JPH02208908A - Inductance element and manufacture thereof - Google Patents
Inductance element and manufacture thereofInfo
- Publication number
- JPH02208908A JPH02208908A JP3065189A JP3065189A JPH02208908A JP H02208908 A JPH02208908 A JP H02208908A JP 3065189 A JP3065189 A JP 3065189A JP 3065189 A JP3065189 A JP 3065189A JP H02208908 A JPH02208908 A JP H02208908A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- resin
- magnetic powder
- inductance
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 229920005989 resin Polymers 0.000 claims abstract description 54
- 239000011347 resin Substances 0.000 claims abstract description 54
- 239000006247 magnetic powder Substances 0.000 claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 abstract description 25
- 238000004804 winding Methods 0.000 abstract description 7
- 230000035699 permeability Effects 0.000 abstract description 6
- 229910000859 α-Fe Inorganic materials 0.000 abstract description 6
- 230000010355 oscillation Effects 0.000 abstract 1
- 230000008901 benefit Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000012254 powdered material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
東策上圀科里分団
本発明は、磁気シールドが要求されるインダクタンス素
子、例えばシールド型チップコイル、シールド型ＥＭＩ
（電磁干渉）フィルタ等に関する。[Detailed Description of the Invention] Tosaku Kamikokushinari Branch The present invention is applicable to inductance elements that require magnetic shielding, such as shielded chip coils, shielded EMI
(Electromagnetic interference) Regarding filters, etc.
従来の技術と課題
従来、この種のインダクタンス素子としては巻線が巻き
回された素体の周囲を磁気シールド材で覆うことによっ
て閉磁路を構成する様にしたものが一般的である。素体
の周囲を磁気シールド材で覆う方法としては、例えばデ
イツプ法、モールド法、貼り合わせ法が知られている。BACKGROUND TECHNOLOGY AND PROBLEMS Conventionally, this type of inductance element has generally been constructed in such a way that a closed magnetic circuit is formed by covering an element body around which a winding is wound with a magnetic shielding material. As a method of covering the periphery of the element with a magnetic shielding material, for example, a dip method, a mold method, and a bonding method are known.
デイツプ法は、巻線が巻き回された、例えば、チップコ
イルの素体を磁性体粉末入り樹脂液に浸漬して素体表面
に樹脂液を付着させて磁性体粉末を含浸した磁気シール
ド樹脂体を素体表面に形成し、素体と磁気シールド樹脂
体で閉磁路を構成する方法である。この方法は、製造コ
ストが安価であるという利点を有するが、素体に付着し
た樹脂液を硬化させる際に磁性体粉末が局部的に偏析す
る現象が生じる。そのため、磁気シールド樹脂体の透磁
率が一様でなく、ばらつきが生じる。また、樹脂硬化後
の磁気シールド樹脂体の形成厚みが不均一になるため、
磁気シールド樹脂体が構成する閉磁路の磁路断面積にも
ばらつきが生ずる。この様に、磁気シールド樹脂体の透
磁率及び磁路断面積にばらつきが生じるためチップコイ
ルのインダクタンスＬの数値のばらつきが大きいという
問題点がある。The dip method uses a magnetic shielding resin body in which a winding wire is wound, for example, a chip coil element, which is impregnated with magnetic powder by immersing the element body in a resin liquid containing magnetic powder to adhere the resin liquid to the element surface. is formed on the surface of the element, and a closed magnetic path is formed between the element and the magnetic shielding resin. Although this method has the advantage of low manufacturing cost, a phenomenon occurs in which the magnetic powder is locally segregated when the resin liquid adhering to the element body is cured. Therefore, the magnetic permeability of the magnetic shielding resin body is not uniform, and variations occur. In addition, since the formed thickness of the magnetic shield resin body after resin curing becomes uneven,
Variations also occur in the magnetic path cross-sectional area of the closed magnetic path formed by the magnetic shielding resin body. As described above, there is a problem in that the magnetic permeability and magnetic path cross-sectional area of the magnetic shield resin body vary, so that the value of the inductance L of the chip coil varies greatly.
