JPH0222064A - Recording element driving unit, and ink jet driving unit and ink jet recording apparatus using the same - Google Patents

Abstract

PURPOSE:To easily prepare a recording element driving unit by mounting a recording element substrate and a drive element substrate on the same base plate in an electrical continuity state. CONSTITUTION:The drive element substrate 2, electrical connection member 3 and recording element substrate 5 arranged between a pressure contact member 1 and a base plate 7 as well as the drive element substrate 2, electrical connection element 3 and printed circuit board 6 also arranged therebetween are mutually brought to a pressure contact state by the pressure contact member 1 fixed to the base plate 7. At this time, both substrates 2, 5 are electrically connected to each other by the righthand electrical connection member 3 while the drive element substrate 2 and the printed circuit board 6 are electrically connected by the lefthand electrical connection member 3. Further, the printed circuit board 6 is electrically connected to a connector 8 to make it possible to input an image signal from the outside. As mentioned above, said substrates 2, 5, 6 can be easily fixed to one base plate 7 and a recording element driving unit can be easily prepared.

Description

Detailed Description of the Invention [Field of Ua Business Application] The present invention relates to a recording element drive unit for driving a recording element according to an image signal input from the outside in ink sheet recording, etc., and an inkjet drive unit using the same. The present invention relates to an inkjet device.

[Prior Art] Conventionally, as a technique for electrically connecting a recording element substrate and a driving element substrate, the following techniques are known.

■Wire bonding method This method electrically connects the electrodes 14, 15 of the recording element substrate 4 and desired electrodes of the drive element substrate to the ridge shown in FIG. It's a way to connect.

(2) Method of forming a recording element and a driving element on an integrated substrate This method is a method of forming a recording element and a driving element on an integrated substrate using an appropriate film forming technique.

■Method using an electrical connection member This method is a method of connecting the electrode portion of the recording element substrate and the electrode portion of the drive element substrate using an electrical connection member as disclosed in Japanese Patent Application No. 133395/1983. It is.

FIG. 4 is a diagram for explaining this method. In the figure, 5 is a recording element substrate, 2 is a drive element substrate, 14 and 15 are electrodes, and 19 and 2° are insulating films. Also,
3 is an electrical connection member, 17 is an electrically conductive member, 1
8 is a holder for holding the electrically conductive member 17. Here, the pitch of the electrically conductive member 17 is set narrower than the pitch of the electrodes 14 and 15.

The recording element substrate 5, drive element substrate 2, and electrical connection members are first arranged as shown in FIG. 4(a), and then as shown in FIG.
They are pressed together as shown in b). Further, FIG. 2(c) is an overall view after crimping.

[Problems to be Solved by the Invention] However, the conventional electrical connection method described above has the following problems.

■ Wire bonding method ■ In the wire bonding method, in order to avoid contact between adjacent ultrafine metal wires, the pitch dimension of the connecting parts on the drive element (distance between the centers of adjacent connecting parts 1!III)
We have no choice but to maintain a certain amount of distance between each other. Therefore, once the size of the drive element is determined, the maximum number of connection portions is necessarily determined. However, in the wire bonding method, the pitch dimension is usually as large as about 0.2 mm, so the number of connections must be reduced.

Conversely, this means that if the number of connection parts between the drive element and the recording element is fixed, the sizes of the drive element substrate and the recording element substrate must be returned to extremely long sizes.

■The height h of the ultra-fine metal wire measured from the connection part on the drive element is usually 0.2 to 0.4 mm, but it is relatively difficult to make it thinner than 0.2 mm, so it is necessary to make it thinner. I can't plan.

■Wire bonding takes time. In particular, when the number of connection points increases, bonding time becomes longer and production efficiency deteriorates.

■If the transfer mold condition range is exceeded for some reason, the ultra-fine metal wire may be deformed or, in the worst case, cut.

