JPH02214014A - Thin-film magnetic disk and production thereof - Google Patents

Thin-film magnetic disk and production thereof

Info

Publication number
JPH02214014A
JPH02214014A JP3416689A JP3416689A JPH02214014A JP H02214014 A JPH02214014 A JP H02214014A JP 3416689 A JP3416689 A JP 3416689A JP 3416689 A JP3416689 A JP 3416689A JP H02214014 A JPH02214014 A JP H02214014A
Authority
JP
Japan
Prior art keywords
substrate
layer
polishing
magnetic disk
base metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3416689A
Other languages
Japanese (ja)
Inventor
Migaku Tada
琢 多田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Victor Company of Japan Ltd
Original Assignee
Victor Company of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Victor Company of Japan Ltd filed Critical Victor Company of Japan Ltd
Priority to JP3416689A priority Critical patent/JPH02214014A/en
Publication of JPH02214014A publication Critical patent/JPH02214014A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To uniform the surface roughness of the disk, lower the coefft. of dynamic friction thereof, prolong the life and to improve durability and reliability by forming surface projections which are uniform in a circumferential direction at the time of forming an underlying metallic layer and a magnetic layer. CONSTITUTION:An Al substrate 1 subjected to electroless NiP plating is subjected to concentrical polishing according to the polishing grains to be used, by which the surface roughness is adjusted to 30 to 150Angstrom . The etching of the substrate surface is then executed by an inert gas and thereafter the continuous and uniform surface projections having about 200 to 400Angstrom height in the circumferential direction and >=30 pieces/mm sectional length density in the radial direction are formed by utilizing the growth of the underlying metallic layer 2 in the work hardened layer at both ends of the flaws generated during polishing at the time of forming the underlying metallic layer 2 and the magnetic layer 3 by a sputtering method.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は記録媒体として好適な薄膜磁気ディスク及びそ
の製造方法に係り、特に製造上の前処理を改善して耐久
性を向上させた薄膜磁気ディスク及びその製造方法に関
する。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a thin-film magnetic disk suitable as a recording medium and a method for manufacturing the same, and particularly relates to a thin-film magnetic disk that has improved durability by improving pre-treatment during manufacturing. This invention relates to a disc and its manufacturing method.

工従来の技術〕 従来より、薄膜磁気ディスクを製造する際、基板に対す
る前処理の仕方としては、表面をアルマイト層で被覆し
たAJ基板を、ポリッシュ等により鏡面仕上げした後、
Ar又はo2或いはその混合ガス雰囲気中で高周波スパ
ッタエッチを行ない、基板に凹部のみ形成させている。
[Conventional technology] Conventionally, when manufacturing thin-film magnetic disks, the pretreatment method for the substrate is to take an AJ substrate whose surface is coated with an alumite layer, polish it to a mirror finish, and then
High frequency sputter etching is performed in an Ar, O2, or mixed gas atmosphere to form only recesses in the substrate.

この基板の平均表面粗さは、70〜140人に調整され
るよう高周波スパッタエッチ条件を選択する0条件とし
ては、ガス圧力=9Pa、RF電力密度=0.2 W/
cd。
The average surface roughness of this substrate is adjusted to 70 to 140. The conditions for selecting high frequency sputter etching conditions are gas pressure = 9 Pa, RF power density = 0.2 W/
cd.

及びエツチング時間=1時間が挙げられる。この後、磁
性層等の薄膜を形成する。
and etching time=1 hour. After this, a thin film such as a magnetic layer is formed.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

鏡面仕上げ後、RF(高周波)スパッタエッチにより、
凹部のみ形成された基板を用いたディスクでは、動摩擦
係数は初期状態では低いが、C8S (Contact
 5tart 5top)試験を繰返すと、深い凹部以
外は摩耗により接触面積が増大し、摩擦力。
After mirror finishing, RF (high frequency) sputter etching
In a disk using a substrate with only recesses formed, the coefficient of dynamic friction is low in the initial state, but C8S (Contact
5tart 5top) When the test is repeated, the contact area increases due to wear except for deep recesses, and the frictional force increases.

