鉛合金めつきが施されるが、その厚さは0.3μ〜
0.5μ（好ましくは0.4μ）であることが好ましい。
半田めつき（又は錫めつき）の厚さは4.0μ〜7μで
あることが好ましい。銅・亜鉛合金の銅と亜鉛の
比率は、銅90％〜50％に対し亜鉛10％〜50％であ
れば、必要な半田付性が得られる。つまり、95％
以上の半田濡れ面積をもつてなるMIL規格を満
足する。 Copper is applied as a base plating to the surface of tempered iron wire.
Zinc alloy plating is applied, but the thickness is 0.3μ ~
It is preferably 0.5μ (preferably 0.4μ).
The thickness of the solder plating (or tin plating) is preferably 4.0μ to 7μ. The necessary solderability can be obtained if the ratio of copper and zinc in the copper-zinc alloy is 90% to 50% copper and 10% to 50% zinc. That is, 95%
It satisfies the MIL standard with the above solder wetted area.
［実施例］
第１図は、本考案の一実施例に係るに係る半田
（錫）めつき鉄線の横断面図である。１は芯材た
る鉄線、２は厚さ0.4μの銅・亜鉛合金めつきから
なる下地めつき層、３は厚さ5μの電気めつきに
よる半田（錫）めつき層である。下地めつきとし
ては、錫−鉛合金からなる半田めつきが使用され
る。錫−鉛合金の成分は、限定はしないが錫60％
〜70％残鉛であり、溶融点は190℃前後で比較的
低いものである。その成分の範囲外のものだと、
溶融点は200℃〜300℃（Sn10：Pb90）となる。[Example] FIG. 1 is a cross-sectional view of a solder (tin) plated iron wire according to an example of the present invention. 1 is an iron wire as a core material, 2 is a base plating layer made of copper/zinc alloy plating with a thickness of 0.4μ, and 3 is a solder (tin) plating layer with a thickness of 5μ by electroplating. As the base plating, solder plating made of tin-lead alloy is used. The composition of the tin-lead alloy is not limited to 60% tin.
~70% residual lead, and the melting point is relatively low at around 190℃. If it is outside the range of its ingredients,
The melting point is 200°C to 300°C (Sn10:Pb90).
［考案の効果］
本考案によれば、鉄線を芯材となし、その上に
銅・亜鉛合金めつきを下地めつきとして施してか
ら、半田又は錫の電気めつきを施すことにより、
半田付の際に下地めつきが露出されても必要な半
田付性を確保することができ、その結果、半田め
つきの厚さを薄くすることができると共に製品価
格をより一層安くすることができる。そして、こ
れにより全体として安くて軽くて半田付しやすい
非常に有利な電子部品用リード線を得ることがで
きるという効果を有する。[Effects of the invention] According to the invention, iron wire is used as the core material, copper-zinc alloy plating is applied thereon as a base plating, and then electroplating with solder or tin is applied.
Even if the base plating is exposed during soldering, the necessary solderability can be ensured, and as a result, the thickness of the solder plating can be reduced and the product price can be further reduced. . This has the effect that it is possible to obtain a very advantageous electronic component lead wire that is cheap, light, and easy to solder as a whole.
第１図は本考案銅・亜鉛合金下地めつき半田め
つき鉄線の一実施例に係る横断面図である。
１……鉄線、２……銅・亜鉛合金下地めつき
層、３……半田（錫）めつき層。
FIG. 1 is a cross-sectional view of an embodiment of the copper-zinc alloy base-plated solder-plated iron wire of the present invention. 1... Iron wire, 2... Copper/zinc alloy base plating layer, 3... Solder (tin) plating layer.
Claims (1)
きを施し、その上に電気めつきにより半田又は錫
めつきを施してなることを特徴とする銅・亜鉛合
金下地半田めつき鉄線。 A copper/zinc alloy base solder-plated iron wire, characterized in that copper/zinc alloy plating is applied as a base plating on the iron wire, and solder or tin plating is applied thereon by electroplating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12992984U JPS6146055U (en) | 1984-08-28 | 1984-08-28 | Copper/zinc alloy base solder plated iron wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12992984U JPS6146055U (en) | 1984-08-28 | 1984-08-28 | Copper/zinc alloy base solder plated iron wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6146055U JPS6146055U (en) | 1986-03-27 |
| JPH0222140Y2 true JPH0222140Y2 (en) | 1990-06-14 |
Family
ID=30688539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12992984U Granted JPS6146055U (en) | 1984-08-28 | 1984-08-28 | Copper/zinc alloy base solder plated iron wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6146055U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS526253A (en) * | 1975-06-30 | 1977-01-18 | Yoshida Kogyo Kk | Slide fastener |
| JPS5530078A (en) * | 1978-08-26 | 1980-03-03 | Matsushita Electric Works Ltd | Device for moving ceiling plate |
| JPS5817275A (en) * | 1981-07-24 | 1983-02-01 | Toshiba Corp | Pilot valve device |
-
1984
- 1984-08-28 JP JP12992984U patent/JPS6146055U/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS526253A (en) * | 1975-06-30 | 1977-01-18 | Yoshida Kogyo Kk | Slide fastener |
| JPS5530078A (en) * | 1978-08-26 | 1980-03-03 | Matsushita Electric Works Ltd | Device for moving ceiling plate |
| JPS5817275A (en) * | 1981-07-24 | 1983-02-01 | Toshiba Corp | Pilot valve device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6146055U (en) | 1986-03-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100318818B1 (en) | Protective film bonding to leadframe | |
| CA2030865A1 (en) | Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board | |
| DE1521401B2 (en) | PROCESS FOR IMPROVING THE SOLDERABILITY OF A SURFACE OF A BODY COMPOSED SUBSTANTLY OF NICKEL | |
| JPH04329891A (en) | Tin plated copper alloy material and its production | |
| JPH08164496A (en) | Sn-zn solder, sn-zn-bi solder, method for surface treatment of same, and mounted substrate using it | |
| JPH0222140Y2 (en) | ||
| JPS5586130A (en) | Connection of semiconductor element | |
| JP3057994B2 (en) | Pole for lead storage battery and method of manufacturing the same | |
| JPH0445985B2 (en) | ||
| JPS57114265A (en) | Ic lead frame and transistor comb and manufacture thereof | |
| JPH028459B2 (en) | ||
| JPS6335359B2 (en) | ||
| JPH10163404A (en) | Input/output terminal for ball grid array(bga) | |
| JPS58127355A (en) | Lead frame | |
| JPS5575893A (en) | Production of solder | |
| JPH02207539A (en) | Semiconductor device | |
| JPS6050342B2 (en) | Lead frame for semiconductor device manufacturing | |
| JP3906584B2 (en) | Lead for electronic parts | |
| SU217185A1 (en) | ||
| JPS6427246A (en) | Semiconductor unit and manufacture | |
| JPS57145352A (en) | Lead frame for semiconductor | |
| JPS6434597A (en) | Cu conductive compound with satisfactory solderability | |
| JPS638136Y2 (en) | ||
| JPS54146960A (en) | Semiconductor device | |
| JPS5922947Y2 (en) | Brazing filler metal |