JPH0221438A - Production of optical memory element - Google Patents

Production of optical memory element

Info

Publication number
JPH0221438A
JPH0221438A JP63171307A JP17130788A JPH0221438A JP H0221438 A JPH0221438 A JP H0221438A JP 63171307 A JP63171307 A JP 63171307A JP 17130788 A JP17130788 A JP 17130788A JP H0221438 A JPH0221438 A JP H0221438A
Authority
JP
Japan
Prior art keywords
optical memory
substrates
substrate
rays
memory element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63171307A
Other languages
Japanese (ja)
Other versions
JP2532593B2 (en
Inventor
Yoshiteru Murakami
善照 村上
Akira Takahashi
明 高橋
Hiroyuki Katayama
博之 片山
Junichiro Nakayama
純一郎 中山
Kenji Ota
賢司 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP63171307A priority Critical patent/JP2532593B2/en
Publication of JPH0221438A publication Critical patent/JPH0221438A/en
Application granted granted Critical
Publication of JP2532593B2 publication Critical patent/JP2532593B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1435—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1445—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface heating both sides of the joint
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1464—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface making use of several radiators
    • B29C65/1467—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface making use of several radiators at the same time, i.e. simultaneous welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1477—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier
    • B29C65/1483—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier coated on the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
    • B29C66/7232—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer
    • B29C66/72321—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer consisting of metals or their alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003—Records or discs
    • B29L2017/005—CD''s, DVD''s

Abstract

PURPOSE:To decrease the number of irradiation of UV rays and to improve productivity by irradiating an adhesive agent with UV rays simultaneously from both the front and rear sides of substrates to cure the adhesive agent. CONSTITUTION:Recording layers 12, 14 are constituted by laminating 1st transparent dielectric films, thin rare earth-transition metal alloy films, 2nd transparent dielectric films and metallic reflecting layers on the substrates 11a, 13a, successively from the side nearer the substrates. While the respective recording layers 12, 14 are disposed to face each other, the UV curing type adhesive agent layer 15 having, for example, about 30mum thickness is interposed therebetween and the two optical memory substrates 11, 13 are stuck to each other. The adhesive agent layer 15 is then irradiated with the UV rays of the specified intensity for a prescribed period of time simultaneously from both sides of the substrate 11a and the substrate 13a and is cured, by which the optical memory element is obtd. The number of the irradiation time of the UV rays is decreased in this way.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、光学的に情報の記録および再生、若しくは消
去を行う光メモリ素子の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing an optical memory element that optically records, reproduces, or erases information.

〔従来の技術〕[Conventional technology]

光メモリ素子は光学的に情報の記録、再生、消去などの
機能を実行できるものであるが、この光メモリ素子とし
ては、上記機能を片面のみで実行する片面型光メモリ素
子と、形状を大きくせずに情報記録容量を２倍にできる
という利点に着目し、上記機能を表裏両面で実行できる
ようにした表裏両面型光メモリ素子とがある。表裏両面
型光メモリ素子は、第４図に示すように、基本的には、
透明な基板１ａに記録層２が一体的に形成された光メモ
リ基板１と、同じく透明な基板３ａに記録層４が一体的
に形成された光メモリ基板３とで構成されている。光メ
モリ基板１と光メモリ基板３とは、記録層２・４同士を
対向させた状態に設けられ、これら記録層２・４同士の
間には、一般に、紫外線硬化性の接着剤層５が介在され
、この接着剤層５によって両光メモリ基板１・３が接着
固定されている。また、かかる表裏両面型の光メモリ素
子において、上記の透明な基板１ａ・３ａとしてポリカ
ーボネートなどの樹脂基板を用いた場合には、光メモリ
素子の゛反り”など、形状の経時変化を′抑えることが
できるという利点も有している。Optical memory elements are capable of optically performing functions such as recording, reproducing, and erasing information, but there are two types of optical memory elements: single-sided optical memory elements that perform the above functions on only one side, and two types that can perform the above functions without increasing the size. Focusing on the advantage of doubling the information storage capacity, there is a double-sided optical memory element that can perform the above functions on both the front and back sides. As shown in Figure 4, the front and back double-sided optical memory element basically has the following
The optical memory substrate 1 includes an optical memory substrate 1 in which a recording layer 2 is integrally formed on a transparent substrate 1a, and an optical memory substrate 3 in which a recording layer 4 is integrally formed in a similarly transparent substrate 3a. The optical memory substrate 1 and the optical memory substrate 3 are provided with the recording layers 2 and 4 facing each other, and an ultraviolet curable adhesive layer 5 is generally interposed between the recording layers 2 and 4. Both optical memory substrates 1 and 3 are adhesively fixed by this adhesive layer 5. In addition, in such a double-sided optical memory element, when a resin substrate such as polycarbonate is used as the transparent substrates 1a and 3a, it is possible to suppress changes in shape over time such as "warping" of the optical memory element. It also has the advantage of

