JPH0222063A - Recording element driving unit, and ink jet driving unit and ink jet recording apparatus using the same - Google Patents

Abstract

PURPOSE:To easily prepare a recording element driving unit and to easily mount said driving unit on a recording apparatus by bringing a recording element substrate and a driving element substrate to an electrical continuity state through a printed circuit board to mount both substrates on one base plate. CONSTITUTION:By the pressure contact member 1 fixed to a base plate 7, the printed circuit board 2, electric connection member 3 and recording element substrate 4 arranged between the pressure contact member 1 and the base plate 7 as well as the printed circuit board 2, electric connection member 3 and driving element substrate 5 therebetween are mutually brought to a pressure contact state. At this time, the upper electrical connection member 3 connecting the printed circuit board 2 to the recording element substrate 4 is brought to an electrical continuity state with respect to the lower electrical connection member 3 connecting the printed circuit board 2 and the driving element substrate 5 through the printed circuit board 2. As mentioned above, since the recording element driving unit is formed on one base plate 7, this driving unit can be easily prepared and the mounting thereof to a recording apparatus can be facilitated.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a recording element drive unit for driving a recording element according to an image signal input from the outside in inkjet recording, etc., and an inkjet drive unit using the same. The present invention relates to an inkjet device.

[Prior Art] Conventionally, as a technique for electrically connecting a recording element substrate and a driving element substrate, the following techniques are known.

■Wire bonding method This method, as shown in FIG. It's a way to connect.

■A method of forming a recording element and a driving element on an integrated substrate.This method is a method of forming a recording element and a driving element on an integral substrate using an appropriate film forming technique.■A method using an electrical connection member.This method This is a method of connecting an electrode portion of a recording element substrate and an electrode portion of a drive element substrate using an electrical connection member disclosed in Japanese Patent Application No. 133395/1983.

FIG. 6 is a diagram for explaining this method. In the figure, 4 is a recording element substrate, 5 is a drive element substrate, 14 and 15 are electrode parts, and 19 and 20 are insulating films. Further, 3 is an electrical connection member, 17 is an electrically conductive member,
18 is a holder for holding the electrically conductive member 17. Here, the pitch of the electrically conductive members 17 is
and 15 pitches.

The recording element substrate 4, drive element substrate 5, and electrical connection members are first arranged as shown in FIG. 6(a), and then as shown in FIG.
They are pressed together as shown in b). Further, FIG. 2(c) is an overall view after pressure welding.

[Problem B to be Solved by the Invention] However, the conventional electrical connection method described above has the following problems.

■ Wire bonding method ■ In the wire bonding method, in order to avoid contact between adjacent aim metal wires, the pitch dimension of the connection parts on the drive element (distance between the centers of adjacent connection parts) is set to a certain distance. I have no choice but to take it. Therefore, once the size of the drive element is determined, the maximum number of connection portions is necessarily determined.

However, in the wire bonding method, the pitch dimension is usually as large as about 0.2 mm, so the number of connections must be reduced.

Conversely, this means that if the number of connection parts between the driving element and the recording element is fixed, the sizes of the driving element substrate and the recording element substrate must be returned to extremely long sizes.

■The height h of the ultra-fine metal wire measured from the connection part on the drive element is usually 0.2 to 0.4 mm, but it is relatively difficult to make it thinner than 0.2 mm, so try to make it thinner. do not have.

■Wire bonding takes time. In particular, when the number of connection points increases, bonding time becomes longer and production efficiency deteriorates.

■If the transfer molding condition range is exceeded for some reason, the ultrafine metal wire may be deformed or, in the worst case, cut.

In addition, at the connection portion on the drive element, since Al1 that is not alloyed with the ultrafine metal wire is exposed, AJ2 corrosion is likely to occur, resulting in a decrease in reliability.

(2) When a drive element becomes defective, it is difficult to replace only the drive element.

(2) The method of forming a recording element and a driving element on an integrated substrate has a problem in that if a defect occurs in any part of the recording element or the driving element, the entire system will stop working.

