JPH0220584A - Adhesive for metal-clad laminate - Google Patents
Adhesive for metal-clad laminateInfo
- Publication number
- JPH0220584A JPH0220584A JP16972688A JP16972688A JPH0220584A JP H0220584 A JPH0220584 A JP H0220584A JP 16972688 A JP16972688 A JP 16972688A JP 16972688 A JP16972688 A JP 16972688A JP H0220584 A JPH0220584 A JP H0220584A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- curing agent
- amino resin
- adhesive
- amino
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 15
- 229920003180 amino resin Polymers 0.000 claims abstract description 20
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 17
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 9
- 239000013034 phenoxy resin Substances 0.000 claims abstract description 9
- 229920006287 phenoxy resin Polymers 0.000 claims abstract description 9
- 239000004640 Melamine resin Substances 0.000 claims abstract description 6
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 5
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000011354 acetal resin Substances 0.000 claims abstract description 4
- 150000007974 melamines Chemical class 0.000 claims abstract description 4
- 229920006324 polyoxymethylene Polymers 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 230000002378 acidificating effect Effects 0.000 claims description 10
- 239000011888 foil Substances 0.000 claims description 6
- 239000011342 resin composition Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 abstract description 12
- 239000011347 resin Substances 0.000 abstract description 12
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 abstract description 10
- 238000005476 soldering Methods 0.000 abstract description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 abstract description 9
- 239000002253 acid Substances 0.000 abstract description 7
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 abstract description 5
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 abstract description 4
- 239000003960 organic solvent Substances 0.000 abstract description 4
- 238000006116 polymerization reaction Methods 0.000 abstract description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 abstract description 2
- 235000019270 ammonium chloride Nutrition 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract description 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 2
- -1 but not limited to Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- GEHMBYLTCISYNY-UHFFFAOYSA-N Ammonium sulfamate Chemical compound [NH4+].NS([O-])(=O)=O GEHMBYLTCISYNY-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は金属箔張り積層板を製造する際に、金属箔と積
層板を接着するのに用いられる金属箔張り積層板用接着
剤に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an adhesive for metal foil-clad laminates that is used for bonding metal foil and laminates when producing metal foil-clad laminates.
民生用電子機器の小型化高機能化が進み、それに用いら
れる印刷配線板は高密度化、超微細化する傾向にある。BACKGROUND OF THE INVENTION As consumer electronic devices become smaller and more sophisticated, the printed wiring boards used therein tend to become more dense and ultra-fine.
これに伴って印刷配線板に用いられる金属箔張り積層板
には高密度実装が可能であることが要求されている。そ
のため、特に細線化された金属導体の引き剥がし強さや
、実装時のはんだ耐熱性の向上が強く望まれている。ま
た、テレビのように高電圧が印加されることがあるもの
には安全性を確保する立場から、耐トラツキング性が要
求されるようになってきた。Accordingly, metal foil-clad laminates used for printed wiring boards are required to be capable of high-density mounting. Therefore, there is a strong desire to improve the peel strength of thin metal conductors and the solder heat resistance during mounting. Additionally, tracking resistance has come to be required for devices such as televisions to which high voltages may be applied in order to ensure safety.
従来は金属箔と積層板との接着には、引き剥がし強さお
よびはんだ耐熱性の点で優れているポリビニルブチラー
ル樹脂とフェノール樹脂が主に用いられてきた。Conventionally, polyvinyl butyral resin and phenol resin, which are excellent in peel strength and soldering heat resistance, have been mainly used for bonding metal foils and laminates.
しかし、このフェノール樹脂は炭化し易いため導通し易
くなり、トラッキング形成が容易になり火災を発しやす
く、耐トラツキング性の低下の原因となっていた。そこ
で、このフェノール樹脂に代わる材料として炭化しにく
い材料であるメラミン樹脂やエポキシ樹脂を用いること
が特開昭６２−１１６６８２号公報などで提案されてい
る。しかし、メラミン樹脂やエポキシ樹脂を用いること
で耐トラツキング性は向上するが、はんだ耐熱性が低下
してしまう。However, since this phenol resin is easily carbonized, it becomes easily conductive, easily forming tracking, and easily causing a fire, which causes a decrease in tracking resistance. Therefore, the use of melamine resin or epoxy resin, which are materials that are difficult to carbonize, has been proposed in Japanese Patent Application Laid-open No. 116682/1982 as a material to replace the phenol resin. However, although the tracking resistance is improved by using a melamine resin or an epoxy resin, the soldering heat resistance is reduced.
本発明は上記のことを考慮してはんだ耐熱性を低下させ
ずに耐トラツキング性を向上させるような金属箔張り積
層板用接着剤を提供することを目的とする。In view of the above, an object of the present invention is to provide an adhesive for metal foil-clad laminates that improves tracking resistance without reducing soldering heat resistance.