また、モールド法は、巻線が巻き回されたチップコイル
の素体を成形型に入れ、磁性体粉末入り溶融樹脂を成形
型内に充填し、磁気シールド樹脂体で素体をモールドし
、素体とモールド樹脂体で閉磁路を構成する方法である
。この方法は、磁気シールド樹脂体の成形厚みが均一で
あるという利点を有するが、製造コストが比較的高価で
あって、かつ、樹脂を硬化させる際に磁性体粉末が局部
的に偏析する現象が生じる。従って、デイツプ法と比較
すると、インダクタンスＬの数値のばらつきは小さいも
のの優れた電気特性とは言い難いものであった。しかも
、磁性体粉末入り樹脂をモールドする場合、柔軟性のあ
る樹脂が使えないため、樹Ｊ＠硬化の際の樹脂収縮によ
ってインダクタンスＬの数値が小さくなり、その後の経
時変化として湿度による樹脂膨張が生じ、インダクタン
スＬの値は逆に大きくなる（数値で約５０％アップ、ば
らつきは±２０％）という問題点がある。In addition, the molding method involves placing the chip coil element with the winding wound around it into a mold, filling the mold with molten resin containing magnetic powder, and molding the element with a magnetic shielding resin. This is a method in which a closed magnetic circuit is constructed using a body and a molded resin body. This method has the advantage that the molded thickness of the magnetic shielding resin body is uniform, but the manufacturing cost is relatively high and the magnetic powder is locally segregated when the resin is cured. arise. Therefore, compared to the dip method, although the variation in the numerical value of the inductance L is small, it is hard to say that it has excellent electrical characteristics. Moreover, when molding resin containing magnetic powder, flexible resin cannot be used, so the value of inductance L decreases due to resin contraction during curing, and the resin expands due to humidity as a subsequent change over time. There is a problem in that the value of the inductance L becomes larger (approximately 50% increase in numerical value, variation is ±20%).
さらに、貼り合わせ法は、巻線が巻き回されたチップコ
イルの素体をフェライトコア等で作られた焼結外枠体に
嵌め込み接着剤で固着し、素体と焼結外枠体とで閉磁路
を構成する方法である。この方法は、焼結外枠体の透磁
率が−様であって、磁路断面積もばらつかないのでチッ
プコイルのインダクタンスＬの数値のばらつきが小さく
、しかも磁気シールド性が優れている利点を有するが、
焼結外枠体の製造工程並びに接着工程が煩雑であって作
業性が悪く、そのため製造コストが他の方法と比較して
高価であり、また、素子の形状が大きなものにしか採用
できないという問題点がある。Furthermore, in the bonding method, the element body of the chip coil around which the winding wire is wound is fitted into a sintered outer frame body made of a ferrite core, etc., and fixed with adhesive. This is a method of configuring a closed magnetic circuit. This method has the advantage that the magnetic permeability of the sintered outer frame is -like and the cross-sectional area of the magnetic path does not vary, so the variation in the value of the inductance L of the chip coil is small, and the magnetic shielding property is excellent. have, but
The manufacturing process of the sintered outer frame and the bonding process are complicated and workability is poor, and therefore the manufacturing cost is high compared to other methods, and the problem is that it can only be used for devices with large shapes. There is a point.
そこで、以上の問題点に鑑み、本発明の課題は、磁気シ
ールド材ないしその取付は方法に起因するインダクタン
スＬのばらつきが少なく、かつ、製造コストが安価な磁
気シールド型インダクタンス素子を提供することにある
。Therefore, in view of the above problems, an object of the present invention is to provide a magnetically shielded inductance element that has less variation in inductance L due to the magnetic shielding material or its mounting method and is inexpensive to manufacture. be.