■Method using electrical connection members In this method, as can be seen from FIG. 7(C), the reference plane of the recording element substrate 4 and the driving element substrate 5 (the surface on which elements etc. are mounted)
Since the directions are opposite to each other, there are problems in that strict dimensional accuracy is required when mechanically fixing each board during manufacturing, and fixing work becomes difficult.

(The following is a blank space) [Means for Solving the Problems] The first gist of the present invention is to provide a holder formed using an electrically insulating material, and a plurality of electrically conductive objects disposed on the holder. one end of the electrically conductive member is exposed on one surface of the holder, and the other end of the electrically conductive member is exposed on the other surface of the holder. A recording element base on which a plurality of electrical connection members and a plurality of recording elements are disposed, a drive element base on which a plurality of drive elements are disposed, and the recording element base and the drive element base are disposed. the recording element substrate is connected via the first electrical connection member on the surface on which the wiring pattern is formed;
The circuit substrate to which the driving element substrate is connected via the second electrical connection member, the circuit substrate and the recording element substrate, and the circuit substrate and the driving element substrate are connected to the electrical connection member, respectively. A recording element driving unit is characterized in that it has a pressure contact member for making pressure contact via a connection member.

A second aspect of the present invention is to have a holder made of an electrically insulating material and a plurality of electrically conductive members disposed on the holder, the electrically conductive members a plurality of electrical connection members, one end of which is exposed on one surface of the holder, and the other end of the electrically conductive member is exposed on the other surface of the holder; a recording element base on which a recording element is disposed; a drive element base on which a plurality of drive elements are disposed; a base for disposing the recording element base and the drive element base; wiring; The recording element substrate is connected to the surface on which the pattern is formed via the first electrical connection member,
The circuit substrate to which the driving element substrate is connected via the second electrical connection member, the circuit substrate and the recording element substrate, and the circuit substrate and the driving element substrate are connected to the electrical connection member, respectively. and a pressure contact member for pressure contact via a connection member, and an ejection port for ejecting ink and a wave path communicating with the ejection port are formed on the recording element base. Exists in inkjet drive units.

A third aspect of the present invention includes a holder formed using an electrically insulating material and a plurality of electrically conductive members disposed on the holder, one end of the electrically conductive member. is exposed on one surface of the holder, and the other end of the electrically conductive member is exposed on the other surface of the holder, and a plurality of recording elements. A recording element base on which a recording element base is disposed, and a drive element base on which a plurality of drive elements are disposed: A base and a wiring pattern are formed for disposing the recording element base and the drive element base. the recording element base is connected via the first electrical connection member;
The circuit substrate to which the driving element substrate is connected via the second electrical connection member, the circuit substrate and the recording element substrate, and the circuit substrate and the driving element substrate are connected to the electrical connection member, respectively. an inkjet drive comprising: a pressure contact member for pressure contact via a connection member; an ejection port for ejecting ink and a liquid path communicating with the ejection port are formed on the recording element base; This exists in an inkjet recording apparatus characterized by comprising a unit.

(Electrical Connection Member) The electrical connection member according to the present invention has a plurality of electrically conductive members arranged on a holder made of an electrically insulating material. The disposed conductive members are electrically insulated from each other. For example, a part of the electrically conductive member may be buried in the holder, or other methods may be used. For example, it may be disposed on the surface of the holder by an appropriate means without embedding it in the holder.

One end of the electrically conductive member is exposed on one side of the holder, and the other end is exposed on the other side of the holder.

In addition, when an electrically conductive member is provided only on the surface, one end and the other end may be connected by appropriate wiring. Furthermore, the electrically connecting member may be composed of one layer or multiple layers of two or more layers. good.

(Electrically conductive member) The electrically conductive member may be anything as long as it exhibits electrical conductivity. Metal materials are common, but other than metal materials, materials that exhibit superconductivity may also be used as materials for metal parts.
Although gold is preferred, any metal or alloy other than gold may be used. For example, Ag, Be, Ca, Mg
Mo, Ns, W, Fe, Ti, In TaZn, Cu
, Al, Sn, Pb-3n and other metals or alloys.

In addition, the metal member and the alloy member may include the same type of metal or different types of metal in the same electrical connection member. Furthermore, one of the metal members and alloy members of the electrical connection member may be made of the same metal or alloy, or may be made of different metals or alloys.