In addition, in the connection portion on the drive element, Aλ that is not alloyed with the ultrafine metal wire is exposed, so Afl corrosion is likely to occur, resulting in a decrease in reliability.

(2) When a drive element becomes defective, it is difficult to replace only the drive element.

(2) The method of forming the recording element and the driving element on an integrated substrate has the problem that if a defect occurs in any part of the recording element or the driving element, the entire system will stop working.

■Method using electrical connection members In this method, as can be seen from FIG. 7(C), the reference plane of the recording element substrate 4 and the driving element substrate 5 (the surface on which elements etc. are mounted)
Since the directions are opposite to each other, there are problems in that strict dimensional accuracy is required when mechanically fixing each board during manufacturing, and fixing work becomes difficult.

[Means for Solving the Problems] A first aspect of the present invention is to provide a method comprising a holder made of an electrically insulating material and a plurality of electrically conductive members disposed on the holder. and a plurality of electrically conductive members, one end of which is exposed on one side of the holder, and the other end of the electrically conductive member is exposed on the other side of the holder. a recording element base on which a plurality of recording elements are disposed, a drive element base on which a plurality of drive elements are disposed, a circuit base for transmitting a drive signal to the drive element base, and the recording element base. and a base for arranging the circuit substrate; press-contacting the recording element substrate and the driving element substrate, and the circuit substrate and the driving element substrate, respectively, via the electrical connection member. a pressure contact member for; the recording element base and the drive element base are electrically connected via the first electrical connection member, and the drive element base and the circuit base are connected to the second The present invention is present in a recording element drive unit characterized in that the recording element drive unit is electrically connected via an electrical connection member.

A second aspect of the present invention includes a holder formed using an electrically insulating material and a plurality of electrically conductive members disposed on the holder, and a plurality of electrically conductive members. a plurality of electrical connection members, one end of which is exposed on one surface of the holder, and the other end of the electrically conductive member is exposed on the other surface of the holder; A recording element base on which elements are arranged, a drive element base on which a plurality of drive elements are arranged, and a circuit base for transmitting a drive signal to the drive element base: The recording element base and the circuit base are arranged. a pressure-contact member for press-contacting a base for mounting, the recording element base and the drive element base, and the circuit base and the drive element base, respectively, via the electrical connection member; An ejection port for ejecting ink and a liquid path communicating with the ejection port are formed on the recording element base, and the recording element base and the drive element base connect to the first electrical connection member. The drive element base and the circuit base are electrically connected through the second electrical connection member.

A third aspect of the present invention includes a holder formed using an electrically insulating material and a plurality of electrically conductive members disposed on the holder, one end of the electrically conductive member. are exposed on one surface of the holder, and the other end of the electrically conductive member is exposed on the other surface of the holder; a plurality of records; a recording element base on which elements are disposed; a drive element base on which a plurality of drive elements are disposed; a circuit base for transmitting a drive signal to the drive element base, the recording element base, and the circuit base on which are disposed; a base for mounting, a pressure contact member for contacting the recording element base and the drive element base, and the circuit base and the drive element base, respectively, through the electrical connection member. , an ejection port for ejecting ink and a liquid path communicating with the ejection port are formed on the recording element base, and the recording element base and the drive element base are connected via the first electrical connection member. An inkjet recording apparatus comprising: an inkjet drive unit that is electrically connected to the drive element base and the circuit base through the second electrical connection member. do.

(Electrical Connection Member) The electrical connection member according to the present invention has a plurality of electrically conductive members arranged on a holder made of an electrically insulating material. The disposed conductive members are electrically insulated from each other. For example, it is possible to embed a part of the electric four-electric member in the holder in a staggered manner, or other methods may be used. For example, it may be disposed on the surface of the holder by an appropriate means without being embedded in the holder.

One end of the electrically conductive member is exposed on one side of the holder, and the other end is exposed on the other side of the holder.

In addition, when an electrically conductive member is provided only on the surface, one end and the other end may be connected by appropriate wiring. Furthermore, the electrically connecting member may be composed of one layer or multiple layers of two or more layers. good.

