JPH02218194A - Flexible printed-wiring board - Google Patents
Flexible printed-wiring boardInfo
- Publication number
- JPH02218194A JPH02218194A JP3909289A JP3909289A JPH02218194A JP H02218194 A JPH02218194 A JP H02218194A JP 3909289 A JP3909289 A JP 3909289A JP 3909289 A JP3909289 A JP 3909289A JP H02218194 A JPH02218194 A JP H02218194A
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- wiring board
- polymer
- circuit
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012779 reinforcing material Substances 0.000 claims abstract description 21
- 229920000642 polymer Polymers 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 125000003118 aryl group Chemical group 0.000 claims description 5
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 4
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 230000001747 exhibiting effect Effects 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 4
- 239000004020 conductor Substances 0.000 abstract description 30
- 239000000463 material Substances 0.000 abstract description 12
- 230000008646 thermal stress Effects 0.000 abstract description 9
- 230000035939 shock Effects 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 7
- 229920005989 resin Polymers 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 4
- 230000035882 stress Effects 0.000 abstract description 3
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 17
- 229920000106 Liquid crystal polymer Polymers 0.000 description 15
- 239000010410 layer Substances 0.000 description 9
- 239000010408 film Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- -1 methylene, ethylene, propylene, Tetramethylene, 1.2-butylene, 1.3-butylene, 2.3-butylene, pentamethylene Chemical group 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229920013683 Celanese Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000005569 butenylene group Chemical group 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical group CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 125000006410 propenylene group Chemical group 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、合成樹脂内に埋め込んで使用するフレキシブ
ルプリント配線板に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a flexible printed wiring board that is used by being embedded in a synthetic resin.
〈従来の技術と発明が解決しようとする課題〉通常のケ
ーブル類に代わって、近時、可撓性を有する絶縁基板と
、金属箔等の導体薄膜からなる導体回路とを積層したフ
レキシブルプリント配線板（ｆｌａｔ ｒＩｅｘｉｂｌ
ｅ ｐｒｉｎｔｅｄ ｃｌｒｃｕｌｔ ： Ｆ Ｐ Ｃ
）が、配線材として使用されることが多くなってきた。<Prior art and problems to be solved by the invention> In place of ordinary cables, flexible printed wiring has recently been developed, which is a layered structure consisting of a flexible insulating substrate and a conductive circuit made of a conductive thin film such as metal foil. Board (flat rIexible
e printed clrcult: FPC
) are increasingly being used as wiring materials.
フレキシブルプリント配線板は、その名の通り可撓性を
有するので、従来のケーブルと同様に種々の配線形状に
対応できる上、多数の回路を少ないスペースで同時に配
線できるという、従来のケーブルにない利点を有してい
る。As the name suggests, flexible printed circuit boards are flexible, so they can accommodate a variety of wiring shapes just like conventional cables, and they also have the advantage of being able to wire multiple circuits at the same time in a small amount of space, which is not possible with conventional cables. have.
しかし、フレキシブルプリント配線板は振動に弱く、導
体回路が断線しやすいという問題があった。そこで、こ
のフレキシブルプリント配線板を合成樹脂中に埋め込む
ことにより、耐振動性を向上する試みがなされている。However, flexible printed wiring boards have a problem in that they are susceptible to vibration and conductor circuits are easily broken. Therefore, attempts have been made to improve the vibration resistance by embedding this flexible printed wiring board in synthetic resin.
ところが、合成樹脂中に埋め込まれたフレキシブルプリ
ント配線板は、特に合成樹脂が発泡樹脂である場合、温
度変化の激しい条件下での使用時に、導体回路が断線し
易いという新たな問題を有することが判った。発明者ら
の検討によれば、上記断線の原因は、フレキシブルプリ
ント配線板を構成する素材と、発泡樹脂材料との熱膨張
係数の差が大きく、冷熱衝撃時に、導体回路に熱応力が
加えられて断線疲労を生じるためであることが判明した
。However, flexible printed wiring boards embedded in synthetic resin, especially when the synthetic resin is foamed resin, may have a new problem in that the conductor circuits are likely to break when used under conditions of severe temperature changes. understood. According to the inventors' study, the cause of the above-mentioned wire breakage is the large difference in coefficient of thermal expansion between the material constituting the flexible printed wiring board and the foamed resin material, and thermal stress is applied to the conductor circuit during thermal shock. It turned out that this was because wire breakage caused fatigue.
