JPH0221776U - - Google Patents
Info
- Publication number
- JPH0221776U JPH0221776U JP10071888U JP10071888U JPH0221776U JP H0221776 U JPH0221776 U JP H0221776U JP 10071888 U JP10071888 U JP 10071888U JP 10071888 U JP10071888 U JP 10071888U JP H0221776 U JPH0221776 U JP H0221776U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- conductor pattern
- heat transfer
- transfer layer
- insulating heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10071888U JPH0221776U (US06653308-20031125-C00199.png) | 1988-07-29 | 1988-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10071888U JPH0221776U (US06653308-20031125-C00199.png) | 1988-07-29 | 1988-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221776U true JPH0221776U (US06653308-20031125-C00199.png) | 1990-02-14 |
Family
ID=31329047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10071888U Pending JPH0221776U (US06653308-20031125-C00199.png) | 1988-07-29 | 1988-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221776U (US06653308-20031125-C00199.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019145077A1 (de) * | 2018-01-23 | 2019-08-01 | Robert Bosch Gmbh | Schaltungsträgeranordnung mit verbesserter elektrischer kontaktierung |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56122190A (en) * | 1980-02-29 | 1981-09-25 | Matsushita Electric Works Ltd | Electric circuit board unit |
| JPS5843594A (ja) * | 1981-09-09 | 1983-03-14 | 住友電気工業株式会社 | 金属芯印刷配線板 |
| JPS5843595A (ja) * | 1981-09-09 | 1983-03-14 | 住友電気工業株式会社 | 金属芯印刷配線板 |
-
1988
- 1988-07-29 JP JP10071888U patent/JPH0221776U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56122190A (en) * | 1980-02-29 | 1981-09-25 | Matsushita Electric Works Ltd | Electric circuit board unit |
| JPS5843594A (ja) * | 1981-09-09 | 1983-03-14 | 住友電気工業株式会社 | 金属芯印刷配線板 |
| JPS5843595A (ja) * | 1981-09-09 | 1983-03-14 | 住友電気工業株式会社 | 金属芯印刷配線板 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019145077A1 (de) * | 2018-01-23 | 2019-08-01 | Robert Bosch Gmbh | Schaltungsträgeranordnung mit verbesserter elektrischer kontaktierung |
| CN111602237A (zh) * | 2018-01-23 | 2020-08-28 | 罗伯特·博世有限公司 | 具有得到改进的电接触的线路基座装置 |
| CN111602237B (zh) * | 2018-01-23 | 2023-09-26 | 罗伯特·博世有限公司 | 具有得到改进的电接触的线路基座装置 |