(Electrically conductive member) The electrically conductive member may be anything as long as it exhibits electrical conductivity. Although metal materials are generally used, materials other than metal materials such as those exhibiting superconductivity may also be used.

Gold is preferred as the material for the metal member, but any metal or alloy other than the metal fittings may also be used. For example, Ag, Be, Ca9MgMo, Ni, W, Fe, Ti
, In TaZn, Cu, Afl, Sn, Pb-3n
Examples include metals or alloys such as.

In addition, the metal member and the alloy member may include the same type of metal or different types of metal in the same electrical connection member. Furthermore, one of the metal members and alloy members of the electrical connection member may be made of the same metal or alloy, or may be made of different metals or alloys.

Furthermore, materials other than metals and alloys may be used, as long as they exhibit conductivity, and may include a metal material containing one or both of an organic material and an inorganic material. Further, a combination of an inorganic material and an organic material may be used as long as it exhibits conductivity.

Furthermore, the cross section of the electrically conductive member can be circular, square, or other shapes.

Further, the thickness of the electrically conductive member is not particularly limited. Considering the pitch of the connection parts of electric circuit components, for example, 20 μm
It may be greater than or equal to φ or less than 20 μmφ.

Note that the exposed portion of the electrically conductive member may be on the same surface as the holder, or may protrude from the surface of the holder. This protrusion may be on one side only or on both sides. If it is made to protrude further, it may be shaped like a hump.

Further, it is preferable that the pitch of the electrically conductive member is smaller than the pitch of the connecting portion of the driving element. By doing so, it becomes possible to connect the connection portion of the drive element base and the electrical connection member without requiring positioning of the connection portion of the drive element and the electrical connection member.

Note that when buried in the holder, the electrically conductive member does not need to be arranged vertically in the holder, but rather diagonally from one side of the holder to the other side of the holder. Good too.

(Holding body) The holder is made of electrically insulating material.

Any electrically insulating material may be used.

Examples of electrically insulating materials include organic materials and inorganic materials. Alternatively, it may be a metal or alloy material that has been treated so that the electrically conductive members are electrically insulated from each other. moreover,
One or more types of inorganic materials, metal materials, and alloy materials having a desired shape such as powder, woven material, plate-like material, rod-like material, and spherical material may be dispersed in the organic material. . Furthermore, one or more of organic materials, metal materials, and alloy materials having a desired shape such as powder, fibers, plate-like bodies, rod-like bodies, and spherical bodies may be dispersed in the inorganic material. good. In addition, metal materials include powder, fibers, plate-shaped bodies, rod-shaped bodies,
One or more types of inorganic and organic materials may be dispersed and held in a desired shape such as a spherical body. In addition,
When the holder is made of a metal material, for example, an electrically insulating material such as resin may be provided between the electrically conductive member and the holder.

Here, as the organic material, for example, an insulating resin may be used, and as the resin, any one of a thermosetting resin, an ultraviolet curing resin, and a thermoplastic resin may be used. For example, polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyetherimide resin, polystyrene resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polyhencylimidazole resin, polyamideimide resin, polypropylene resin, polyvinyl chloride. Resins such as polystyrene resin, methyl methacrylate resin, polyphenylene oxide resin, phenol resin, melanin resin, epoxy resin, urea resin, methacrylic resin, vinylidene chloride resin, alkyd resin, silicone resin and other resins can be used.

Among these resins, it is more preferable to use a resin with good thermal conductivity because even if the semiconductor element has heat, the heat can be radiated through the resin. moreover,
If the resin is selected to have the same or similar coefficient of thermal expansion as the circuit board, and if at least one hole or multiple bubbles are present in the organic material, thermal expansion/contraction , it becomes possible to further prevent a decrease in reliability of the device.