以上の課題を解決するため、本発明に係るインダクタン
ス素子は、素体の表面上に樹脂材からなる外体を備え、
前記外体の表面部に磁性体粉末が付着・含浸された磁気
シールド層を形成し、該磁気シールド層と前記素体とで
閉磁路を構成したことを特徴とする。In order to solve the above problems, an inductance element according to the present invention includes an outer body made of a resin material on the surface of an element body,
The present invention is characterized in that a magnetic shielding layer in which magnetic powder is adhered and impregnated is formed on the surface of the outer body, and the magnetic shielding layer and the element body constitute a closed magnetic path.
また、本発明に係るインダクタンス素子の製造方法は、
素体の表面上に樹脂材からなる外体を形成した後、・該
素体と磁性体粉末とを加熱、振動することにより、前記
外体表面に磁性体粉末を付着・含浸させて磁気シールド
層を外体表面に形成し、該磁気シールド層と前記素体と
で閉磁路を構成したことを特徴とする。Further, the method for manufacturing an inductance element according to the present invention includes:
After forming an outer body made of a resin material on the surface of the element body, by heating and vibrating the element body and magnetic powder, the magnetic powder is attached to and impregnated on the surface of the outer body to form a magnetic shield. It is characterized in that a layer is formed on the surface of the outer body, and the magnetic shield layer and the element body constitute a closed magnetic path.
作用
即ち、素体と磁性体粉末とを一緒に加熱、振動すること
により、素体表面上に形成した樹脂製の外体が軟化し可
塑性を示し、この可塑性を示している外体表面に磁性体
粉末が均一に付着・含浸される。そのため、均一な厚み
の磁気シールド層ができ、かつ、その磁気シールド層の
透磁率は−様なものとなり、磁気シールド材ないしその
取付は方法に起因するインダクタンスＬのばらつきが小
さくなる。In other words, by heating and vibrating the element body and magnetic powder together, the resin outer body formed on the element surface softens and exhibits plasticity, and the outer body surface exhibiting plasticity becomes magnetic. Body powder is evenly adhered and impregnated. Therefore, a magnetic shield layer with a uniform thickness is formed, and the magnetic permeability of the magnetic shield layer is -like, and variations in the inductance L due to the magnetic shield material or the method of attaching it are reduced.
実施例
以下、本発明に係るインダクタンス素子及びその製造方
法の実施例をシールド型チップコイル１を例にして説明
する。EXAMPLE Hereinafter, an example of an inductance element and a method for manufacturing the same according to the present invention will be described using a shielded chip coil 1 as an example.
第１ＵｇＪに示す様に、シールド型チップコイル１は、
フェライト材等でできた素体２の胴部２ａに巻線Ｗが巻
き回されている。この素体２の胴部２ａに第２図に示す
様に樹脂３を付与する。樹脂３の材料は熱可塑性樹脂、
例えば、塩化ビニル樹脂、ボッエチレン等、あるいは熱
硬化性樹脂、例えば、フェノール樹脂、エポキシ樹脂等
を用いる。付与する方法とじ−てはデイツプ法、デイス
ペンサー法、コーティング法などがある。As shown in the first UgJ, the shielded chip coil 1 is
A winding W is wound around a body 2a of an element body 2 made of ferrite material or the like. A resin 3 is applied to the body 2a of the element body 2 as shown in FIG. The material of resin 3 is thermoplastic resin,
For example, vinyl chloride resin, botethylene, etc., or thermosetting resins, such as phenol resin, epoxy resin, etc. are used. Application methods include dip method, dispenser method, and coating method.
続いて、この様に形成されたチップコイル１の素体２と
磁性体粉末４とを図示していない容器に入れる。磁性体
粉末４は、例えばフェライト等が使用されている。Subsequently, the element body 2 of the chip coil 1 and the magnetic powder 4 thus formed are placed in a container (not shown). The magnetic powder 4 is made of, for example, ferrite.
