JPH022094A - Electronic equipment - Google Patents
Electronic equipmentInfo
- Publication number
- JPH022094A JPH022094A JP63143760A JP14376088A JPH022094A JP H022094 A JPH022094 A JP H022094A JP 63143760 A JP63143760 A JP 63143760A JP 14376088 A JP14376088 A JP 14376088A JP H022094 A JPH022094 A JP H022094A
- Authority
- JP
- Japan
- Prior art keywords
- card
- circuit
- electronic device
- ground
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000006378 damage Effects 0.000 abstract description 9
- 230000005611 electricity Effects 0.000 abstract description 8
- 230000003068 static effect Effects 0.000 abstract description 8
- 210000004907 gland Anatomy 0.000 abstract 4
- 230000007257 malfunction Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は電子機器に関ν、特にICカードなどの増設回
路収納体をコネクタを介し挿抜自在に装着、接続して用
いる電子機器に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to electronic equipment, and in particular to electronic equipment in which an additional circuit storage body such as an IC card is attached and connected to and removed from the connector via a connector. be.
[従来の技術]
この種の電子機器として、パーソナルコンピュータやコ
ンピュータ応用の各種の電子機器では、例えばメモリ回
路と同回路の接続用コネクタをカード状収納体に収納し
てなるメモリカードなどのICカードを挿抜自在に装着
、接続して用いる構造が広く採用されている。この種の
電子機器でICカードを装着、接続して使用する際には
、ICカードと電子機器本体の回路の電位の基準レベル
(一般にグランドとかアースとか呼ばれるが以下グラン
ドと呼ぶ)を合せてから信号のやりとりを行なわないと
データ破壊や誤動作につながる。このため電子機器本体
側のコネクタとICカードのコネクタのグランドのピン
を他のピンより長くし、ICカードの挿入時にはグラン
ドピンとうじが他のピンどうしよりも早く接続され、I
Cカードの抜脱時には他のピンの接続が外れてからグラ
ンドとンどうしの接続が外れるようにした構造が採用さ
れている。[Prior Art] As this type of electronic equipment, in personal computers and various electronic equipment applied to computers, there are, for example, IC cards such as memory cards in which a memory circuit and a connector for connecting the same circuit are housed in a card-like storage body. A structure in which devices are inserted and connected in a manner that allows them to be inserted and removed has been widely adopted. When installing, connecting, and using an IC card in this type of electronic device, make sure to match the reference level (generally called ground or earth, hereinafter referred to as ground) of the potential of the IC card and the circuit of the electronic device itself. Failure to exchange signals may lead to data destruction or malfunction. For this reason, the ground pin of the connector on the electronic device side and the IC card connector is made longer than other pins, and when the IC card is inserted, the ground pin and the maggot are connected earlier than the other pins, and the I
When the C card is removed or removed, a structure is adopted in which the ground pins are disconnected after the other pins are disconnected.
[発明が解決しようとする課題]
ところがこのような構造ではコネクタの構造が複雑にな
り高価になってしまう。またそれぞれのコネクタのグラ
ンドピンの位置が制限され、設計の自由度が制限される
という問題がある。[Problems to be Solved by the Invention] However, with such a structure, the structure of the connector becomes complicated and expensive. Further, there is a problem in that the position of the ground pin of each connector is restricted, and the degree of freedom in design is restricted.
一方、ICカードでは外装がアルミなどの導電性材料か
ら構成されたものがあり、この場合静電破壊の防止など
のために外装はカード内の回路のグランドパターンと接
続される。ところがこのようなICカードを電子機器に
装着した状態でICカードの外装に静電気が印加される
と、ICカードの外装からそれぞれのコネクタのグラン
ドピンと電子機器本体の回路のグランドパターンを介し
電子機器本体の筺体グランドへ電流が流れるため、電子
機器本体の回路とICカードの回路のグランド電位が変
動し、データ破壊や回路の誤動作につながる恐れがある
。On the other hand, some IC cards have an exterior made of a conductive material such as aluminum, and in this case, the exterior is connected to the ground pattern of the circuit inside the card to prevent electrostatic damage. However, if static electricity is applied to the exterior of the IC card while such an IC card is attached to an electronic device, it will be transferred from the exterior of the IC card to the electronic device itself via the ground pins of each connector and the ground pattern of the circuit of the electronic device itself. Since current flows to the chassis ground of the electronic device, the ground potential of the circuit of the electronic device and the circuit of the IC card fluctuate, which may lead to data destruction or circuit malfunction.