吸着力の著しい増加が見られる。これにより、ヘッド、
ディスク間の貼り着きゃ、保護層、更には磁性層等の破
壊が生じてしまうという問題点があった。
A significant increase in adsorption power is observed. This allows the head,
There is a problem in that if the disks stick together, the protective layer, furthermore, the magnetic layer, etc., will be destroyed.

〔課題を解決するための手段〕[Means to solve the problem]

本発明は、無電解Ni合金鍍金と、研磨砥粒での研磨加
工とを施されたのち高周波スパッタエッチを施されたA
1基板と、スパッタリング法により形成された下地金属
層及び磁性層とを少なくとも有し、上記研磨加工時に生
じる傷とその両端の加工変質部における下地金属層の成
長を利用して、円周方向に高さ約200〜400人で、
半径方向の断面実密度が30本/fi以上の連続した均
一な表面突起を形成されて作製される薄膜磁気ディスク
及びその製造方法を提供することにより、上記問題点を
解決した。
In the present invention, A
1 substrate, and at least a base metal layer and a magnetic layer formed by a sputtering method, and by utilizing the scratches generated during the polishing process and the growth of the base metal layer in the process-altered parts at both ends, Approximately 200 to 400 people in height,
The above problems have been solved by providing a thin film magnetic disk manufactured by forming continuous and uniform surface protrusions with an actual cross-sectional density of 30 protrusions/fi or more in the radial direction, and a method for manufacturing the same.

〔実施例〕〔Example〕

本発明の薄膜磁気ディスク及びその製造方法について、
第1図を参照しながら説明する。第1図は本発明の薄膜
磁気ディスクの一実施例の拡大部分断面図である。まず
、無電解NIP鍍金を施した/’l基板(以下rNiP
基板」とも記載する)1に、用いる研磨砥粒に応じて、
同心円状の研磨加工(テクスチャリング加工)を施し、
平均表面粗さを30〜150人に調整する0次いで高周
波スパッタリング法により不活性ガスで基板表面のエツ
チングを行なった後、下地金属層2及び磁性層3をスパ
ッタリング法により形成する際、研磨加工時に生じる傷
の両端の加工変質部での下地金属層2の成長を利用して
、円周方向に均一な表面突起を形成するのが最大の特徴
である。
Regarding the thin film magnetic disk of the present invention and its manufacturing method,
This will be explained with reference to FIG. FIG. 1 is an enlarged partial sectional view of an embodiment of the thin film magnetic disk of the present invention. First, a /'l substrate (rNiP
(also referred to as "substrate") 1, depending on the abrasive grains used,
Concentric polishing process (texturing process) is applied,
The average surface roughness is adjusted to 30 to 150. After etching the substrate surface with an inert gas by high-frequency sputtering, the base metal layer 2 and magnetic layer 3 are formed by sputtering, and during polishing. The most important feature is that uniform surface protrusions are formed in the circumferential direction by utilizing the growth of the base metal layer 2 at the process-altered parts at both ends of the scratch.

研磨加工は研磨砥粒1〜10μmの研磨テープで行なう
ことができ、加工条件により平均表面粗さを30〜15
0人に調整することができる。この加工は基板に凹凸を
形成し、磁気ディスクとヘッドとの間の接触面積を低減
させて、摩擦力や吸着力を小さくすることを目的とする
。しかるに、深い凹部と同程度に凸部も発生するので、
均一な表面粗さを得ることは困難である。また、ポリッ
シュ加工を施した基板に高周波スパッタエッチにより凹
部のみを形成させた基板を用いた磁気ディスクでは、長
期的なC8S試験では摩耗が大きく、摩擦力や吸着力が
上昇し、ヘッド、ディスク間の貼り着きゃ、保護14.
更には磁性層3の破壊が生じる。同心円状の研磨加工を
施して適度に凹凸を形成したNiP基板1を用い、高周
波スパッタエッチを施すと、高い突起はエツチングによ
り除去される。
Polishing can be performed using a polishing tape with abrasive grains of 1 to 10 μm, and the average surface roughness can be adjusted to 30 to 15 μm depending on the processing conditions.
It can be adjusted to 0 people. The purpose of this processing is to form irregularities on the substrate to reduce the contact area between the magnetic disk and the head, thereby reducing frictional force and adsorption force. However, since convex portions occur to the same extent as deep concave portions,
It is difficult to obtain uniform surface roughness. In addition, in a magnetic disk using a polished substrate with only concave portions formed by high-frequency sputter etching, long-term C8S tests showed large wear, increased frictional force and adsorption force, and increased friction between the head and the disk. If it sticks, protect it 14.
Furthermore, the magnetic layer 3 is destroyed. When high frequency sputter etching is performed using a NiP substrate 1 which has been subjected to concentric polishing to form moderate irregularities, tall protrusions are removed by etching.