本発明は、上記の目的に合致した、金属張り積層板用接
着剤であって、ポリビニルアセタール樹脂、フェノキシ
樹脂及びアミノ樹脂からなる樹脂組成物にアミノ樹脂の
硬化剤として酸性硬化剤を添加したことを特徴とする。The present invention is an adhesive for metal-clad laminates that meets the above-mentioned objectives, and comprises adding an acidic curing agent as a curing agent for the amino resin to a resin composition consisting of a polyvinyl acetal resin, a phenoxy resin, and an amino resin. It is characterized by
本発明に用いるポリビニルアセタール樹脂としてはポリ
ビニルホルマール、ポリビニルブチラールがあり、特に
比較的安価な有機溶剤であるアセトン、メチルエチルケ
トン、メタノール、トルエンなどに溶解するポリビニル
ブチラールが好ましい、ポリビニルブチラール樹脂のブ
チラール化度、重合度は特に制限されないが、ブチラー
ル化度６０〜７０モル％、重合度１５００〜２５００の
ものが好ましい、具体的な樹脂として、エスレックＢＸ
−１，ＢＸ−２，ＢＸ−５５（積木化学工業社製、商品
名）、電化ブチラール４０００−２゜５０００−Ａ、６
０００−Ｃ（電気化学工業社製、商品名）などが挙げら
れる。これらの樹脂は単独又は２種以上混合して用いら
れる。The polyvinyl acetal resin used in the present invention includes polyvinyl formal and polyvinyl butyral, and polyvinyl butyral that is soluble in relatively inexpensive organic solvents such as acetone, methyl ethyl ketone, methanol, and toluene is particularly preferred; the degree of butyralization of the polyvinyl butyral resin, The degree of polymerization is not particularly limited, but a degree of butyralization of 60 to 70 mol% and a degree of polymerization of 1500 to 2500 are preferable.Specific resins include S-LEC BX
-1, BX-2, BX-55 (manufactured by Block Chemical Industry Co., Ltd., trade name), Denka Butyral 4000-2゜5000-A, 6
000-C (manufactured by Denki Kagaku Kogyo Co., Ltd., trade name) and the like. These resins may be used alone or in a mixture of two or more.
フェノキシ樹脂はアミノ樹脂と反応して剛直性を付与す
るもので、本発明に用いるフェノキシ樹脂としてはエピ
コート０Ｌ−５３−Ｌ−３２，０Ｌ−５３−ＢＨ−３５
（分子！５５．０００）、０Ｌ−５５−Ｌ−３２，０Ｌ
−１２５５−ＨＸ−３０（分子量７０，０００）（油化
シェルエポキシ社製、商品名）やフェノトートＹＰ−４
０（分子量２０．０００）ＹＰ−５０Ｍ （分子量３０
゜０００）ＹＰ−５０（分子量４０，０００）？東部化
成社製、商品名） 、ＰＫＩ（）ｌ、ＰＫＨＪ （分子
量４０．００）（ユニオンカーバイト社製、商品名）な
どが挙げられる。これらのフェノキシ樹脂は単独又は２
種以上混合して用いられる。Phenoxy resin reacts with amino resin to impart rigidity, and examples of phenoxy resin used in the present invention include Epicote 0L-53-L-32, 0L-53-BH-35.
(Numerator! 55.000), 0L-55-L-32,0L
-1255-HX-30 (molecular weight 70,000) (manufactured by Yuka Shell Epoxy Co., Ltd., trade name) and Phenotote YP-4
0 (molecular weight 20.000) YP-50M (molecular weight 30
゜000) YP-50 (molecular weight 40,000)? (manufactured by Tobu Kasei Co., Ltd., trade name), PKI ()l, PKHJ (molecular weight 40.00) (manufactured by Union Carbide Co., Ltd., trade name). These phenoxy resins may be used alone or in combination.
It is used in combination of more than one species.
本発明に用いるアミノ樹脂としてはメラミン樹脂やベン
ゾグアナミン樹脂及びアルキルエーテル化したアルキル
エーテル化メラミン樹脂、アルキルエーテル化ベンゾグ
アナミン樹脂などがあり、アルキル化メラミン樹脂が好
ましく用いられる。The amino resins used in the present invention include melamine resins, benzoguanamine resins, alkyl etherified melamine resins, and alkyl etherified benzoguanamine resins, and alkylated melamine resins are preferably used.