本発明は、以上の事情に鑑みてなされたものであって、
熱応力に強く、容易に断線しないフレキシブルプリント
配線板を提供することを目的としている。The present invention has been made in view of the above circumstances, and
The purpose is to provide a flexible printed wiring board that is resistant to thermal stress and does not easily break.
く課題を解決するための手段および作用〉上記課題を解
決するために、本発明のフレキシブルプリント配線板は
、サーモトロピック液晶性を示すポリマー（以下「液晶
性ポリマー」という）からなる補強材を有することを特
徴としている。Means and Effects for Solving the Problems> In order to solve the above problems, the flexible printed wiring board of the present invention has a reinforcing material made of a polymer exhibiting thermotropic liquid crystallinity (hereinafter referred to as "liquid crystalline polymer"). It is characterized by
上記構成からなる本発明のフレキシブルプリント配線板
においては、補強材を形成する液晶性ポリマーの線膨張
係数が導体回路を形成する金属材料に近く、且つ、引張
弾性率が通常の樹脂材料に比べて大きいため、冷熱衝撃
時の熱応力の一部を吸収し、導体回路に加えられる応力
を軽減して、導体回路を保護することができ、導体回路
の断線が防止される。In the flexible printed wiring board of the present invention having the above structure, the linear expansion coefficient of the liquid crystalline polymer forming the reinforcing material is close to that of the metal material forming the conductor circuit, and the tensile modulus is higher than that of a normal resin material. Since it is large, it can absorb part of the thermal stress during thermal shock, reduce the stress applied to the conductor circuit, protect the conductor circuit, and prevent disconnection of the conductor circuit.
また、上記液晶性ポリマーは、加熱により液晶状態とな
る、いわゆるサーモトロピック液晶性を示し、真の溶融
温度よりも低い温度で流動し得るので、高い耐熱性を有
するにも拘らず、成形加工性に優れており、フィルム状
等の適宜の形状への成形が容易であるという利点をも有
している。In addition, the liquid crystalline polymer described above exhibits so-called thermotropic liquid crystallinity, in which it becomes a liquid crystal state when heated, and can flow at a temperature lower than the true melting temperature. It also has the advantage of being easy to mold into an appropriate shape such as a film.
補強材を形成する液晶性ポリマーとしては、主鎖中に剛
直な芳香族環を有するものが好ましく用いられ、特に、
下記一般式（１１〜（財）の各式で表わされる化合物よ
りなる群から選ばれた少なくとも１種のものがより好ま
しく用いられる。As the liquid crystalline polymer forming the reinforcing material, those having a rigid aromatic ring in the main chain are preferably used, and in particular,
At least one compound selected from the group consisting of compounds represented by the following general formulas (11 to 2) is more preferably used.
■においてはｌ ＋ｍ＋ｎ≧１００である必要がある）
上記式中のＲに相当する２価の脂肪族基または芳香族基
としては、例えば、メチレン、エチレン、プロピレン、
テトラメチレン、１．２−ブチレン、１．３−ブチレン
、２．３−ブチレン、ペンタメチレン、α−アミレン、
β−アミレン、α、δ−アミレン、プロペニレン、２−
ブテニレン、０−フェニレン、ｍ−フェニレン、ｐ−フ
ェニレン、および、下記式で表わされる化合物が好まし
いものとして挙げられ、特に、エチレン基およびフェニ
レン基が、より好ましく用いられる。In (2), it is necessary that l+m+n≧100) Examples of the divalent aliphatic group or aromatic group corresponding to R in the above formula include methylene, ethylene, propylene,
Tetramethylene, 1.2-butylene, 1.3-butylene, 2.3-butylene, pentamethylene, α-amylene,
β-amylene, α, δ-amylene, propenylene, 2-
Preferred examples include butenylene, 0-phenylene, m-phenylene, p-phenylene, and compounds represented by the following formulas, with ethylene and phenylene groups being particularly preferred.