本発明の課題はこのような問題を解決することにある。An object of the present invention is to solve such problems.
[課題を解決するための手段]
本発明においては上述した課題を解決するために、導電
性の外装を有する増設回路収納体をコネクタを介し挿抜
自在に装着、接続して用いる電子m器において、該電子
機器の前記収納体装着部で前記収納体を挿抜する経路の
前記収納体接続用コネクタより外側の位置で前記収納体
の外装が電子機器の筺体グランドに対し直接に接続され
るように構成した。[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention provides an electronic device in which an additional circuit storage body having a conductive exterior is detachably attached and connected via a connector. The exterior of the storage body is configured to be directly connected to the casing ground of the electronic device at a position outside of the storage body connection connector on the path for inserting and removing the storage body in the storage body mounting portion of the electronic device. did.
[作 用]
このような構造によれば、増設回路収納体の電子m器に
対する挿入時には、コネクタどうしが接続される前に収
納体の外装が電子機器の筺体グランドに接続されること
により、電子機器本体の回路と増設回路収納体の回路の
グランドが接続される。また増設回路収納体の抜脱時に
はコネクタどうしの接続が外れてから収納体の外装と電
子機器の筺体グランドの接続が外れ、電子機器本体の回
路のグランドと増設回路収納体の回路のグランドの接続
が外れる。また増設回路収納体を電子機器に装着した状
態で増設回路収納体の外装に静電気が印加された場合に
は、静電気による電流は収納体の外装から電子機器の筺
体グランドに直接流れる。[Function] According to such a structure, when the expansion circuit housing is inserted into an electronic device, the exterior of the housing is connected to the electronic device's case ground before the connectors are connected to each other. The circuit of the main body of the device and the ground of the circuit of the expansion circuit housing are connected. Also, when removing the expansion circuit housing, the connectors are disconnected from each other, the housing's exterior and the electronic device's casing ground are disconnected, and the circuit ground of the electronic device itself is connected to the circuit ground of the expansion circuit housing. comes off. Furthermore, if static electricity is applied to the exterior of the additional circuit housing while the additional circuit housing is attached to an electronic device, the current due to the static electricity flows directly from the exterior of the housing to the ground of the electronic device's casing.
[実施例]
以下、図面に示す実施例に基づいて本発明の詳細な説明
する。[Example] Hereinafter, the present invention will be described in detail based on the example shown in the drawings.
第1図および第2図はそれぞれ本発明の実施例による電
子機器のICカード装着部とICカードの構造を説明す
る縦断側面図と横断平面図であり、両図の左側に電子機
器のICカード装着部を示し右側にICカードを示しで
ある。FIG. 1 and FIG. 2 are a vertical side view and a cross-sectional plan view, respectively, illustrating the structure of an IC card mounting part and an IC card of an electronic device according to an embodiment of the present invention. The mounting part is shown, and the IC card is shown on the right side.
電子機器のICカード装着部の構造において、まず符号
1は電子機器本体の外装であり、この外装置の図示した
部分にはICカードを挿入するための開口部1aが形成
されている。開口部1aの奥側にはICカードを挿抜す
るとともに収容する筒状の通路1bが外装置に一体に形
成されている。通路1bの中間部の上下には開口部1c
。In the structure of an IC card mounting portion of an electronic device, reference numeral 1 denotes the exterior of the main body of the electronic device, and an opening 1a for inserting an IC card is formed in the illustrated portion of the outer device. On the back side of the opening 1a, a cylindrical passage 1b for inserting and removing an IC card and accommodating the IC card is formed integrally with the outer device. There are openings 1c above and below the middle part of the passage 1b.
.
1dが形成されている。1d is formed.
そして通路1bの奥にはICカードを着脱自在に接続す
るためのコネクタ3が設けられている。A connector 3 for removably connecting an IC card is provided at the back of the passage 1b.