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

ところが、上記の表裏両面型光メモリ素子にあっては、
接着剤Ｎ５の厚みが比較的厚くなることから、その深部
まで紫外線を十分に浸透させることができず、かかる接
着剤層５の硬化が不完全となり易い。従って、照射する
紫外線の出力を強くしたり、エネルギー積算値を高める
ことで硬化の完全化を図っているが、上記の透明基板１
ａ・３ａとしてポリカーボネートなどの樹脂基板を用い
た場合には、紫外線照射による温度上昇を考慮しなけれ
ばならないから、紫外線照射を数回に分けて行うなどの
配慮が必要となり、生産性向上が図れないという問題を
招来していた。However, in the above-mentioned double-sided optical memory element,
Since the thickness of the adhesive N5 is relatively thick, ultraviolet rays cannot be sufficiently penetrated deep into the adhesive layer 5, so that the adhesive layer 5 tends to be incompletely cured. Therefore, complete curing is attempted by increasing the output of the ultraviolet rays or increasing the integrated energy value, but the above transparent substrate 1
When using a resin substrate such as polycarbonate as a/3a, it is necessary to take into account the temperature rise due to ultraviolet irradiation, so considerations such as dividing the ultraviolet irradiation into several times are necessary to improve productivity. This led to the problem that there was no such thing.

また、同じく、接着剤層５の厚みが比較的厚いと、紫外
線の出力およびエネルギー積算値を高めても、接着剤Ｎ
５の厚さ方向で、硬化状態に差が生じてしまう。すなわ
ち、第５図に示すように、紫外線を照射した側（図中→
印は紫外線照射方向を示している）の記録層２に近い側
では、はぼ所望の硬化状態が得られるのであるが、記録
層４に近い側では、記録層２に近い側での硬化状態と同
程度の硬化状態を得ることはできない。このように、硬
化状態に差異が生じると、かかる紫外線硬化樹脂の物性
にも当然に差異が生じ、その結果、硬化の不十分な箇所
で耐湿性などの耐環境特性が不完全となり、記録層４側
で酸化や腐蝕の進行が速まることになる。さらに、硬化
の不十分な箇所では、樹脂中の七ツマ−が拡散、運動を
行うため、このモノマー成分が記録層４に悪影響を及ぼ
す虞れもある。Similarly, if the thickness of the adhesive layer 5 is relatively thick, even if the output of ultraviolet rays and the integrated energy value are increased, the adhesive N
There is a difference in the cured state in the thickness direction of No. 5. In other words, as shown in Figure 5, the side irradiated with ultraviolet rays (→ in the figure)
The mark indicates the direction of ultraviolet irradiation) On the side closer to the recording layer 2, the desired cured state is obtained, but on the side closer to the recording layer 4, the cured state on the side closer to the recording layer 2 is obtained. It is not possible to obtain the same degree of hardening. If there is a difference in the curing state as described above, there will naturally be a difference in the physical properties of the ultraviolet curable resin, and as a result, environmental resistance properties such as moisture resistance will be incomplete in areas where the curing is insufficient, and the recording layer Oxidation and corrosion will accelerate on the 4th side. Furthermore, in areas where curing is insufficient, the monomer components in the resin diffuse and move, so there is a possibility that this monomer component may have an adverse effect on the recording layer 4.