Furthermore, materials other than metals and alloys may be used, as long as they exhibit conductivity, and may include a metal material containing one or both of an organic material and an inorganic material. Further, a combination of an inorganic material and an organic material may be used as long as it exhibits conductivity.

Furthermore, the cross-section of the electrically conductive member can be circular, square, or other shapes.

Further, the thickness of the electrically conductive member is not particularly limited. Considering the pitch of the connection parts of electric circuit components, for example, 20 μm
It may be greater than or equal to φ or less than 20 μmφ.

Note that the exposed portion of the electrically conductive member may be on the same surface as the holder, or may protrude from the surface of the holder. This protrusion may be on one side only or on both sides. If it is made to protrude further, it may be made into a bump shape.

Further, it is preferable that the pitch of the electrically conductive member is smaller than the pitch of the connecting portion of the driving element. By doing so, it becomes possible to connect the connection part of the drive element base and the electrical connection member without having to determine the position of the connection part of the drive element and the electrical connection member.

Note that when buried in the holder, the electrically conductive member does not need to be arranged vertically in the holder, but rather diagonally from one side of the holder to the other side of the holder. Good too.

(Holding body) The holder is made of electrically insulating material.

Any electrically insulating material may be used.

Examples of electrically insulating materials include organic materials and inorganic materials. Alternatively, it may be a metal or alloy material that has been treated so that the electrically conductive members are electrically insulated from each other. moreover,
One or more types of inorganic materials, metal materials, and alloy materials having a desired shape such as powder, fibers, plate-like bodies, rod-like bodies, and spherical bodies may be dispersed in the organic material. Furthermore, one or more of organic materials, metal materials, and alloy materials having a desired shape such as powder, fibers, plate-like bodies, rod-like bodies, and spherical bodies may be dispersed in the inorganic material. good.

Further, one or more kinds of inorganic materials and organic materials having a desired shape such as powder, fibers, plate-like bodies, rod-like bodies, and spherical bodies may be dispersed and held in the metal material. In addition, when the holding body is made of a metal material, for example, an electrically insulating material such as resin may be provided between the electrically conductive member and the holding body.

Here, as the organic material, for example, an insulating resin may be used, and the resin may be any of a thermosetting resin, an ultraviolet curing resin, and a thermoplastic resin. Examples include polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyetherimide resin, polystyrene resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzylimidazole resin, polyamideimide resin, polypropylene resin, polyvinyl chloride. Resins such as polystyrene resin, methyl methacrylate resin, polyphenylene oxide resin, phenol resin, melanin resin, epoxy resin, urea resin, methacrylic resin, vinylidene chloride resin, alkyd resin, silicone resin and other resins can be used.

Among these resins, it is more preferable to use a resin with good thermal conductivity because even if the semiconductor element has heat, the heat can be radiated through the resin. moreover,
If the resin is selected to have the same or similar coefficient of thermal expansion as the circuit board, and if at least one hole or multiple bubbles are present in the organic material, thermal expansion/contraction , it becomes possible to further prevent a decrease in reliability of the device.

In addition, specific examples of metal materials and alloy materials include, for example,
Ag, Cu, Au, Af! ,,Be,CaMg,Mo,
Fe, Ni, St, Co, MnW, Cr, Nb, Zr,
Ti, Ta, Zn.

Examples include metals or alloys such as Sn and Pb-5n.

Examples of inorganic materials include 5in2 B20s, AIL203, Na20. 20 Cabs
, ZnO, Bad, PbO, 5b203AS203,
La2O3, ZrO2, Bad.

P20S, TiO2, MgO, SiC, Be0BP,
BN; AfLN, B4 C, TaC, Ti B2
CrB2. Examples include ceramics such as TiN, Si3N4, Ta2o5, diamond, glass, carbon, boron, and other inorganic materials.

(Recording Element, Driving Element) As the recording element in the present invention, an element operated by thermal energy (heating element) or other recording element, such as a piezo element, may be used.

In the recording element unit and inkjet unit according to the present invention, the number of connection parts for recording elements may be greater than the required number. Thereby, the electrical connection member and the recording element base can be connected without requiring precise positioning.