コネクタ3は電子機器本体の回路を構成するプリント基
板4の端部上に固定されている。そして第2図に示すコ
ネクタ3の両端のグランドピン3a、3bはプリント基
板4上に形成された電子回路のグランドパターン5に接
続されている。The connector 3 is fixed onto an end of a printed circuit board 4 that constitutes a circuit of the main body of the electronic device. Ground pins 3a and 3b at both ends of the connector 3 shown in FIG. 2 are connected to a ground pattern 5 of an electronic circuit formed on a printed circuit board 4.
一方、プリント基板4は電子機器本体の筺体グランドと
して導電材料からなるシャーシ2に切り起されたL字型
の支持部2c上にビス6により締め付けて固定されてい
る。ビス6は導電性のものでグランドパターン5の上か
らシャーシ2の支持部2Cに締め付けられる。すなわち
グランドパターン5はビス6を介して筺体グランドとし
てのシャーシ2に接続される。On the other hand, the printed circuit board 4 is fastened with screws 6 onto an L-shaped support portion 2c cut and raised in the chassis 2 made of a conductive material as a casing ground of the main body of the electronic device. The screws 6 are conductive and are tightened onto the support portion 2C of the chassis 2 from above the ground pattern 5. That is, the ground pattern 5 is connected via the screw 6 to the chassis 2 as a case ground.
一方、シャーシ2には本発明に関わる構造として、後述
のようにICカードの外装をシャーシ2の筺体グランド
に直接接続するためのほぼへの字形に屈曲された突片状
の接続部2a、2bが形成されている。接続部2a、2
bはそれぞれ通路1bの中間部の上下に形成された開口
部1c。On the other hand, as a structure related to the present invention, the chassis 2 has connection parts 2a and 2b in the form of protrusions bent into an approximately U-shape for directly connecting the exterior of the IC card to the chassis ground of the chassis 2, as described later. is formed. Connection part 2a, 2
b are openings 1c formed above and below the middle part of the passage 1b, respectively.
1dのそれぞれを介して通路1b内に臨むようにして設
けられている。そして接続部2a、2bは後述するよう
に装着されるICカードの外装に対して弾性的に圧接す
るようになっている。1d so as to face the inside of the passage 1b. The connecting portions 2a and 2b are adapted to come into elastic pressure contact with the outer casing of the IC card to be mounted, as will be described later.
一方、両図に符号10で示すICカードの構造はICカ
ードの電子回路を実装したプリント基板14と同回路の
接続用コネクタ13をプラスチックのモールドからなる
フレーム11により支持したものを外装置2内に固定し
たものとなっている。外装置2はこの場合アルミなどの
導電性の会所からなるものとする。なおプリント基板1
4上の回路のグランドパターン15は導電性のコイルス
プリング16を介して外装置2に接続されるようになっ
ている。なお符号13a、13bはグランドビンである
。On the other hand, the structure of the IC card shown by reference numeral 10 in both figures is such that a printed circuit board 14 on which an electronic circuit of the IC card is mounted and a connector 13 for connecting the same circuit are supported by a frame 11 made of plastic mold, and are mounted inside an external device 2. It is fixed to . In this case, the outer device 2 is made of a conductive material such as aluminum. Furthermore, printed circuit board 1
A ground pattern 15 of the circuit above 4 is connected to the external device 2 via a conductive coil spring 16. Note that reference numerals 13a and 13b are ground bins.
このような構造の下にICカード10の装着時には、矢
印で示すようにICカード10を電子機器の外装置の開
口部1aから通路1bに挿入し、コネクタ13をコネク
タ3に差し込み、嵌着させ接続させる。この際にコネク
タ3.13どうしが接続される前にコネクタ3より外側
にある接続部2a、2bがICカード10の外装置2に
圧接し外装置2がシャーシ2に接続される。すなわち電
子機器本体の筺体グランドに直接接続され、これにより
ICカード10の回路と電子機器本体側の回路のグラン
ドパターン5.15どうしが接続される。When installing the IC card 10 under such a structure, the IC card 10 is inserted into the passage 1b from the opening 1a of the external device of the electronic device as shown by the arrow, the connector 13 is inserted into the connector 3, and the connector 3 is fitted. Connect. At this time, before the connectors 3 and 13 are connected to each other, the connecting portions 2a and 2b located outside the connector 3 are pressed into contact with the outer device 2 of the IC card 10, and the outer device 2 is connected to the chassis 2. That is, it is directly connected to the casing ground of the electronic device main body, thereby connecting the circuit of the IC card 10 and the ground patterns 5.15 of the circuit on the electronic device main body side.