In addition, specific examples of metal materials and alloy materials include, for example,
Ag, Cu, Au, Afl, Be, CaMg, Mo, F
e, tJ+, Sl, Co, MnW, Cr, Nb, Zr,
Examples include metals or alloys such as Ti, Ta, ZnSn, and Pb-3n.

Examples of inorganic materials include 5i02 B203. Af! , 20. , , Na2O, to 20CaO
ZnOBaOPbO, 5b203As203, La2
03, ZrO2, Ba0P205, TiO2, Mg
O, SiC, Be0BP, BN, Aj2N, B4
C, TaC, TiB2CrB2, TiN, Si3N
4. Examples include ceramics such as Ta2O5, diamond, glass, carbon, boron, and other inorganic materials.

(Printing Element, Driving Element) As the printing element in the present invention, for example, an element operated by thermal energy (heating element) or other printing element, such as a piezo element, may be used.

In the recording element unit and ink sheet unit according to the present invention, the number of connection parts for recording elements may be greater than the required number. Thereby, the electrical connection member and the recording element base can be connected without requiring precise positioning.

On the other hand, the same effect can be obtained by arranging the required number or more than the required number of connecting portions of the driving element on the driving element base.

In this way, if more than the required number are provided, connection with the electrical connection member can be made reliably without positioning, or even if it is done, without much precision.

(Each unit) The recording element unit in the present invention has the above-described electrical connection member, recording element base, and drive element base,
Further, the inkjet drive unit is configured by forming a liquid path on the recording element base of the recording element unit. The shape, dimensions, etc. of the liquid path may be arbitrary.

(Inkjet Apparatus) The inkjet apparatus according to the present invention includes the inkjet drive unit and means for mounting the inkjet drive unit. There are two types of inkjet devices: the so-called serial scanning type (the print head prints while moving back and forth horizontally with respect to the paper), and the flat scanning type (one that uses a horizontal row of print heads). good. In particular, the present invention is effective in long inkjet drive units;
A planar scanning type is preferred.

[Function] According to the present invention, since the recording element base and the drive element base can be formed on the same base, it is possible to easily manufacture the recording element drive unit. It is possible to simplify the work when installing the recording device.

Further, according to the present invention, the recording element substrate and the driving element substrate can be detachably connected, the driving element substrate can be easily separated, and therefore, the driving element substrate can be easily replaced.

[Example] (Example 1) FIG. 1 is a diagram for explaining an example of a recording element drive unit (claim 1) according to the present invention. Figure 1 (a
) is a cross-sectional view of the recording element drive unit according to this embodiment, and (b) is a view seen from above the reference plane (the surface on which elements and the like are mounted). In the figure, 1 is a pressure contact member, 2 is a drive element board, 3 is an electrical connection member, 4 is a drive element, 5 is a recording element board, 6 is a circuit board, 7 is a base, and 8 is a connector. Note that the recording element substrate and the circuit board used had the same thickness.

As shown in this figure (a), the pressure contact member 1 is fixed to the base 7 by a method such as screwing, and due to this pressure,
The driving element substrate, the electrical connecting member, the recording element substrate, the driving element substrate, the electrical connecting member, and the circuit board, which are arranged between the pressing member 1 and the base 7, are pressed against each other.

In this figure (a), the recording element board 5 and the drive element board 2 are electrically connected by the electrical connection member 1 on the right side, and the drive element board 2 and the circuit board are connected by the electrical connection member 1 on the left side. 6 are electrically connected. Further, the circuit board 6 is electrically connected to the connector 8, so that image signals and the like can be input manually from the outside.

As described above, according to this embodiment, it is possible to easily mechanically fix each substrate of the recording element drive unit, and since the recording element drive unit can be formed on one base, the recording element drive unit can be easily fixed mechanically. The element drive unit can also be easily attached to the recording apparatus.

In the recording element drive unit shown in this embodiment, an inkjet drive unit (claimed Term 6) can be obtained.

Moreover, an inkjet recording device (claim 11) can be obtained using the inkjet drive unit.