また、研磨加工を施した基板lに金属H2をスパッタリ
ング法にて形成すると、傷の両端のパリの部分では、他
の平坦な部分よりも金属膜2の成長速度が速く、100
0〜2000人程度の幅で円周方向に沿った連続した表
面突起が形成される。これは加工変質部の活性点に起因
するが、高周波スパッ、タエッチにより基板表面の酸化
層を除去すると、金属膜2の成長速度の速い部分は増加
し、形成される突起数も多くなる0表面突起の高さは形
成される金属膜2の厚さや、スパッタリング条件により
調整できるが、C8S試験等でも長期間摩耗せず、ヘッ
ドの低浮上量に対してヘッドクラッシュも生じないよう
にするためには200〜400人の範囲が望ましい。
Furthermore, when the metal H2 is formed by sputtering on the polished substrate l, the growth rate of the metal film 2 is faster in the paris parts at both ends of the scratch than in other flat parts, and the growth rate is 100%.
Continuous surface projections along the circumferential direction are formed with a width of about 0 to 2000. This is caused by active points in the processed parts, but when the oxide layer on the substrate surface is removed by high-frequency sputtering and etching, the areas where the metal film 2 grows at a high rate increase and the number of protrusions formed increases. The height of the protrusions can be adjusted depending on the thickness of the metal film 2 to be formed and the sputtering conditions, but in order to prevent long-term wear even in C8S tests, etc., and to prevent head crashes due to the low flying height of the head. The preferred range is 200 to 400 people.

表面突起の密度は、ヘッド加重を分散し、動摩擦係数を
長期間に互って低く抑えておくためには、半径方向に単
位断面長さをとると、少くとも30本/m以上が必要で
あり、その反面、ヘッドとの接触面積を小さくするため
には、多くとも200本/fi以下となる。突起の円周
方向の長さは、研磨加工条件により興なるため特定しな
い、また、スパッタエッチ条件、下地金属I!!2のス
パッタ条件も装置因子が大きいので特定しない、しかし
ながら、エツチングを過剰に行なって加工変質部を除去
すると突起は発生しなくなる。
In order to distribute the head load and keep the coefficient of dynamic friction low over a long period of time, the density of the surface protrusions must be at least 30 protrusions/m when the unit cross-sectional length is taken in the radial direction. On the other hand, in order to reduce the contact area with the head, the number should be at most 200 lines/fi. The length of the protrusion in the circumferential direction is not specified because it depends on the polishing conditions, and also depends on the sputter etching conditions and the underlying metal I! ! Since the sputtering conditions of No. 2 also depend on the equipment, they are not specified. However, if etching is performed excessively to remove the damaged parts, no protrusions will be generated.

このように、高周波スパッタエッチを施して、研磨加工
により凹凸を調整し、下地金属WA2により任意の好ま
しい高さや密度の表面突起を得ることが可能であり、高
耐久性を持つ薄膜磁気ディスクを作製することが可能と
なる。以下、第2図以降を参照して、具体的な実施例と
比較例を示しながら説明する。
In this way, by performing high-frequency sputter etching and adjusting the unevenness by polishing, it is possible to obtain surface protrusions of any desired height and density using the base metal WA2, and a highly durable thin-film magnetic disk can be produced. It becomes possible to do so. Hereinafter, a description will be given while showing specific examples and comparative examples with reference to FIG. 2 and subsequent figures.