またICカード10の抜脱時にはICカード10の後端
部をつかんで強く引くことにより、コネクタ3.13ど
うしの嵌着が外れICカード10を引き出すことができ
る。この際にコネクタ3.13どうしの嵌着が外れコネ
クタ3,13どうじの接続が外れた時点では接続部2a
、2bが外装置2に圧接しており、外装置2とシャーシ
2の接続によりICカード10の回路のグランドと電子
機器本体の回路のグランドが接続されている。コネクタ
3.13どうしの接続が外れた後に両回路のグランドの
接続が外れることになる。Furthermore, when removing the IC card 10, by grasping the rear end of the IC card 10 and pulling strongly, the connectors 3 and 13 are disengaged and the IC card 10 can be pulled out. At this time, when the connectors 3 and 13 are unfitted and the connectors 3 and 13 are disconnected, the connecting portion 2a
, 2b are in pressure contact with the external device 2, and the connection between the external device 2 and the chassis 2 connects the circuit ground of the IC card 10 and the circuit ground of the main body of the electronic device. After the connectors 3.13 are disconnected, the ground connections of both circuits will be disconnected.
このようにICカード10の挿入時にはコネクタ3.1
3の接続の前にグランドが接続され、抜脱時にはコネク
タ3.13の接続が外れた後にグランドの接続が外れる
ので、先述したデータ破壊や誤動作を防止することがで
きる。In this way, when inserting the IC card 10, the connector 3.1
The ground is connected before the connection of the connector 3.3, and the ground is disconnected after the connector 3.13 is disconnected at the time of disconnection, so that the data destruction and malfunction described above can be prevented.
またICカード10を電子機器に装着した状態では、外
装置2が接続部2a、2bの圧接により電子機器本体の
筺体グランドに直接に接続されているので、外装置2に
静電気が印加された場合静電気による電流は外装置2か
らコネクタ3.13のグランドピンを介さずに直接にシ
ャーシ2に流れる。このためICカード10の回路のグ
ランドの電位変化が少なく、データ破壊や誤動作を防止
することができる。In addition, when the IC card 10 is attached to an electronic device, the external device 2 is directly connected to the casing ground of the electronic device by pressure contact between the connecting parts 2a and 2b, so if static electricity is applied to the external device 2, A current due to static electricity flows directly from the external device 2 to the chassis 2 without going through the ground pin of the connector 3.13. Therefore, there is little change in the ground potential of the circuit of the IC card 10, and data destruction and malfunction can be prevented.
また本実施例によればICカード10の挿抜時のグラン
ドの接続が上述のようになされるので、コネクタ3.1
3のグランドビン3a、3bおよび13a、13bを他
のビンより長くせずに済み、グランドピンの配置を自由
に設定でき、設計の自由度が得られる。Further, according to this embodiment, since the ground connection is made as described above when inserting and removing the IC card 10, the connector 3.1
There is no need to make the three ground bins 3a, 3b and 13a, 13b longer than the other bins, the arrangement of the ground pins can be set freely, and a degree of freedom in design can be obtained.
[発明の効果]
以上の説明から明らかなように、本発明によれば、導電
性の外装を有する増設回路収納体をコネクタを介し挿抜
自在に装着、接続して用いる電子機器において、該電子
機器の前記収納体装着部で前記収納体を挿抜する経路の
前記収納体接続用コネクタより外側の位置で前記収納体
の外装が電子機器の筺体グランドに対し直接に接続され
るように構成したので、増設回路収納体の挿抜時、およ
び装着状態で収納体に静電気が印加された場合のデータ
破壊および回路の誤動作を防止できるとともに、収納体
のコネクタと電子機器側のコネクタのピン配置に関して
設計の自由度が得られるという優れた効果が得られる。[Effects of the Invention] As is clear from the above description, according to the present invention, in an electronic device in which an additional circuit housing having a conductive exterior is detachably attached and connected via a connector, the electronic device Since the exterior of the storage body is configured to be directly connected to the casing ground of the electronic device at a position outside the storage body connection connector on the path for inserting and removing the storage body in the storage body mounting portion of the electronic device, Data destruction and circuit malfunctions can be prevented when static electricity is applied to the expansion circuit enclosure when it is inserted or removed, or when static electricity is applied to the enclosure while it is attached.It also allows for freedom in design regarding the pin arrangement of the enclosure's connector and the connector on the electronic equipment side. An excellent effect of increasing the degree of strength can be obtained.