〔課題を解決するための手段〕[Means to solve the problem]

本発明に係る光メモリ素子の製造方法は、上記の課題を
解決するために、光学的に情報を記録する記録層が形成
された光メモリ基板同士の接合、若しくは、上記の記録
層が形成された光メモリ基板と保護用基板との接合を、
紫外線照射で硬化する接着剤にて行うようにした光メモ
リ素子の製造方法において、上記圧いの基板の間に上記
の接着剤を介在させてこれらを貼り合わせた後、この貼
り合わされた基板の表裏両側から同時に紫外線を照射し
て、上記接着剤を硬化させることを特徴としている。In order to solve the above problems, the method for manufacturing an optical memory element according to the present invention involves bonding optical memory substrates on which a recording layer for optically recording information is formed, or an optical memory device on which the above recording layer is formed. Bonding the substrate and the protective substrate,
In a method for manufacturing an optical memory element using an adhesive that cures with ultraviolet irradiation, after bonding the substrates together with the adhesive interposed between them, the front and back surfaces of the bonded substrates are bonded together. It is characterized in that the adhesive is cured by simultaneously irradiating ultraviolet rays from both sides.

〔作　用〕[For production]

上記の構成によれば、基板同士の間に介在されている上
記の接着剤は、画記録層における界面近傍（一方が保護
用基板である場合にはこの基板および他方の基板トの記
録層における界面近傍）で均一に硬化することになるか
ら、表裏両面での耐環境特性、並びにモノマー成分によ
る悪影響の低減能力を同等に保有することができ、全体
的な品質および信頼性の向上を図ることができる。その
上、紫外線の同時両面照射により接着剤の硬化を短時間
で行うことが可能になるから、紫外線照射を数回に分け
て行う場合などにはその回数を減らすことができ、生産
性向上を図って、生産コストを低減することが可能にな
る。According to the above configuration, the adhesive interposed between the substrates is applied near the interface in the image recording layer (if one is a protective substrate, in the recording layer of this substrate and the other substrate). Since the material is cured uniformly (near the interface), it is possible to maintain the same environmental resistance properties on both the front and back surfaces as well as the ability to reduce the negative effects of monomer components, improving overall quality and reliability. I can do it. Furthermore, simultaneous UV irradiation on both sides allows the adhesive to harden in a short time, so when UV irradiation is divided into several parts, the number of times can be reduced, improving productivity. This makes it possible to reduce production costs.

〔実施例） 本発明の一実施例を第１図ないし第３図に基づいて説明
すれば、以下の通りである。なお、第３図では本発明と
の比較のために、従来の紫外線照射方法を例示している
。[Embodiment] An embodiment of the present invention will be described below with reference to FIGS. 1 to 3. Note that FIG. 3 illustrates a conventional ultraviolet irradiation method for comparison with the present invention.

本発明に係る光メモリ素子の製造方法は、第１図（ａ）
に示すように、透明な基板である例えばポリカーボネー
ト基板１１ａ上に記録層１２の形成されてなる光メモリ
基板１■、および、上記と同様、透明な基板である例え
ばポリカーボネート基板１３ａ上に記録層１４の形成さ
れてなる光メモリ基板１３を用意する。なお、上記の記
録Ｎ１２・１４は、それぞれ、基板ＩＬａ・１３ａ側か
ら近い順に、第１の透明誘電体膜、希土類遷移金属合金
薄膜、第２の透明誘電体膜、および金属反射膜が積層さ
れることで構成されている。The method for manufacturing an optical memory element according to the present invention is shown in FIG. 1(a).
As shown in FIG. 1, there is an optical memory substrate 12 in which a recording layer 12 is formed on a transparent substrate, for example, a polycarbonate substrate 11a, and similarly to the above, a recording layer 14 is formed on a transparent substrate, for example, a polycarbonate substrate 13a. An optical memory substrate 13 is prepared. Note that in the above records N12 and 14, a first transparent dielectric film, a rare earth transition metal alloy thin film, a second transparent dielectric film, and a metal reflective film are laminated in order from the substrates ILa and 13a, respectively. It consists of:

次に、同図（ｂ）に示すように、互いの記録層１２・１
４間士を対向させた状態で、かかる記録層１２・１４間
に、例えば、厚み約３０μｍの紫外線硬化性の接着剤層
１５を介在させて両光メモリ基板１１・１３を貼り合わ
せる。Next, as shown in FIG.
The optical memory substrates 11 and 13 are bonded together with the recording layers 12 and 14 facing each other with, for example, an ultraviolet curable adhesive layer 15 having a thickness of about 30 μm interposed therebetween.

