JPH02208997A - Printed board - Google Patents

Abstract

PURPOSE:To obtain a printed board, in which the electrodes of a chip component and a copper foil pattern are prevented from being shortcircuited to each other, by a method wherein a solder bank land is provided to a part where the electrode of the chip component is not opposed to the solder bank land, where the said part is a part of a region where the chip component is opposed to the printed board. CONSTITUTION:A pair of component lands 12 is provided separate from each other on a printed board 11 and two or more rows of copper patterns 13 are provided between the lands 12, and solder bank lands 17 are provided to a part on the inner edge side of the lands 12, where electrodes 15 of a chip Al capacitor 14 are not opposed to the lands 17. And, an electrode 15 is fixed to each of the lands 12 with a solder 16. In the board 11 of this structure, when the capacitor 14 is soldered to the side of the board 11 through reflow or the like, cream solder is previously printed on the lands 17. By this setup, the solder 16 rises on the lands 17 when it is heated at reflow, and the capacitor 14 is fixed separate from the surface of the board 11 when the solder is cooled down. Therefore, an enough space can be secured between the patterns provided between the lands 12 and the electrodes 15.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a printed circuit board to which chip components are soldered.

<Prior Art> Conventionally, when a chip 81 capacitor is soldered to a printed circuit board, it is constructed as shown in FIG. In other words, component land 2W on printed circuit board 1! A copper foil pattern 3 is provided on J, and an electrode 5 of one capacitor 4 is soldered 6 to the component land 2 for a chip placed on the upper surface thereof.

<Problems to be Solved by the Invention> However, in the conventional example described above, since the spacing between the electrodes 50 provided on the bottom surface of the A1 capacitor 4 is narrow, when the copper foil pattern 3 is provided on the two component lands, the solder 6 is attached later. An electrical short may occur between the electrode 5 and the copper foil pattern 3. In order to prevent this, measures such as applying silk printing ink on the rJAD pattern 3 to ensure insulation have been taken, but this has resulted in an increase in cost.

SUMMARY OF THE INVENTION An object of the present invention is to provide a printed circuit board that eliminates the drawbacks of the prior art and prevents electrical shorts between the electrodes of chip components and the copper foil pattern.

Means for Solving the Problems> In order to achieve the above object, the present invention provides a solder pool land in a region facing the chip component on a printed circuit board but not facing the electrode of the chip component. be.

<Function> The printed circuit board configured as described above uses the solder in the solder pool lands to lift the chip components above the printed circuit board surface, and prevents electrical shorts by widening the distance between the copper foil pattern and the electrode provided between the component lands. do.

<Example> An example of the present invention will be described below with reference to FIGS. 1 and 2.

Reference numeral 11 denotes a printed circuit board, on its upper surface, a pair of component lands 12 are formed with a plurality of rows of copper foil patterns 13 between the component lands 12, and a chip A1 capacitor 14 on the inner edge side of the component land 12 is formed. A solder pool land 17 is provided in a portion not facing the electrode 15. And this is the printed circuit board.

In the printed circuit board 11 having the above configuration, when the capacitor 14 to the chip is soldered to the printed circuit board surface by means such as reflow, a creamy solder is also applied to the solder pool land 17 so that the reflow heating is performed. At this point, the solder 16 bulges on the solder pool 17, and during cooling, the chip A1 capacitor 14 is fixed in a state raised from the surface of the printed circuit board 11. Therefore, a sufficient distance is ensured between the copper foil pattern 13 provided on the component land 12IISl and the electrode 15.

FIG. 3 shows another embodiment of the invention.

To simplify the explanation, the same parts as in the previous embodiment are given the same reference numerals, and only the different points will be explained.

In this practical example, the solder pool land 17 on the printed circuit board 11
A chip A1 capacitor 14, which is a chip component facing the
A foot 18 is formed with a recess 18a on the bottom side. The other configurations are the same as those of the previous embodiment.

In this embodiment, when soldering, the convex part formed by the solder 16 formed in the solder pool land 17 and the concave part 18a on the bottom side of the deep A1 capacitor 14 match due to the effect of self-alignment, and the chip A1 capacitor 14 is printed. Not only can it be lifted above the surface of the substrate 11, but it can also be effectively aligned in the lateral direction.

<Effects of the Invention> As explained above, the present invention can increase manufacturing costs by providing a solder pool land in a region of a printed circuit board facing a chip component but not facing an electrode of a chip component. This has the effect that a copper foil pattern can be provided between component lands to prevent electrical short-circuiting with the electrodes of the chip component.

Further, there is an effect that it is possible to restrict lateral positional deviation of the chip component.

[Brief explanation of the drawing]

Fig. 1 is a side view of a printed circuit board according to an embodiment of the present invention, Fig. 2 is a plan view thereof, Fig. 3 is a sectional view of main parts of another embodiment of the invention, and Fig. 4 is a conventional example. FIG. 3 is a side view of the printed circuit board. 11... Printed circuit board, 12... Component land, 13
...Copper foil pattern, 14...Chip A1 capacitor (
chip parts), 15...electrode, 16...solder, 17
...Solder pool land, 18...leg, 18a...recess. Original 1 = Figure 2

Claims (1)

[Claims] 1. A printed circuit board characterized in that a solder pool land is provided in a region facing a chip component on the printed circuit board but not facing an electrode of the chip component.