容器はバイブレータによって微小振動をかけられると同
時に容器の周囲に設けられたヒータによって加熱される
。これにより、容器に投入されている素体２と磁性体粉
末４は加熱され、素体２に付与された樹脂３はその熱に
よって軟化し可塑性を示す。そして、バイブレータによ
る微小振動によって磁性体粉末４が、可塑性を示してい
る状態の樹脂３の表面に均一に付着・含浸する（第３図
参照）。The container is subjected to minute vibrations by a vibrator and at the same time is heated by a heater provided around the container. As a result, the element body 2 and the magnetic powder 4 placed in the container are heated, and the resin 3 applied to the element body 2 is softened by the heat and exhibits plasticity. Then, the magnetic powder 4 uniformly adheres to and impregnates the surface of the plastic resin 3 due to minute vibrations caused by the vibrator (see FIG. 3).
樹脂３として熱可塑性樹脂を使用した場合は、磁性体粉
末４が均一に付着・含浸した後、任意の降温速度で冷却
させて磁性体粉末４の磁気シールド層５ａ、 ５ｂを樹
脂３の表面に形成する。When a thermoplastic resin is used as the resin 3, after the magnetic powder 4 is uniformly adhered and impregnated, it is cooled at an arbitrary cooling rate to form magnetic shield layers 5a and 5b of the magnetic powder 4 on the surface of the resin 3. Form.
また、樹脂３として熱硬化性樹脂を使用した場合は、磁
性体粉末４が均一に付着・含浸した後、さらに樹脂３の
硬化温度まで任意の速度で温度を上昇させることにより
、磁性体粉末４の磁気シールド層５ａ、 ５ｂを樹脂３
の表面に形成する。In addition, when a thermosetting resin is used as the resin 3, after the magnetic powder 4 is uniformly adhered and impregnated, the temperature is further increased at an arbitrary speed to the curing temperature of the resin 3. The magnetic shield layers 5a and 5b are made of resin 3.
Formed on the surface of
ここで、磁気シールド層５ａ、 ５ｂの厚みは、容器に
投入する素体２の総表面積（正確には樹脂３の総表面積
）と磁性体粉末４の量で決まり、その組合わせは任意に
選ぶことができる。樹脂３の表面に形成された磁気シー
ルド層５ａ、 ５ｂは、第４図に示す様に素体２と共に
閉磁路を形成する。即ち、素体２の胴部２ａに巻き回さ
れた巻線Ｗに電流が流れることによって、発生した磁束
は素体２の胴部２ａ−素体２の一方のベース部２ｂ−磁
気シールド層５ａ−素体２の他方のベース部２Ｃをつな
ぐ閉磁路内及び、胴部２ａ−ベース部２ｂ−磁気シール
ド層ｓｂ−ベース部２ｃをつなぐ閉磁路内を通る。これ
によってチップコイル１は完全に磁気シールドされる。Here, the thickness of the magnetic shielding layers 5a and 5b is determined by the total surface area of the element body 2 (more precisely, the total surface area of the resin 3) and the amount of the magnetic powder 4 to be placed in the container, and the combination can be selected arbitrarily. be able to. The magnetic shield layers 5a and 5b formed on the surface of the resin 3 form a closed magnetic path together with the element body 2, as shown in FIG. That is, when a current flows through the winding W wound around the body 2a of the element 2, the generated magnetic flux is distributed between the body 2a of the element 2, one base 2b of the element 2, and the magnetic shield layer 5a. - It passes through a closed magnetic path that connects the other base portion 2C of the element body 2, and a closed magnetic path that connects the body portion 2a, the base portion 2b, the magnetic shield layer sb, and the base portion 2c. As a result, the chip coil 1 is completely magnetically shielded.