そして、同図（ｃ）に示すように、基板１１ａおよび基
板１３ａの両側から、同時に、一定強すの紫外線を所定
時間照射して（図中→印は紫外線照射方向を示している
）、前記接着剤層１５を硬化させて光メモリ素子を得る
。Then, as shown in FIG. 3(c), ultraviolet rays of a constant intensity are irradiated from both sides of the substrate 11a and the substrate 13a for a predetermined time (in the figure, the → mark indicates the direction of ultraviolet irradiation). The adhesive layer 15 is cured to obtain an optical memory element.

ここで、かかる製造方法による上記接着剤層１５の硬化
具合と、従来の紫外線照射方法による接着剤層１５の硬
化具合とを比較する。なお、従来の紫外線照射方法によ
る硬化度合との比較が容易となるように、接着剤層１５
は比較的耐湿性の低い材料を用いている。また、上記紫
外線のエネルギー積算値は表裏正面でそれぞれＸ　ｍ　
Ｊ　／　ｃｉに設定しである。Here, the degree of hardening of the adhesive layer 15 by this manufacturing method will be compared with the degree of hardening of the adhesive layer 15 by the conventional ultraviolet irradiation method. Note that the adhesive layer 15 was
uses materials with relatively low moisture resistance. In addition, the integrated energy value of the ultraviolet rays mentioned above is X m for the front and back sides respectively.
It is set to J/ci.

（従来第１方法） 第３図（ａ）に示すように、基板１１ａ側からのみ紫外
線を照射し、そのエネルギー積算値をＸｍ　Ｊ　／　ｃ
ｔＭに設定している。(Conventional first method) As shown in FIG. 3(a), ultraviolet rays are irradiated only from the substrate 11a side, and the integrated energy value is Xm J / c
It is set to tM.

（従来第２方法） 同図（ｂ）に示すように、基板１１ａ側がらのみ紫外線
を照射し、そのエネルギー積算値を上記の２倍である２
ＸｍＪ／ｃｄに設定している。(Second Conventional Method) As shown in FIG. 2(b), only the side of the substrate 11a is irradiated with ultraviolet rays, and the integrated energy value is 2, which is twice the above value.
It is set to XmJ/cd.

（従来第３方法） 同図（ｃ）に示すように、基板１１ａ側がらのみ紫外線
を照射した後、裏返して、基板１３ａ側からのみ紫外線
を照射し、そのエネルギー積算値をそれぞれＸｍＪ／ｃ
ＴＩｌに設定している。(Conventional 3rd method) As shown in the same figure (c), after irradiating ultraviolet rays only from the substrate 11a side, turn it over and irradiate ultraviolet rays only from the substrate 13a side, and calculate the integrated energy value of XmJ/c.
It is set to TIl.

なお、上記いずれの方法においても、紫外線照射による
温度上昇が光メモリ基板に影響を与えることはなかった
。Note that in any of the above methods, the temperature increase due to ultraviolet irradiation did not affect the optical memory substrate.

上記各々の紫外線照射方法により硬化した接着剤層の腐
蝕試験を、温度湿度サイクルテスト（環境テスト）と称
されるテストで行った。具体的には、第２図に示すよう
に、一定時間（６時間）内に温度および湿度を所定に変
化させ、この所定変化を１サイクルとして、このサイク
ルを４８回繰り返す。従って、合計２８８時間にわたる
テストを行った。そして、腐蝕の状態を肉眼または光学
顕微鏡により観察し、記録層１２および記録層１４のそ
れぞれの全膜面積に対する腐蝕部分の総面積をパーセン
トで表示している。A corrosion test of the adhesive layer cured by each of the above ultraviolet irradiation methods was carried out in a test called a temperature/humidity cycle test (environmental test). Specifically, as shown in FIG. 2, the temperature and humidity are changed to a predetermined value within a certain period of time (6 hours), and this predetermined change is defined as one cycle, and this cycle is repeated 48 times. Therefore, a total of 288 hours of testing was conducted. The state of corrosion is then observed with the naked eye or with an optical microscope, and the total area of the corroded portion is expressed as a percentage of the total film area of each of the recording layers 12 and 14.

このテスト結果を以下の第１表に示す。The test results are shown in Table 1 below.