（式中、Ｒは２価の脂肪族基または芳香族基を表わし、
（１＊ ｍ＋ ｎはそれぞれ１以上の整数であって、
式（Ｉ） （ＩＩ）においてはｍ＋ｎ≧１ｏＯ１式圓（
式中、Ｘ、Ｙはハロゲンまたはアルキル基、Ｚは水素原
子、ハロゲンまたはアルキル基を表わす）
現在入手可能な液晶性ポリマーとしては、住友化学社製
の商品名「エコノールＪ 、ＤＡＲＴＣＯＭＦＧ社製の
商品名ｒＸｙｄａｒＪ 、Ｃｅｌａｎｅｓｅ社製の商品
名ｒＶｅｃｔｒａＪ 、ユニチカ社製の商品名ｒＬＣ−
２０００Ｊ等が挙げられる。(In the formula, R represents a divalent aliphatic group or an aromatic group,
(1*m+n are each integers greater than or equal to 1,
In formula (I) (II), m+n≧1oO1 formula circle (
(In the formula, X and Y represent a halogen or an alkyl group, and Z represents a hydrogen atom, a halogen or an alkyl group) Currently available liquid crystalline polymers include the product name "Econol J" manufactured by Sumitomo Chemical Co., Ltd. and the product manufactured by DARTCOM FG. Name rXydarJ, product name rVectraJ manufactured by Celanese, product name rLC- manufactured by Unitika.
2000J etc. are mentioned.
上記液晶性ポリマーからなる補強材は、フィルム状、ワ
イヤ状、網状等、フレキシブルプリント配線板の形状や
層構成に応じた、適宜の形状とすることができる。The reinforcing material made of the liquid crystalline polymer can have any suitable shape, such as film, wire, or net shape, depending on the shape and layer structure of the flexible printed wiring board.
本発明のフレキシブルプリント配線板は、上記液晶性ポ
リマーからなる補強材と、導体回路とを備えること以外
の構成は特に限定されず、従来のものと同様の部材によ
り、従来の配線板と同様に構成することができる。The flexible printed wiring board of the present invention is not particularly limited in configuration other than that it includes a reinforcing material made of the liquid crystalline polymer and a conductor circuit, and is made of the same members as conventional ones, and can be used in the same manner as conventional wiring boards. Can be configured.
補強材および導体回路と共に、フレキシブルプリント配
線板を構成する部材としては、導体回路を支持する、可
撓性を有する絶縁基板や、この絶縁基板、補強材、導体
回路等を相互に接着するための接着剤層等が例示される
。また、本発明のフレキシブルプリント配線板において
は、上記絶縁基板自体を液晶性ポリマーて形成して、絶
縁基板と補強材とを兼用させたり、絶縁基板中に液晶性
ポリマーからなるワイヤ状等の形状の補強材を埋め込ん
で両者を一体化したりすることもできる。Along with reinforcing materials and conductive circuits, the members that make up the flexible printed wiring board include a flexible insulating substrate that supports the conductive circuits, and a material for bonding the insulating substrate, reinforcing materials, conductive circuits, etc. to each other. Examples include adhesive layers and the like. In addition, in the flexible printed wiring board of the present invention, the insulating substrate itself may be formed of a liquid crystalline polymer to serve both as an insulating substrate and a reinforcing material, or the insulating substrate may have a shape such as a wire made of a liquid crystalline polymer. It is also possible to integrate the two by embedding a reinforcing material.