(Embodiment 2) FIG. 2 is a sectional view for explaining an embodiment of the recording element drive unit (claim 2) according to the present invention.

The difference between this example and Example 1 is that the thickness of the base is thicker at the portion that contacts the recording element substrate and the circuit board and thinner at the portion facing the drive element.

As described above, according to this embodiment, by arbitrarily setting the difference between the thickness of the portion of the base in contact with the recording element substrate and the circuit board and the thickness of the portion facing the drive element, the thickness of the drive element can be adjusted. Drive elements can be mounted freely without being affected.

In the recording element drive unit shown in this embodiment, an inkjet drive unit (claimed Term 7) can be obtained.

Moreover, an inkjet recording device (claim 12) can be obtained using the inkjet drive unit.

[Effects of the Invention] As explained above, according to the present invention, the recording element drive unit can be formed on two bases, so the manufacturing of the recording element drive unit can be facilitated, and the recording element drive unit can be easily manufactured. The element drive unit can also be easily attached to the recording apparatus.

Furthermore, according to this embodiment, by arbitrarily setting the difference between the thickness of the portion of the base in contact with the recording element substrate and the circuit board and the thickness of the portion facing the drive element, even thick drive elements can be used. It can be installed on.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing an embodiment of a recording element drive unit according to the present invention, FIG. 2 is a diagram showing a second embodiment of the recording element drive unit according to the present invention, and FIG. 3 is a diagram showing a conventional recording element drive unit. (by wire bonding)
FIG. 4 is a diagram showing a conventional recording element drive unit (based on electrical connection members). DESCRIPTION OF SYMBOLS 1... Pressure contact member, 2... Drive element board, 3... Electrical bonding member, 4... Drive element, 5... Recording element board, 6... Circuit board, 7... Base, 8... Connector, 1415... Electrode, 16... Ultrafine metal wire, 17
...electrically conductive member, 18...holding body, 19.20
...Insulating film. Figure (a) Figure 4 (b) Figure 4 (C)

Claims (24)