第１表 上記の結果から明らかなように、本発明に係る光メモリ
素子の製造方法によれば、基板ｉ１ａおよび基板１３ａ
の両側から、同時に、紫外線を照射して、接着剤層１５
を硬化させているので、この接着剤Ｊｉ１５は画記録層
１２・１４における界面近傍で均一に硬化することにな
る。これにより、表裏両面での耐環境特性、並びにモノ
マー成分による悪影響の低減能力を同等に保有すること
ができ、全体的な品質および信頬性の向上を図ることが
できる。その上、紫外線の同時両面照射により上記接着
剤層１５の硬化を短時間で行うことが可能になるから、
紫外線照射を数回に分けて行う場合などにはその回数を
減らすことができ、生産性向上を図って、生産コストを
低減することができる。Table 1 As is clear from the above results, according to the method of manufacturing an optical memory element according to the present invention, the substrate i1a and the substrate 13a
The adhesive layer 15 is simultaneously irradiated with ultraviolet rays from both sides of the adhesive layer 15.
Since the adhesive Ji15 is cured, the adhesive Ji15 is uniformly cured near the interface between the image recording layers 12 and 14. As a result, it is possible to equally maintain environmental resistance properties on both the front and back sides, as well as the ability to reduce the adverse effects of monomer components, and it is possible to improve the overall quality and reliability. Moreover, since the adhesive layer 15 can be cured in a short time by simultaneous irradiation of both sides with ultraviolet rays,
In cases where ultraviolet irradiation is performed in several parts, the number of times can be reduced, productivity can be improved, and production costs can be reduced.

なお、本実施例では、側基板とも光メモリ基板である両
面型の光メモリ素子を示したが、一方が光メモリ基板で
他方が保護用基板である片面型光メモリ素子を製造する
場合にも適用できることは勿論である。かかる場合には
、上記保護用基板側には記録層が無いことにより紫外線
が透過し易（なるから、この側から照射する紫外線の出
力を他方の側よりも幾分弱くするなどの処置を施せば、
両面で均質の硬化状態を得ることができる。Although this embodiment shows a double-sided optical memory device in which both the side substrates are optical memory substrates, it is of course applicable to manufacturing a single-sided optical memory device in which one side substrate is an optical memory substrate and the other is a protective substrate. It is. In such a case, since there is no recording layer on the protective substrate side, ultraviolet rays are likely to pass through (this is why measures such as making the output of ultraviolet rays emitted from this side somewhat weaker than from the other side should be taken). Ba,
A homogeneous cured state can be obtained on both sides.

〔発明の効果〕〔Effect of the invention〕

本発明に係る光メモリ素子の製造方法は、以上のように
、光学的に情報を記録する記録層が形成された光メモリ
基板同士の接合、若しくは、上記の記録層が形成された
光メモリ基板と保護用基板との接合を、紫外線照射で硬
化する接着剤にて行うようにした光メモリ素子の製造方
法において、上記圧いの基板の間に上記の接着剤を介在
させてこれらを貼り合わせた後、この貼り合わされた基
板の表裏両側から同時に紫外線を照射して、上記接着剤
を硬化させる構成である。As described above, the method for manufacturing an optical memory element according to the present invention includes bonding optical memory substrates on which a recording layer for optically recording information is formed, or bonding an optical memory substrate on which the above-mentioned recording layer is formed and a protective layer. In a method for manufacturing an optical memory element in which the bonding with the substrate is performed using an adhesive that cures with ultraviolet irradiation, the above adhesive is interposed between the substrates of the above thickness, and then these are bonded together. The adhesive is cured by simultaneously irradiating ultraviolet rays from both the front and back sides of the bonded substrates.