On the other hand, the same effect can be obtained by arranging the required number or more than the required number of connecting portions of the driving element on the driving element base.

In this way, if more than the required number are provided, connection with the electrical connection member can be made reliably without positioning, or even if it is done, without much precision.

(Each unit) The recording element unit in the present invention has the above-described electrical connection member, recording element base, and drive element base,
Further, the inkjet drive unit is configured by forming a liquid path on the recording element base of the recording element unit. The shape, dimensions, etc. of the liquid path may be arbitrary.

(Inkjet Apparatus) The inkjet apparatus according to the present invention includes the inkjet drive unit and means for mounting the inkjet drive unit. There are two types of inkjet devices: the so-called serial scanning type (the print head prints while moving back and forth horizontally with respect to the paper) and the plane scanning type (the print head uses a horizontal row of print heads). good. In particular, the present invention is effective in long inkjet drive units;
A planar scanning type is preferred.

[Function] According to the present invention, the reference planes of the recording element base and the driving element base can be formed on the same plane, so that the mechanical fixing operation can be facilitated.

Further, according to the present invention, the recording element substrate and the driving element substrate can be connected detachably, the driving element substrate can be easily separated, and therefore, the driving element substrate can be easily replaced.

(Margin below) [Embodiment 1] FIG. 1 is a diagram for explaining an embodiment of a recording element drive unit (claim 1) according to the present invention. Figure 1 (a
) is a view of the recording element drive unit of this embodiment viewed from above the reference plane (the surface on which elements and the like are mounted), and (b') is a cross-sectional view. Further, (c) is a diagram for explaining a state in which the circuit board 2 and the electrical connection member 3 are arranged on the pressure contact member 1. In the figure, 1 is a pressure contact member, 2 is a circuit board, and 3
4 is a recording element substrate, 5 is a drive element substrate, 6 is a drive element, and 7 is a base.

As shown in this figure (a), the pressure contact member 1 is fixed to the base 7 at both ends in the longitudinal direction by a method such as screwing.
Due to this pressure, the circuit board, the electrical connection member, the recording element board, the circuit board, the electrical connection member, and the drive element board arranged between the pressure contact member 1 and the base 7 are pressed against each other.

In this figure (c), the upper electrical connection member 1 is electrically connected to the lower electrical connection member 1 via the circuit board 2, so that the recording element substrate 4 and the drive element substrate 5 are electrically conductive (FIG. (b)).

As described above, according to this embodiment, since the recording element driving unit can be formed on the base of one sheet, the manufacturing of the recording element driving unit can be facilitated, and the recording element driving unit recording apparatus can be easily manufactured. It can also be easily installed.

(Embodiment 2) FIG. 2 is a diagram for explaining a second embodiment of the recording element drive unit (claim 1) according to the present invention. FIG. 2(a) is a view of the recording element drive unit of this embodiment viewed from above the reference plane, and FIG. 2(b) is a sectional view.

The difference between this example and Example 1 is that the interval between the electrodes on the recording element substrate is small.

As described above, according to the present invention, the interval between the electrodes of the recording element substrate can be made smaller than when connected by wire bonding.

In the recording element drive unit as shown in Examples 1 and 2, an inkjet drive unit having an ejection port for ejecting ink and a liquid path communicating with the ejection port formed on the printing element base is used. A drive unit (claim 7) can be obtained.

Moreover, an inkjet recording device (claim 13) can be obtained using the inkjet drive unit.

(Embodiment 3) FIG. 3 is a diagram for explaining an embodiment of the recording element drive unit (claim 2) according to the present invention. Figure 3 (a
) is a view of the recording element drive unit of this embodiment as seen from above the reference plane, and (b) is a cross-sectional view.

The difference between this example and Examples 1 and 2 is that the pressure contact member 1 is shaped as shown in FIG. 1B, and the position of fixation by screws or the like is changed. With this configuration, there is no risk of bending of the pressure contact member 1 even when the number of recording elements mounted on the recording element drive unit is large (that is, when the recording element drive unit is long in the longitudinal direction). .