上記各部材からなる、本発明のフレキシブルプリント配
線板においては、適宜の層構成を採用することができる
。例えば、前記のように、絶縁基板自体が補強材を兼ね
る場合や、絶縁基板と補強材とが一体化された場合には
、１層の絶縁基板の片面に導体回路が積層された片面型
、１層の絶縁基板の両面に導体回路が積層された両面型
、複数の絶縁基板と複数の導体回路とが交互に積層され
た多層型、２層の絶縁基板の間に導体回路が介装された
フラットケーブル型等の通常の層構成とすることができ
る。また、液晶性ポリマーからなる補強材が、絶縁基板
と別体である場合には、上記各構成゛の最外層や各層間
の任意の位置に補強材を配置することで、フレキシブル
プリント配線板が構成される。In the flexible printed wiring board of the present invention made of the above-mentioned members, an appropriate layer structure can be adopted. For example, as mentioned above, when the insulating substrate itself also serves as a reinforcing material, or when the insulating substrate and the reinforcing material are integrated, a single-sided type in which a conductor circuit is laminated on one side of a single layer of insulating substrate, Double-sided type, in which conductor circuits are laminated on both sides of a single layer of insulating substrate; multilayer type, in which multiple insulating substrates and multiple conductor circuits are alternately laminated; and conductor circuits are interposed between two layers of insulating substrates. It can have a normal layered structure such as a flat cable type. In addition, if the reinforcing material made of liquid crystalline polymer is separate from the insulating substrate, the flexible printed wiring board can be improved by placing the reinforcing material in the outermost layer of each of the above structures or at any position between the layers. configured.
導体回路を形成する金属材料としては、銅、錫、銀、ニ
ッケル、アルミニウム、またはこれら金属の合金等が挙
げられる。導体回路の形成法としては、絶縁基板の表面
に積層された上記金属材料からなる薄膜の不要部分をエ
ツチング除去する、いわゆるサブストラッテイブ法、絶
縁基板表面の、導体回路として必要な部分にのみ金属材
料を堆積させるアディティブ法、サブストラッテイブ法
とアディティブ法とを組み合わせ、たセミアデイティブ
法等の、従来公知の導体回路の製造法を適用することが
できる。導体回路の厚みは、導体回路の材質、製造方法
等の条件に応じて、最適の範囲を選択することができる
が、通常、１８〜７０μｍ程度であることが好ましい。Examples of the metal material forming the conductor circuit include copper, tin, silver, nickel, aluminum, and alloys of these metals. The method for forming conductor circuits is the so-called substratative method, in which unnecessary parts of the thin film made of the above-mentioned metal materials laminated on the surface of an insulating substrate are removed by etching. Conventionally known conductor circuit manufacturing methods can be applied, such as an additive method for depositing materials, a semi-additive method that combines a substrative method and an additive method. The thickness of the conductor circuit can be selected from an optimal range depending on conditions such as the material of the conductor circuit and the manufacturing method, but it is usually preferably about 18 to 70 μm.
絶縁基板としては、ポリエステル系、ポリイミド系、ガ
ラスエポキシ系、ガラステフロン系、ポリアミドイミド
系、ポリ塩化ビニル系、ポリエチレン系等の、可撓性を
有する、従来公知のフレキシブル配線板用絶縁フィルム
が、何れも使用可能である。また、前記のように、液晶
性ポリマーによって、補強材を兼ねた絶縁基板を形成す
ることもできる。絶縁基板の厚みは、従来と同程度か、
或いは補強材が積層される分、従来よりも薄くすること
ができるが、通常、２５〜１２５μｍの範囲内であるこ
とが好ましい。As the insulating substrate, conventionally known flexible wiring board insulating films having flexibility such as polyester, polyimide, glass epoxy, glass Teflon, polyamideimide, polyvinyl chloride, and polyethylene are used. Either can be used. Furthermore, as described above, an insulating substrate that also serves as a reinforcing material can be formed using a liquid crystalline polymer. Is the thickness of the insulating substrate the same as before?
Alternatively, since the reinforcing material is laminated, it can be made thinner than before, but it is usually preferably within the range of 25 to 125 μm.
接着剤層を形成する接着剤としては、耐熱性に優れ、フ
レキシブルプリント配線板の可撓性を妨げず、且つ、熱
応力に強い、ウレタン系、ポリエステル系、エポキシ系
等の接着剤が使用される。As the adhesive forming the adhesive layer, urethane-based, polyester-based, epoxy-based adhesives, etc. are used, which have excellent heat resistance, do not hinder the flexibility of the flexible printed wiring board, and are resistant to thermal stress. Ru.