これにより、表裏両面での耐環境特性、並びにモノマー
成分による悪影響の低減能力を同等に保有することがで
き、全体的な品質および信頼性の向上を図ることができ
る。その上、紫外線の両面照射により接着剤の硬化を短
時間で行うことが可能になるから、紫外線照射を数回に
分けて行う場合などにはその回数を減らすことができ、
生産性向上を図って、生産コストを低減できるという効
果も併せて奏する。As a result, it is possible to maintain the same environmental resistance properties on both the front and back sides, as well as the ability to reduce the adverse effects of the monomer components, thereby improving the overall quality and reliability. Furthermore, since the adhesive can be cured in a short time by irradiating both sides with UV rays, the number of times of UV irradiation can be reduced if the UV irradiation is to be done in several parts.
This also has the effect of improving productivity and reducing production costs.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図（ａ）ないしくｃ）は本発明の一実施例を示すも
のであって、それぞれ光メモリ素子の製造工程の各段階
を示す断面図、第２図は環境テストにおける１サイクル
の内容を示す説明図、第３図（ａ）ないしくｃ）はそれ
ぞれ本発明との比較のために例示した従来の紫外線照射
方法を示す説明図、第４図は光メモリ素子の断面図、第
５図は従来の紫外線照射方法により得られた光メモリ素
子における接着剤層の硬化具合を説明するための説明図
である。 １１・１３は光メモリ基板、ｌｌａ・１３ａはポリカー
ボネート基板、１２・１４は記録層、１５は接着剤層で
ある。 第　１１（ａ） 第　１　区（ｂ） 第　２　図 第　１　図（Ｃ） 第 ３図（ａ） 箪 図（ｂ） ズ （Ｃ）Figures 1 (a) to c) show one embodiment of the present invention, and are cross-sectional views showing each stage of the manufacturing process of an optical memory element, and Figure 2 shows the contents of one cycle in an environmental test. 3(a) to 3(c) are explanatory diagrams showing a conventional ultraviolet irradiation method exemplified for comparison with the present invention, FIG. 4 is a sectional view of an optical memory element, and FIG. FIG. 3 is an explanatory diagram for explaining the degree of hardening of an adhesive layer in an optical memory element obtained by a conventional ultraviolet irradiation method. 11 and 13 are optical memory substrates, lla and 13a are polycarbonate substrates, 12 and 14 are recording layers, and 15 is an adhesive layer. Section 11 (a) Section 1 (b) Section 2 Section 1 (C) Section 3 (a) Table of drawers (b) Zu (C)

Claims (1)

【特許請求の範囲】[Claims] １、光学的に情報を記録する記録層が形成された光メモ
リ基板同士の接合、若しくは、上記の記録層が形成され
た光メモリ基板と保護用基板との接合を、紫外線照射で
硬化する接着剤にて行うようにした光メモリ素子の製造
方法において、上記互いの基板の間に上記の接着剤を介
在させてこれらを貼り合わせた後、この貼り合わされた
基板の表裏両側から同時に紫外線を照射して、上記接着
剤を硬化させることを特徴とする光メモリ素子の製造方
法。1. Bonding between optical memory substrates on which a recording layer for optically recording information is formed, or bonding between an optical memory substrate on which the above-mentioned recording layer is formed and a protective substrate, using an adhesive that hardens with ultraviolet irradiation. In the method for manufacturing an optical memory device, the substrates are bonded together with the adhesive interposed between them, and then ultraviolet rays are irradiated from both the front and back sides of the bonded substrates, A method for manufacturing an optical memory element, comprising curing the adhesive.
JP63171307A 1988-07-08 1988-07-08 Method for manufacturing optical memory device Expired - Lifetime JP2532593B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63171307A JP2532593B2 (en) 1988-07-08 1988-07-08 Method for manufacturing optical memory device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63171307A JP2532593B2 (en) 1988-07-08 1988-07-08 Method for manufacturing optical memory device

Publications (2)

Publication Number Publication Date
JPH0221438A true JPH0221438A (en) 1990-01-24
JP2532593B2 JP2532593B2 (en) 1996-09-11

Family

ID=15920848

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP2532593B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0836182A2 (en) * 1996-10-11 1998-04-15 Wea Manufacturing Inc. Methods for bonding structurally dissimilar optical discs
USRE39412E1 (en) 1995-02-15 2006-11-28 Matsushita Electric Industrial Co., Ltd. Optical information medium, and method and apparatus for fabricating the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63160034A (en) * 1986-12-23 1988-07-02 Seiko Epson Corp Production of optical recording medium

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63160034A (en) * 1986-12-23 1988-07-02 Seiko Epson Corp Production of optical recording medium

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE39412E1 (en) 1995-02-15 2006-11-28 Matsushita Electric Industrial Co., Ltd. Optical information medium, and method and apparatus for fabricating the same
EP0836182A2 (en) * 1996-10-11 1998-04-15 Wea Manufacturing Inc. Methods for bonding structurally dissimilar optical discs
EP0836182A3 (en) * 1996-10-11 1998-11-11 Wea Manufacturing Inc. Methods for bonding structurally dissimilar optical discs
US5900098A (en) * 1996-10-11 1999-05-04 Wea Manufacturing Inc. Methods for bonding structurally dissimilar optical discs

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