〈実施例1〉 NIP基板に平均砥粒9μmの研磨テープで研磨加工を
施し、平均表面粗さを100人に調整した。
<Example 1> A NIP substrate was polished using a polishing tape with an average abrasive grain size of 9 μm, and the average surface roughness was adjusted to 100.

次にこの基板にRF出力200W、Arガス圧10m 
Torrで100分間高波スパッタエッチを行なった。
Next, apply an RF output of 200 W and an Ar gas pressure of 10 m to this substrate.
High wave sputter etching was performed at Torr for 100 minutes.

この基板を真空中に保持したまま、下地金属層としてC
r約400人、磁性層としてCO系合金約700人、及
び保護層としてC(炭素)約400人を、DCマグネト
ロンスパッタリング法により形成した。更にF(弗素)
系潤滑剤を30人スピンコードして潤滑層(第1図の5
)を形成して磁気ディスクを完成した。このディスクの
半径方向の表面形状を第2図に示す。
While holding this substrate in vacuum, C was used as a base metal layer.
About 400 layers of R, about 700 layers of CO-based alloy as a magnetic layer, and about 400 layers of C (carbon) as a protective layer were formed by DC magnetron sputtering. Furthermore, F (fluorine)
A lubricant layer (5 in Figure 1) was created by spin-coding a lubricant based on
) and completed the magnetic disk. The radial surface shape of this disk is shown in FIG.

〈実施例2〉 NIP基板に平均砥粒3μmの研磨テープで研磨加工を
施し、平均表面粗さを30人に調整した。
<Example 2> A NIP substrate was polished using a polishing tape with an average abrasive grain of 3 μm, and the average surface roughness was adjusted to 30.

次にこの基板にRF出力200W、Arガス圧10mT
Orrで2分間高周波スパッタエッチを施し、以下実施
例1と同様のスパッタリングにより薄膜を形成した0次
にF系潤滑剤を20人スピンコードして磁気ディスクを
作製した。このディスクの半径方向の表面形状を第3図
に示す。
Next, apply an RF output of 200W and an Ar gas pressure of 10mT to this substrate.
High-frequency sputter etching was performed for 2 minutes at Orr, and a thin film of the zero-order F-based lubricant was formed by sputtering in the same manner as in Example 1, and 20 people spin-coded it to produce a magnetic disk. The radial surface shape of this disk is shown in FIG.

く比較例1〉 NIP基板に実施例1と同様な研磨加工を施し、RF出
力200W、Arガス圧100m Torrで300分
間高波スパッタエヅチを行ない、以下、実施例1と同様
な工程を経て磁気ディスクを作製した。
Comparative Example 1 A NIP substrate was polished in the same manner as in Example 1, and high-wave sputter etching was performed at an RF output of 200 W and an Ar gas pressure of 100 m Torr for 300 minutes. Created.

このディスクの半径方向の表面形状を第4図に示す。The radial surface shape of this disk is shown in FIG.

く比較例2〉 NiP基板に実施例1と同様な研磨加工を施し、高周波
スパッタエッチを行なわず、その他は実施例1と同様な
工程を経て磁気ディスクを作製した。
Comparative Example 2> A magnetic disk was manufactured by subjecting a NiP substrate to the same polishing process as in Example 1, without performing high-frequency sputter etching, and in other steps similar to those in Example 1.

この磁気ディスクの半径方向の表面形状を第5図に示す
FIG. 5 shows the radial surface shape of this magnetic disk.

以上4種類の磁気ディスクについてC8S試験を行なっ
た。その結果を第1表に示す、なお、使用したヘッドは
Mn−Znフェライトヘッドである。
A C8S test was conducted on the above four types of magnetic disks. The results are shown in Table 1. The head used was a Mn--Zn ferrite head.