前記磁気シールド層５ａ、５ｂは、磁性体粉末４が樹脂
３に均一に付着・含浸されるためその形成厚みは均一で
あって、閉磁路の磁路断面積のばらつきが少なく、−ま
た、透磁率も一様となる。このため、チップコイル１の
インダクタンスＬのばらつきが小さくなる。The magnetic shield layers 5a and 5b have a uniform thickness because the magnetic powder 4 is uniformly adhered to and impregnated into the resin 3, and there is little variation in the cross-sectional area of the closed magnetic path. The magnetic rate also becomes uniform. Therefore, variations in the inductance L of the chip coil 1 are reduced.
なお、本発明に係るインダクタンス素子及びその製造方
法は前記各実施例に限定するものではなく、その要旨の
範囲内で種々に変更することができる。Note that the inductance element and the method for manufacturing the same according to the present invention are not limited to the above-mentioned embodiments, and can be variously modified within the scope of the gist thereof.
例えば、磁性を有する粉末の材料としては、フェライト
に限る必要はなく、純鉄、パーマロイ、センゲス］・の
材料を微粉末にしたものであっても良い。但し、フェラ
イトを使用した場合は電気抵抗率が高い磁気シールド材
が得られるため高周波領域での損失が少ないインダクタ
ンス素子となる。For example, the material of the magnetic powder is not limited to ferrite, and may be a finely powdered material such as pure iron, permalloy, or CENGES. However, when ferrite is used, a magnetic shielding material with high electrical resistivity can be obtained, resulting in an inductance element with low loss in the high frequency range.
発明の効果
以上の説明で明らかな様に、本発明に係るインダクタン
ス素子及びその製造方法によれば、素体の表面上に樹脂
材からなる外体を形成した後、該素体と磁性体粉末とを
加熱、振動することにより、前記外体表面に磁性体粉末
を均一に付着・含浸させて、厚みのばらつきが小さく、
磁性体粉末の偏析がない磁気シールド層を形成できる。Effects of the Invention As is clear from the above explanation, according to the inductance element and the method for manufacturing the same according to the present invention, after forming an outer body made of a resin material on the surface of an element, the element and magnetic powder are combined. By heating and vibrating the magnetic powder, the magnetic powder is uniformly adhered to and impregnated on the surface of the outer body, and the thickness variation is small.
A magnetic shield layer without segregation of magnetic powder can be formed.
これによって、磁路断面積のばらつきが少なく、−様な
透磁率を有する磁気シールド層と素体とが閉磁路を形成
するのでインダクタンスＬの数値のばらつきの小さいイ
ンダクタンス素子を得ることができる。This makes it possible to obtain an inductance element with small variations in the magnetic path cross-sectional area and small variations in the numerical value of the inductance L since the magnetic shield layer and the element body having --like magnetic permeability form a closed magnetic path.
しかも、シールド層の厚みを容器に投入する素体の総表
面積（正確には、樹脂の総表面積）と磁性体粉末の量で
任意にコントロールできる。Moreover, the thickness of the shield layer can be arbitrarily controlled by the total surface area of the element (to be more precise, the total surface area of the resin) placed in the container and the amount of magnetic powder.
また、シールド層を設けるための樹脂の付着量、形状に
制約がないため、大がかりな設備は不要であり、製造コ
ストが安価になる。Furthermore, since there are no restrictions on the amount or shape of the resin deposited to provide the shield layer, large-scale equipment is not required, and manufacturing costs are reduced.
さらに、樹脂の材料についての使用制限がないため、樹
脂硬化の際の樹脂収縮の少ない柔軟性のある樹脂を使用
して、経時的にもインダクタンスＬの変化の少ない安定
したシールド性を有するインダクタンス素子を得ること
ができる。そして、素子の使用目的に適した特性を有す
る樹脂材料を広範な樹脂種類の中から選択できる。Furthermore, since there are no restrictions on the use of resin materials, a flexible resin with little resin shrinkage during resin curing is used to create an inductance element that has stable shielding properties with little change in inductance L over time. can be obtained. Then, a resin material having characteristics suitable for the intended use of the element can be selected from a wide variety of resin types.