In such a recording element drive unit, an inkjet drive unit (claim 8) is obtained by using a recording element drive unit in which an ejection port for ejecting ink and a liquid path communicating with the ejection port are formed on the printing element base. be able to.

Moreover, an inkjet recording device (claim 14) can be obtained using the inkjet drive unit.

(Embodiment 4) FIG. 4 is a diagram for explaining an embodiment of the recording element drive unit (claim 3) according to the present invention. Figure 4 (a
) is a view of the recording element drive unit of this embodiment as seen from above the reference plane, and (b) is a cross-sectional view. In the figure, the same reference numerals as in FIG. 3 indicate the same components as in FIG. 3, respectively.

Further, 9 is a connector, 11 is a press-fitting rubber, 12 is a flexible cable, and 13 is a flexible cable reinforcing plate.

The difference between this embodiment and Embodiment 2 is that a connector for inputting image signals etc. to the recording element drive unit and a means (flexible cable, etc.) for electrically connecting the drive element board and the connector are newly provided. , and an elastic member (rubber, etc.) for press-contacting the flexible cable etc. to the drive element board.
This is because we have established

In this embodiment, the electrical connection between the flexible cable and the driving element substrate can also be made by pressure contact, so that the manufacturing of the recording element driving unit can be further facilitated.

In such a recording element drive unit, an inkjet drive unit (claim 9) is obtained by using a recording element drive unit in which an ejection port for ejecting ink and a liquid path communicating with the ejection port are formed on the printing element base. be able to.

Moreover, an inkjet recording device (claim 15) can be obtained using the inkjet drive unit 1-.

[Effects of the Invention] As explained above, according to the present invention, since the recording element drive unit can be formed on two bases, the production of the recording element drive unit can be facilitated, and the recording element drive unit can be easily manufactured. The element drive unit can also be easily attached to the recording apparatus.

Further, according to the present invention, the electrical connection between the flexible cable and the driving element substrate can be made by pressure contact, so that the manufacturing of the recording element driving unit can be further facilitated.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a first embodiment of the invention, FIG. 2 is a diagram showing a second embodiment of the invention, FIG. 3 is a diagram showing a third embodiment of the invention, and FIG. 4 is a diagram showing a third embodiment of the invention. The figure shows a fourth embodiment of the present invention, FIG. 5 shows a conventional recording element drive unit (based on wire bonding), and FIG. 6 shows a conventional recording element drive unit (based on electrical connection members). FIG. DESCRIPTION OF SYMBOLS 1... Pressure contact member, 2... Circuit board, 3... Electrical connection member, 4... Recording element board, 5... Drive element board, 6... Drive element, 7... Base, 8... electrodes,
9...Connector, 11...Rubber for pressure welding, 12...
Flexible cable, 13... Flexible cable reinforcement plate, 14. 15... Electrode, 16... Ultrafine metal wire, 17... Electrically conductive member, 18... Holder, 1
9.20...Insulating film. (a) Figure (b) Figure (C) Figure (0) Figure (b) Figure

Claims (27)