〈実施例〉 以下、実施例に基づき、本発明を説明する。<Example> The present invention will be explained below based on Examples.
（実施例１）
厚み５０−１幅２ｃｆ１１．長さ１８ｃｍの長尺帯状の
ポリエチレンテレフタレート（ＰＥＴ）フィルムの表面
に、厚み７０μｍの電解銅箔をウレタン系接着剤（式日
薬品工業社製、商品名＾−５４０）を介して積層、接着
した後、この銅箔をエツチングして、帯材の長手方向に
平行に、線幅０．５龍の導体回路２本と線幅０．ｌｎ＋
ｍの導体回路１本とを形成した。次に、この導体回路の
上に、上記と同じＰＥＴフイルムを、同じウレタン系接
着剤を用いて積層、接着して、通常のフラットケーブル
型プリント配線板に相当する積層体を得た。積層体のト
ータルの厚みは１９５μｌであった。そして、この積層
体の両面、すなわち２層のＰＥＴフィルムの外側に、押
出成形により形成された液晶性ポリマー（Ｃｅｌａｎｅ
ｓｅ社製の商品名Ｖｅｃｔｒａ）からなる、厚み約２０
０μｍの補強材フィルムを、それぞれ、上記ウレタン系
接着剤からなる厚み３０庫の接着剤層を介して積層、接
着して、第１図に示す層構成のフレキシブルプリント配
線板（Ａ）を作製した。なお、図において、（１）は導
体回路、（２） （２）はＰＥＴフィルム、（３） （
３）は補強材フィルム、（４）・・・はウレタン系接着
剤からなる接着剤層を示している。(Example 1) Thickness 50-1 Width 2cf11. Electrolytic copper foil with a thickness of 70 μm was laminated and adhered to the surface of a long belt-shaped polyethylene terephthalate (PET) film with a length of 18 cm via a urethane adhesive (manufactured by Shikinichi Yakuhin Kogyo Co., Ltd., trade name ^-540). After that, this copper foil is etched, and two conductor circuits with a line width of 0.5mm and two conductor circuits with a line width of 0.5mm are etched parallel to the longitudinal direction of the strip material. ln+
One conductor circuit of m was formed. Next, the same PET film as above was laminated and adhered onto this conductor circuit using the same urethane adhesive to obtain a laminate corresponding to a normal flat cable type printed wiring board. The total thickness of the laminate was 195 μl. Then, on both sides of this laminate, that is, on the outside of the two layers of PET film, a liquid crystalline polymer (Celane) is formed by extrusion molding.
made by Se Company (product name: Vectra), approximately 20 mm thick.
A flexible printed wiring board (A) having the layer structure shown in FIG. 1 was prepared by laminating and adhering 0 μm reinforcing films through an adhesive layer having a thickness of 30 mm made of the above-mentioned urethane adhesive. . In the figure, (1) is a conductor circuit, (2) (2) is a PET film, and (3) (
3) indicates a reinforcing material film, and (4)... indicates an adhesive layer made of a urethane adhesive.
（実施例２）
電解銅箔に代えて、厚み７０μｌの圧延銅箔を用いたこ
と以外は、上記実施例１と同様にしてフレキシブルプリ
ント配線板を作製した。(Example 2) A flexible printed wiring board was produced in the same manner as in Example 1, except that a rolled copper foil with a thickness of 70 μl was used instead of the electrolytic copper foil.
（比較例１）
実施例１において、両面に液晶性ポリマーからなる補強
材フィルムを積層する前の段階の積層体を、そのままフ
レキシブルプリント配線板として用いた。(Comparative Example 1) In Example 1, the laminate before laminating reinforcing films made of liquid crystalline polymer on both sides was used as a flexible printed wiring board as it was.