第１図〜第４図は本発明に係るインダクタンス素子の一
実施例を示すもので、第１図は素体にリード線が巻き回
されたチップコイルの正面丙、第２図は第１図のチップ
コイルに樹脂製外体が形成された状態を示す一部断面図
、第３図は第２図に示すチップコイルに磁性体粉末を付
着・含浸させた状態を示す一部断面図、第４図は第３図
に示すチップコイルの閉磁路の説明断面図である。
１・・・インダクタンス素子（チップコイル）、２・・
・素体、２ａ・・・胴部、２ｂ、 ２ｃ・・・ベース部
、３・・・樹脂製外体、４・・・磁性体粉末、５ａ、５
ｂ・・・磁気シールド層。
特許出願人 株式会社村田製作所Figures 1 to 4 show an embodiment of the inductance element according to the present invention. Figure 1 is a front view of a chip coil in which a lead wire is wound around the element body, and Figure 2 is the same as Figure 1. FIG. 3 is a partial cross-sectional view showing a state in which a resin outer body is formed on the chip coil shown in FIG. FIG. 4 is an explanatory sectional view of the closed magnetic path of the chip coil shown in FIG. 3. 1...Inductance element (chip coil), 2...
・Element body, 2a...Body part, 2b, 2c...Base part, 3...Resin outer body, 4...Magnetic powder, 5a, 5
b...Magnetic shield layer. Patent applicant Murata Manufacturing Co., Ltd.
Claims (2)
体の表面部に磁性体粉末が付着・含浸された磁気シール
ド層を形成し、該磁気シールド層と前記素体とで閉磁路
を構成したことを特徴とするインダクタンス素子。1. An outer body made of a resin material is provided on the surface of the element body, a magnetic shielding layer in which magnetic powder is adhered and impregnated is formed on the surface of the outer body, and a closed magnetic path is formed between the magnetic shield layer and the element body. An inductance element characterized by comprising:
該素体と磁性体粉末とを加熱、振動することにより、前
記外体表面に磁性体粉末を付着・含浸させて磁気シール
ド層を外体表面に形成し、該磁気シールド層と前記素体
とで閉磁路を構成したインダクタンス素子の製造方法。2. After forming the outer body made of resin material on the surface of the base body,
By heating and vibrating the element body and the magnetic powder, the magnetic powder is attached to and impregnated on the surface of the outer body to form a magnetic shielding layer on the outer body surface, and the magnetic shielding layer and the magnetic powder are bonded to each other. A method of manufacturing an inductance element that forms a closed magnetic circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3065189A JPH02208908A (en) | 1989-02-08 | 1989-02-08 | Inductance element and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3065189A JPH02208908A (en) | 1989-02-08 | 1989-02-08 | Inductance element and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02208908A true JPH02208908A (en) | 1990-08-20 |
Family
ID=12309700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3065189A Pending JPH02208908A (en) | 1989-02-08 | 1989-02-08 | Inductance element and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02208908A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2345800A (en) * | 1997-08-19 | 2000-07-19 | Taiyo Yuden Kk | Method of manufacture for a wire wound electronic component |
| US7924132B2 (en) | 2003-07-09 | 2011-04-12 | Power Integrations, Inc. | Method and apparatus for transferring energy in a power converter circuit |
-
1989
- 1989-02-08 JP JP3065189A patent/JPH02208908A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2345800A (en) * | 1997-08-19 | 2000-07-19 | Taiyo Yuden Kk | Method of manufacture for a wire wound electronic component |
| GB2345802A (en) * | 1997-08-19 | 2000-07-19 | Taiyo Yuden Kk | Electronic component with a multilayer ferrite and resin seal structure |
| GB2345802B (en) * | 1997-08-19 | 2001-08-01 | Taiyo Yuden Kk | Wire wound electronic component |
| US7924132B2 (en) | 2003-07-09 | 2011-04-12 | Power Integrations, Inc. | Method and apparatus for transferring energy in a power converter circuit |
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