第1図は本発明の実施例による電子機器のrcカード装
着部とICカードの構造を示す縦断側面図、第2図は同
装着部とICカードの横断平面図である。
1・・・外装 2・・・シャーシ2a、2b
・・・接続部 3.13・・・コネクタ4.14・・・
プリント基板
5.15・・・グランドパターン
10・・・ICカード 11・・・フレーム12・・
・導電性の外装
置6・・・コイルスプリングFIG. 1 is a longitudinal sectional side view showing the structure of an RC card mounting section and an IC card of an electronic device according to an embodiment of the present invention, and FIG. 2 is a transverse plan view of the same mounting section and IC card. 1...Exterior 2...Chassis 2a, 2b
... Connection part 3.13 ... Connector 4.14 ...
Printed circuit board 5.15...Ground pattern 10...IC card 11...Frame 12...
・Conductive outer device 6...Coil spring
Claims (1)
介し挿抜自在に装着、接続して用いる電子機器において
、該電子機器の前記収納体装着部で前記収納体を挿抜す
る経路の前記収納体接続用コネクタより外側の位置で前
記収納体の外装が電子機器の筺体グランドに対し直接に
接続されるように構成したことを特徴とする電子機器。1) In an electronic device that is used by attaching and connecting an additional circuit housing having a conductive exterior so as to be freely inserted and removed via a connector, the housing is connected to the housing in a path for inserting and removing the housing at the housing mounting portion of the electronic device. An electronic device characterized in that the exterior of the storage body is directly connected to a casing ground of the electronic device at a position outside the connection connector.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63143760A JPH022094A (en) | 1988-06-13 | 1988-06-13 | Electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63143760A JPH022094A (en) | 1988-06-13 | 1988-06-13 | Electronic equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH022094A true JPH022094A (en) | 1990-01-08 |
Family
ID=15346386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63143760A Pending JPH022094A (en) | 1988-06-13 | 1988-06-13 | Electronic equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH022094A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4950361A (en) * | 1988-09-15 | 1990-08-21 | Quaker Chemical Corporation | Process for controlling pitch deposits in the pulp and papermaking processes with zirconium (IV) compound |
JPH0410295A (en) * | 1990-04-26 | 1992-01-14 | Mitsubishi Electric Corp | Portable semiconductor memory |
JPH0410296A (en) * | 1990-04-26 | 1992-01-14 | Mitsubishi Electric Corp | Portable semiconductor memory |
JPH0428083A (en) * | 1990-05-24 | 1992-01-30 | Mitsubishi Electric Corp | Portable semiconductor storage device |
JPH0728966A (en) * | 1991-09-11 | 1995-01-31 | Itt Corp | Memory-card earthing device |
-
1988
- 1988-06-13 JP JP63143760A patent/JPH022094A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4950361A (en) * | 1988-09-15 | 1990-08-21 | Quaker Chemical Corporation | Process for controlling pitch deposits in the pulp and papermaking processes with zirconium (IV) compound |
JPH0410295A (en) * | 1990-04-26 | 1992-01-14 | Mitsubishi Electric Corp | Portable semiconductor memory |
JPH0410296A (en) * | 1990-04-26 | 1992-01-14 | Mitsubishi Electric Corp | Portable semiconductor memory |
JPH0428083A (en) * | 1990-05-24 | 1992-01-30 | Mitsubishi Electric Corp | Portable semiconductor storage device |
JPH0728966A (en) * | 1991-09-11 | 1995-01-31 | Itt Corp | Memory-card earthing device |
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