（比較例２）
電解銅箔に代えて、厚み７０μＩの圧延銅箔を用いたこ
と以外は、上記比較例１と同様にしてフレキシブルプリ
ント配線板を作製した。(Comparative Example 2) A flexible printed wiring board was produced in the same manner as in Comparative Example 1, except that a rolled copper foil having a thickness of 70 μI was used instead of the electrolytic copper foil.
（耐冷熱衝撃試験）
上記実施例１，２、並びに比較例１，２のフレキシブル
プリント配線板を、それぞれ金型内に装填してポリウレ
タンの発泡成形を行い、各フレキシブルプリント配線板
の周囲に肉厚２０市の発泡ウレタン層を有する、フレキ
シブルプリント配線板埋め込み成形品を作製した。そし
て、各成形品に対し、−４０℃×２時間および＋９０℃
×２時間を１サイクルとする冷熱衝撃を加えて、導体回
路の断線を観察したところ、比較例１のフレキシブルプ
リント配線板を埋め込んだ成形品では１９８サイクル、
比較例２のフレキシブルプリント配線板を埋め込んだ成
形品では４１１サイクルで、それぞれ導体回路が断線し
た。(Cold Thermal Shock Resistance Test) The flexible printed wiring boards of Examples 1 and 2 and Comparative Examples 1 and 2 above were loaded into molds and foam molded with polyurethane. A flexible printed wiring board embedded molded product having a foamed urethane layer with a thickness of 20 cm was produced. Then, for each molded product, -40℃ x 2 hours and +90℃
When thermal shock was applied with one cycle of 2 hours and the conductor circuit was observed for disconnection, it was found that the molded product in which the flexible printed wiring board of Comparative Example 1 was embedded had 198 cycles.
In the molded product in which the flexible printed wiring board of Comparative Example 2 was embedded, each conductor circuit was disconnected after 411 cycles.
これに対し、実施例１．２のフレキシブルプリント配線
板を埋め込んだ成形品は、何れも、１０００サイクル以
上の冷熱衝撃でも導体回路が断線せず、このことから、
液晶性ポリマーからなる補強材が冷熱衝撃時の熱応力の
一部を吸収して、導体回路に加えられる応力を低減する
ことが判明した。On the other hand, in all of the molded products in which the flexible printed wiring board of Example 1.2 was embedded, the conductor circuit did not break even after 1000 cycles or more of thermal shock.
It has been found that a reinforcing material made of liquid crystalline polymer absorbs a portion of the thermal stress during thermal shock, reducing the stress applied to the conductor circuit.
〈発明の効果〉
本発明のフレキシブルプリント配線板は、冷熱衝撃時に
発生する熱応力の一部を、液晶性ポリマーからなる補強
材が吸収して、導体回路を熱応力から保護するため、導
体回路が容易に断線することがなく、高寿命、高信頼性
で、且つ温度変化の激しい環境下での使用に適したもの
となる。<Effects of the Invention> In the flexible printed wiring board of the present invention, the reinforcing material made of liquid crystalline polymer absorbs a part of the thermal stress generated during thermal shock and protects the conductor circuit from thermal stress. The wire does not break easily, has a long life, is highly reliable, and is suitable for use in environments with severe temperature changes.
第１図は、実施例のフレキシブルプリント配線板の層構
成を示す断面図である。
（Ａ）・・・フレキシブルプリント配線板、（１）・・
・導体回路、（２１（２）・・・ＰＥＴフィルム、（３
） （３）・・・補強材フィルム、（４）・・・接着剤
層。FIG. 1 is a cross-sectional view showing the layer structure of the flexible printed wiring board of the example. (A)...Flexible printed wiring board, (1)...
・Conductor circuit, (21(2)...PET film, (3
) (3)... Reinforcement film, (4)... Adhesive layer.
Claims (3)
プリント配線板であって、 サーモトロピック液晶性を示すポリマーからなる補強材
を有することを特徴とするフレキシブルプリント配線板
。1. A flexible printed wiring board used embedded in a synthetic resin, characterized in that it has a reinforcing material made of a polymer exhibiting thermotropic liquid crystallinity.
ある請求項１記載のフレキシブルプリント配線板。2. The flexible printed wiring board according to claim 1, wherein the polymer has an aromatic ring in its main chain.