[Claims] (1) A holder formed using an electrically insulating material and a plurality of electrically conductive members disposed on the holder, one end of the electrically conductive member being one end of the holder. a plurality of electrical connection members which are exposed on the other surface of the holder, and the other end of the electrically conductive member is exposed on the other surface of the holder; a plurality of recording elements are arranged; a recording element base; a drive element base on which a plurality of drive elements are disposed; a base for disposing the recording element base and the drive element base; a surface on which a wiring pattern is formed; , the recording element base is connected via the first electrical connection member,
a circuit substrate to which the drive element substrate is connected via the second electrical connection member; the circuit substrate and the recording element substrate, and the circuit substrate and the drive element substrate, respectively, 1. A recording element drive unit comprising: a pressure contact member for pressure contact via a target connection member; (2) The recording element drive unit according to claim 1, further comprising an electric signal transmission means for transmitting a drive signal to the drive element base. (3) The recording element drive unit according to claim 1, further comprising a connector for inputting a drive signal. (4) The recording element drive unit according to claim 1, wherein the recording element base and the drive element base are disposed on the same plane of the base. (5) The recording element drive unit according to claim 1, wherein the pressure contact member is fixed to the base at both ends in the longitudinal direction. (6) The recording element drive unit according to claim 1, wherein the pressure contact member is fixed to the base at one end on the long side. (7) The recording element drive unit according to claim 1, wherein the recording element is an element that performs recording using thermal energy. (8) The recording element drive unit according to claim 1, wherein the number of recording elements arranged on the recording element base is at least one more than the required number. (9) The recording element drive unit according to claim 1, wherein the number of connection parts of the drive elements disposed on the drive element base is at least one more than the required number. (10) A holder formed using an electrically insulating material and a plurality of electrically conductive members disposed on the holder, one end of the electrically conductive member being one end of the holder. a plurality of electrical connection members which are exposed on the other surface of the holder, and the other end of the electrically conductive member is exposed on the other surface of the holder; a plurality of recording elements are arranged; a recording element base; a drive element base on which a plurality of drive elements are disposed; a base for disposing the recording element base and the drive element base; a surface on which a wiring pattern is formed; , the recording element base is connected via the first electrical connection member,
a circuit substrate to which the drive element substrate is connected via the second electrical connection member; the circuit substrate and the recording element substrate, and the circuit substrate and the drive element substrate, respectively, a pressure-contacting member for press-contacting via a connecting member; and an ejection port for ejecting ink and a liquid path communicating with the ejection port are formed on the recording element base. An inkjet drive unit featuring: (11) The inkjet drive unit according to claim 10, further comprising an electric signal transmission means for transmitting a drive signal to the drive element base. (12) The inkjet drive unit according to claim 10, further comprising a connector for inputting a drive signal. (13) The inkjet drive unit according to claim 10, wherein the recording element base and the drive element base are disposed on the same plane of the base. (14) The inkjet drive unit according to claim 10, wherein the pressure contact member is fixed to the base at both ends in the longitudinal direction. (15) The inkjet drive unit according to claim 10, wherein the pressure contact member is fixed to the base at one end on the long side. (16) The inkjet drive unit according to claim 10, wherein the recording element is an element that performs recording using thermal energy. (17) The inkjet drive unit according to claim 10, wherein the number of recording elements disposed on the recording element base is at least one more than the required number. (18) The inkjet drive unit according to claim 10, wherein the number of connection parts of the drive element disposed on the drive element base is at least one more than the required number. (19) A holder formed using an electrically insulating material and a plurality of electrically conductive members disposed on the holder, one end of the electrically conductive member being one end of the holder. a plurality of electrical connection members which are exposed on the other surface of the holder, and the other end of the electrically conductive member is exposed on the other surface of the holder; a plurality of recording elements are arranged; a recording element base; a drive element base on which a plurality of drive elements are disposed; a base for disposing the recording element base and the drive element base; a surface on which a wiring pattern is formed; , the recording element base is connected via the first electrical connection member,
a circuit substrate to which the drive element substrate is connected via the second electrical connection member; the circuit substrate and the recording element substrate, and the circuit substrate and the drive element substrate, respectively, an inkjet comprising: a pressure-contacting member for press-contacting via a connecting member; an ejection port for ejecting ink and a liquid path communicating with the ejection port are formed on the recording element base; An inkjet recording device comprising a drive unit. (20) The inkjet recording apparatus according to claim 19, further comprising: an electric signal transmission means for transmitting a drive signal to the drive element base. (21) The inkjet recording apparatus according to claim 19, further comprising a connector for inputting a drive signal. (22) The inkjet recording apparatus according to claim 19, wherein the recording element base and the drive element base are disposed on the same plane of the base. (23) The inkjet recording apparatus according to claim 19, wherein the pressing member is fixed to the base at both ends in the longitudinal direction. (24) The inkjet recording apparatus according to claim 19, wherein the pressing member is fixed to the base at one end on the long side. (25) The inkjet recording apparatus according to claim 19, wherein the recording element is an element that performs recording using thermal energy. (26) The inkjet recording apparatus according to claim 19, wherein the number of recording elements disposed on the recording element base is at least one more than the required number. (27) The inkjet recording apparatus according to claim 19, wherein the number of connection parts of the drive element disposed on the drive element base is at least one more than the required number.