(第  1  表  ) 注 μに:動摩擦係数 り、c、:ヘッドクラッシュ(head crash)
awe :平均値、iax:fi大値 この第1表から、本発明の薄膜磁気ディスクの方が、従
来例(比較例)よりも動摩擦係数μkが小さく、しかも
C8S回数を大幅に増加しても長期に互って安定してお
り、高耐久性を持っていることがわかる。その理由は、
第2図及び第3図から明らかなように、ディスクがほぼ
均一な表面粗さを持ち、均一な高さの表面突起を円周方
向に連続して多数形成させたことにより、最適な表面形
状が得られたことによるものである。第4図の比較例に
見られるような、表面突起がなく凹部が殆どである磁気
ディスクでは、次第に動摩擦係数が上昇し、膜(下地金
属層2.更には磁性層3)の破壊が起こる。又、第5図
の比較例に見られるような500Å以上の高い凸部がラ
ンダムに形成された磁気ディスクは、表面突起によりヘ
ッドクラッシュが生じ易く、寿命は短いことが見受けら
れる。
(Table 1) Note μ: Dynamic friction coefficient, c: Head crash
awe: average value, iax: fi large value From Table 1, it can be seen that the thin film magnetic disk of the present invention has a smaller dynamic friction coefficient μk than the conventional example (comparative example), and even when the number of C8S is significantly increased. It can be seen that they are stable over a long period of time and have high durability. The reason is,
As is clear from Figures 2 and 3, the disk has a nearly uniform surface roughness and a large number of surface protrusions of uniform height are continuously formed in the circumferential direction, resulting in an optimal surface shape. This is due to the fact that it was obtained. In a magnetic disk that has no surface protrusions and has mostly recesses, such as the comparative example shown in FIG. 4, the coefficient of dynamic friction gradually increases, causing destruction of the film (underlying metal layer 2 and furthermore, magnetic layer 3). Furthermore, a magnetic disk in which high protrusions of 500 Å or more are randomly formed, such as the comparative example shown in FIG. 5, is likely to cause head crashes due to surface protrusions, and appears to have a short lifespan.

〔効 果〕〔effect〕

以上説明したように、本発明の薄膜磁気ディスク及びそ
の製造方法によれば、ディスクの表面粗さを均一にでき
、そのため動摩擦係数が小さくなり、ディスク、ヘッド
間の貼着きゃクラッシュが起り難くなり、寿命は大幅に
増加し、耐久性及び信頼性が格段に向上するという優れ
た特長を有する。
As explained above, according to the thin-film magnetic disk and its manufacturing method of the present invention, the surface roughness of the disk can be made uniform, and therefore the coefficient of dynamic friction is reduced, making it difficult to cause sticking between the disk and the head and a crash. It has excellent features such as significantly increased lifespan, significantly improved durability and reliability.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の薄膜磁気ディスクの一実施例の拡大部
分断面図、第2図及び第3図は本発明になる薄膜磁気デ
ィスクの第1.第2実施例の半径方向の表面形状を示す
断面図、第4図及び第5図は第1.第2比較例の薄膜磁
気ディスクの半径方向の表面形状を示す断面図である。 1・・・NIP基板、2・・・下地金属層、4・・・保
護層、5・・・潤滑層。 3・・・磁性層、 特許出願人  日本ビクター株式会社 代表者  埋木 邦人 手続補正書(自発) 平成2年1月6日 1、事件の表示 平成1年特許願第34166号 2、発明の名称 薄膜磁気ディスク及びその製造方法 3、補正をする者 事件との関係  特許出願人 住所 神奈川県横浜市神奈用区守屋町 3丁目12番地 4、補正命令の日付 自発補正 5、補正の対象 (1)明細書第5頁第2行の「ディスク」を「ディスク
」と補正する。 (2)同、第7頁第7行の「説明する。」の後に、次の
字句を挿入する。 「なお、第2図乃至第5図に示す磁気ディスクの表面形
状の測定は、タリステップ(ランクテーラーホブソン社
、触針形状0.IX2.5μm)を用いて行なったもの
である。」 43)第2図乃至第5図を別紙補正図面のように補正す
る。
FIG. 1 is an enlarged partial cross-sectional view of one embodiment of the thin-film magnetic disk of the present invention, and FIGS. 2 and 3 show a first embodiment of the thin-film magnetic disk of the present invention. 4 and 5 are cross-sectional views showing the radial surface shape of the second embodiment. FIG. 7 is a cross-sectional view showing the radial surface shape of a thin film magnetic disk of a second comparative example. DESCRIPTION OF SYMBOLS 1...NIP board, 2... Base metal layer, 4... Protective layer, 5... Lubricating layer. 3...Magnetic layer, Patent applicant Representative of Victor Japan Co., Ltd. Umiki Japanese Procedural Amendment (voluntary) January 6, 1990 1. Display of the case 1999 Patent Application No. 34166 2. Name of the invention Thin film Magnetic disks and their manufacturing method 3, Relationship with the person making the amendment Patent applicant address 3-12-4 Moriya-cho, Kanayō-ku, Yokohama-shi, Kanagawa Prefecture Date of amendment order Voluntary amendment 5 Subject of amendment (1) Details "Disc" in the second line of page 5 of the book is corrected to "disk". (2) Insert the following phrase after "I will explain." on page 7, line 7. ``The measurements of the surface shapes of the magnetic disks shown in Figures 2 to 5 were carried out using a Talystep (Rank Taylor Hobson Co., Ltd., stylus shape 0.IX 2.5 μm).'' 43) Figures 2 to 5 are corrected as shown in the attached corrected drawings.