で表わされる化合物よりなる群から選ばれた少なくとも
１種である請求項２記載のフレキシブルプリント配線板
。 ▲数式、化学式、表等があります▼．．．（Ｉ） ▲数式、化学式、表等があります▼．．．（II） ▲数式、化学式、表等があります▼．．．（III） ▲数式、化学式、表等があります▼．．．（IV） （式中、Ｒは２価の脂肪族基または芳香族基を表わし、
ｌ，ｍ，ｎはそれぞれ１以上の整数であって、式（Ｉ）
（II）においてはｍ＋ｎ≧１００、式（III）（IV）に
おいてはｌ＋ｍ＋ｎ≧１００である必要がある）3. 3. The flexible printed wiring board according to claim 2, wherein the polymer is at least one selected from the group consisting of compounds represented by the following general formulas (I) to (IV). ▲There are mathematical formulas, chemical formulas, tables, etc.▼． ．． ．． (I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼. ．． ．． (II) ▲There are mathematical formulas, chemical formulas, tables, etc.▼． ．． ．． (III) ▲There are mathematical formulas, chemical formulas, tables, etc.▼． ．． ．． (IV) (wherein R represents a divalent aliphatic group or an aromatic group,
l, m, n are each integers of 1 or more, and formula (I)
In (II), m+n≧100; in equations (III) and (IV), l+m+n≧100)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3909289A JP2628741B2 (en) | 1989-02-17 | 1989-02-17 | Flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3909289A JP2628741B2 (en) | 1989-02-17 | 1989-02-17 | Flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02218194A true JPH02218194A (en) | 1990-08-30 |
| JP2628741B2 JP2628741B2 (en) | 1997-07-09 |
Family
ID=12543436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3909289A Expired - Fee Related JP2628741B2 (en) | 1989-02-17 | 1989-02-17 | Flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2628741B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06177520A (en) * | 1992-12-03 | 1994-06-24 | Sony Chem Corp | Flexible printed substrate |
| US5326245A (en) * | 1992-06-26 | 1994-07-05 | International Business Machines Corporation | Apparatus for extruding materials that exhibit anisotropic properties due to molecular or fibril orientation as a result of the extrusion process |
| EP0675673A2 (en) * | 1994-03-30 | 1995-10-04 | Nitto Denko Corporation | Reinforcement for flexible printed circuit board and reinforced flexible circuit board |
| US5717556A (en) * | 1995-04-26 | 1998-02-10 | Nec Corporation | Printed-wiring board having plural parallel-connected interconnections |
| US10168582B1 (en) | 2017-09-28 | 2019-01-01 | Chipbond Technology Corporation | Chip package having a flexible substrate |
-
1989
- 1989-02-17 JP JP3909289A patent/JP2628741B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5326245A (en) * | 1992-06-26 | 1994-07-05 | International Business Machines Corporation | Apparatus for extruding materials that exhibit anisotropic properties due to molecular or fibril orientation as a result of the extrusion process |
| JPH06177520A (en) * | 1992-12-03 | 1994-06-24 | Sony Chem Corp | Flexible printed substrate |
| EP0675673A2 (en) * | 1994-03-30 | 1995-10-04 | Nitto Denko Corporation | Reinforcement for flexible printed circuit board and reinforced flexible circuit board |
| EP0675673A3 (en) * | 1994-03-30 | 1997-03-05 | Nitto Denko Corp | Reinforcement for flexible printed circuit board and reinforced flexible circuit board. |
| US5717556A (en) * | 1995-04-26 | 1998-02-10 | Nec Corporation | Printed-wiring board having plural parallel-connected interconnections |
| US10168582B1 (en) | 2017-09-28 | 2019-01-01 | Chipbond Technology Corporation | Chip package having a flexible substrate |
| KR101992732B1 (en) * | 2017-09-28 | 2019-06-25 | 칩본드 테크놀러지 코포레이션 | Chip package having flexible substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2628741B2 (en) | 1997-07-09 |
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| LAPS | Cancellation because of no payment of annual fees |