[Claims] (1) A holder formed using an electrically insulating material and a plurality of electrically conductive members disposed on the holder, one end of the electrically conductive member being one end of the holder. a plurality of electrical connection members which are exposed on the other surface of the holder, and the other end of the electrically conductive member is exposed on the other surface of the holder; a plurality of recording elements are arranged; a recording element base; a drive element base on which a plurality of drive elements are disposed; a circuit base for transmitting a drive signal to the drive element base; a base for disposing the recording element base and the circuit base; a base; and a pressure-contact member for press-contacting the recording element base and the drive element base, and the circuit base and the drive element base, respectively, via the electrical connection member; The recording element base and the drive element base are electrically connected via the first electrical connection member, and the drive element base and the circuit base are electrically connected via the second electrical connection member. A recording element drive unit characterized in that: (2) The thickness of the part of the base where the circuit board is arranged and the part where the recording element is arranged is the same, and the thickness of the part facing the drive element arranged on the drive element base is the same as that of the circuit board. 2. The recording element drive unit according to claim 1, wherein the thickness of the portion where the recording element is disposed is thinner than the thickness of the portion where the recording element is disposed. (3) The recording element drive unit according to claim 1 or 2, further comprising a connector for inputting a drive signal. (4) The recording element drive unit according to claim 1 or 2, wherein the recording element base and the circuit base are disposed on the same plane of the base. (5) The recording element drive unit according to claim 1 or 2, wherein the pressure contact member is fixed to a base. (6) The recording element drive unit according to claim 1 or 2, wherein the recording element is an element that performs recording using thermal energy. (7) The recording element drive unit according to claim 1 or 2, wherein the number of recording elements arranged on the recording element base is at least one more than the required number. (8) The recording element drive unit according to claim 1 or 2, wherein the number of connection parts of the drive elements disposed on the drive element base is at least one more than the required number. (9) A holder formed using an electrically insulating material, and a plurality of electrically conductive members disposed on the holder, one end of the electrically conductive member being one end of the holder. a plurality of electrical connection members which are exposed on the other surface of the holder, and the other end of the electrically conductive member is exposed on the other surface of the holder; a plurality of recording elements are arranged; a recording element base; a drive element base on which a plurality of drive elements are disposed; a circuit base for transmitting a drive signal to the drive element base; a base for disposing the recording element base and the circuit base; a base; and a pressure-contact member for press-contacting the recording element base and the drive element base, and the circuit base and the drive element base, respectively, via the electrical connection member; An ejection port for ejecting ink and a liquid path communicating with the ejection port are formed on the recording element base; the recording element base and the drive element base are connected via the first electrical connection member. An inkjet drive unit characterized in that the drive element base and the circuit base are electrically connected via the second electrical connection member. (10) The thickness of the part of the base where the circuit board is arranged and the part where the recording element is arranged is the same, and the thickness of the part facing the drive element arranged on the drive element base is the same as that of the circuit board. 10. The inkjet drive unit according to claim 9, wherein the thickness of the portion where the recording element is provided is thinner than the thickness of the portion where the recording element is provided. (11) The inkjet drive unit according to claim 9 or 10, further comprising a connector for inputting a drive signal. (12) The inkjet drive unit according to claim 9 or 10, wherein the recording element base and the circuit base are disposed on the same plane of the base. (13) The inkjet drive unit according to claim 9 or 10, wherein the pressure contact member is fixed to a base. (14) The inkjet drive unit according to claim 9 or 10, wherein the recording element is an element that performs recording using thermal energy. (15) The inkjet drive unit according to claim 9 or 10, wherein the number of recording elements disposed on the recording element base is at least one more than the required number. (16) The inkjet drive unit according to claim 9 or 10, wherein the number of connection parts of the drive element disposed on the drive element base is at least one more than the required number. (17) A holder formed using an electrically insulating material and a plurality of electrically conductive members disposed on the holder, one end of the electrically conductive member being one end of the holder. a plurality of electrical connection members which are exposed on the other surface of the holder, and the other end of the electrically conductive member is exposed on the other surface of the holder; a plurality of recording elements are arranged; a recording element base; a drive element base on which a plurality of drive elements are disposed; a circuit base for transmitting a drive signal to the drive element base; a base for disposing the recording element base and the circuit base; a base; and a pressure-contact member for press-contacting the recording element base and the drive element base, and the circuit base and the drive element base, respectively, via the electrical connection member; An ejection port for ejecting ink and a liquid path communicating with the ejection port are formed on the recording element base; the recording element base and the drive element base are connected via the first electrical connection member. An inkjet recording apparatus comprising: an inkjet drive unit that is electrically connected, and the drive element base and the circuit base are electrically connected via the second electrical connection member. (18) The thickness of the part of the base where the circuit board is arranged and the part where the recording element is arranged is the same, and the thickness of the part facing the drive element arranged on the drive element base is the same as that of the circuit board. 18. The inkjet recording apparatus according to claim 17, wherein the thickness of the portion where the recording element is provided is thinner than the thickness of the portion where the recording element is provided. (19) The inkjet recording apparatus according to claim 17 or 18, further comprising a connector for inputting a drive signal. (20) Claim 17 or 18, characterized in that the recording element base and the circuit base are disposed on the same plane of the base.
The inkjet recording device described in . (21) The inkjet recording apparatus according to claim 17 or 18, wherein the pressure contact member is fixed to a base. (22) The inkjet recording apparatus according to claim 17 or 18, wherein the recording element is an element that performs recording using thermal energy. (23) The inkjet recording apparatus according to claim 17 or 18, wherein the number of recording elements arranged on the recording element base is at least one more than the required number. (24) The inkjet recording apparatus according to claim 17 or 18, wherein the number of connection parts of the drive element disposed on the drive element base is at least one more than the required number.