Claims (2)

【特許請求の範囲】[Claims] (1)無電解Ni合金鍍金と、研磨砥粒での研磨加工と
を施されたのち高周波スパッタエッチを施されたAl基
板と、スパッタリング法により形成された下地金属層及
び磁性層とを少なくとも有し、上記研磨加工時に生じる
傷とその両端の加工変質部における下地金属層の成長を
利用して、円周方向に、高さ約200〜400Åで半径
方向の断面長密度が30本/mm以上の連続した均一な
表面突起を形成されて作製されることを特徴とする薄膜
磁気ディスク。
(1) It has at least an Al substrate that has been subjected to electroless Ni alloy plating, polishing with abrasive grains, and high-frequency sputter etching, and a base metal layer and a magnetic layer formed by sputtering. However, by utilizing the scratches generated during the polishing process and the growth of the base metal layer in the process-altered parts at both ends, the cross-sectional length density in the radial direction is approximately 200 to 400 Å in height and 30 lines/mm or more in the circumferential direction. A thin film magnetic disk characterized in that it is manufactured by forming continuous and uniform surface protrusions.
(2)無電解Ni合金鍍金を施したAl基板に、研磨砥
粒で同心円状の研磨加工を施し、次いで高周波スパッタ
リング法によつてエッチングを行なつた後、スパッタリ
ング法により少なくとも下地金属層及び磁性層を形成し
、上記同心円状の研磨加工時に生じる傷とその両端の加
工変質部における下地金属層の成長を利用して円周方向
に連続した均一な表面突起を形成することを特徴とする
薄膜磁気ディスクの製造方法。
(2) An Al substrate plated with an electroless Ni alloy is polished concentrically with abrasive grains, then etched by a high frequency sputtering method, and then at least the base metal layer and the magnetic layer are etched by a sputtering method. A thin film characterized in that it forms uniform surface protrusions that are continuous in the circumferential direction by using the scratches that occur during the concentric polishing process and the growth of the base metal layer in the process-altered parts at both ends of the scratches. A method of manufacturing magnetic disks.
JP3416689A 1989-02-14 1989-02-14 Thin-film magnetic disk and production thereof Pending JPH02214014A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3416689A JPH02214014A (en) 1989-02-14 1989-02-14 Thin-film magnetic disk and production thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3416689A JPH02214014A (en) 1989-02-14 1989-02-14 Thin-film magnetic disk and production thereof

Publications (1)

Publication Number Publication Date
JPH02214014A true JPH02214014A (en) 1990-08-27

Family

ID=12406625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3416689A Pending JPH02214014A (en) 1989-02-14 1989-02-14 Thin-film magnetic disk and production thereof

Country Status (1)

Country Link
JP (1) JPH02214014A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5939170A (en) * 1993-12-28 1999-08-17 Hoya Corporation Magnetic recording medium

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5939170A (en) * 1993-12-28 1999-08-17 Hoya Corporation Magnetic recording medium

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