具体的には、メチル化メラミン樹脂の二カラツクＭＷ−
３０、ＭＳ−００１、ＭＸ−００２、ＭＸ−７０５（三
和ケミカル社製、商品名）、サイメルー３００．３２５
．３５０（三井東圧社製、商品名）メランー２２．２８
．２９．２６５．２４５（日立化成社製、商品名）やベ
ンゾグアナミン樹脂の二カラツクＢＬ−６０（三和ケミ
カル社製、商品名）メランー８１（日立化成社製、商品
名）などが挙げられる。これらのアミノ樹脂は単独又は
２種以上混合して用いられる。Specifically, two types of methylated melamine resin MW-
30, MS-001, MX-002, MX-705 (manufactured by Sanwa Chemical Co., Ltd., trade name), Cymeru 300.325
．． 350 (manufactured by Mitsui Toatsu Co., Ltd., product name) Meran-22.28
．． 29.265.245 (manufactured by Hitachi Chemical Co., Ltd., trade name), benzoguanamine resin Nikaratsuku BL-60 (manufactured by Sanwa Chemical Co., Ltd., trade name), Melan-81 (manufactured by Hitachi Chemical Co., Ltd., trade name), and the like. These amino resins may be used alone or in combination of two or more.
以上の樹脂の混合比率は特に限定するものではないが、
好ましくはポリアセクール樹脂１００重量部に対してフ
ェノキシ樹脂１０〜５０重量部、アミノ樹脂５０−１５
０重量部を配合して樹脂組成物とする。フェノキシ樹脂
が１０重量部未満では耐熱性が劣り、また５０重量部を
超えるとビール強度が低下する。アミノ樹脂が５０重量
部未満では架橋密度が小さくなりはんだ耐熱性が低下す
る。アミノ樹脂１５０重量部を超えると架橋密度が高く
なり、接着剤がもろくなるため銅箔引き剥がし強さが低
下する。Although the mixing ratio of the above resins is not particularly limited,
Preferably, 10 to 50 parts by weight of phenoxy resin and 50-15 parts by weight of amino resin per 100 parts by weight of polyacecool resin.
A resin composition is prepared by blending 0 parts by weight. If the phenoxy resin is less than 10 parts by weight, heat resistance will be poor, and if it exceeds 50 parts by weight, beer strength will be reduced. If the amino resin is less than 50 parts by weight, the crosslinking density will be low and the soldering heat resistance will be reduced. When the amino resin exceeds 150 parts by weight, the crosslinking density becomes high and the adhesive becomes brittle, resulting in a decrease in copper foil peel strength.
これらの樹脂組成物は有機溶剤に溶解させておくことが
好ましい、有機溶剤としては上記材料を溶解するもので
あればよ（、特に限定するものではないが、メタノール
、アセトン、トルエン、メチルエチルケトン、メチルセ
ルソルブ、Ｎ、Ｎ−ジメチルホルムアミドなど比較的安
価な溶剤に溶解することが望ましい。It is preferable that these resin compositions be dissolved in an organic solvent, as long as the organic solvent dissolves the above-mentioned materials (including, but not limited to, methanol, acetone, toluene, methyl ethyl ketone, methyl It is desirable to dissolve it in a relatively inexpensive solvent such as Cellsolve, N,N-dimethylformamide.
本発明のアミノ樹脂の硬化剤としての酸性硬化剤はアミ
ノ樹脂に対して０．Ｏ１〜・２．０重量％であることが
望ましい。アミノ樹脂の酸性硬化剤の添加ｌが０．０１
重量％未満ではメラミン樹脂が硬化不足になりはんだ耐
熱性が低下し、２重量％を超えると硬化が進みすぎるた
め、フェノール樹脂を紙基材に含浸させて得たプリプレ
グのＢ−ステージの樹脂と反応しなくなるため銅箔引き
剥がし強さが低下する。The acidic curing agent used as the curing agent for the amino resin of the present invention is 0.0% relative to the amino resin. It is desirable that the content is 1 to 2.0% by weight. Addition l of acidic curing agent to amino resin is 0.01
If it is less than 2% by weight, the melamine resin will be insufficiently cured and the soldering heat resistance will decrease, and if it exceeds 2% by weight, the curing will progress too much, so the B-stage resin of the prepreg obtained by impregnating the paper base material with phenolic resin and Since it no longer reacts, the peel strength of the copper foil decreases.
本発明に用いられる酸性硬化剤としてはで示されるイミ
ドジスルホン酸塩、
で示されるニトリロスルホン酸塩のように加水分解して
酸を生成し、硬化作用を示す加水分解型酸性硬化剤が用
いられる。イミドジスルホン酸三アンモニウム塩誘導体
、ニトリロスルホン酸三アンモニウム塩誘導体としてキ
ャタニット、キャタニットＡ１キャタニットＣ１キャタ
ニットＵ２キャタニットＰ、キャタニットＳ（いずれも
日東化学社製、商品名）が市販されている。また塩化ア
ンモニウム、スルファミン酸アンモニウム、塩化亜鉛な
どの熱によって解離して酸を生成する熱解離型酸性硬化
剤も用いることができる。The acidic curing agent used in the present invention is a hydrolyzable acidic curing agent that generates an acid by hydrolysis and exhibits a curing action, such as the imidodisulfonate shown by and the nitrilosulfonate shown by . Catanite, Catanite A1 Catanite C1 Catanite U2 Catanite P, and Catanite S (all manufactured by Nitto Kagaku Co., Ltd., trade names) are commercially available as imidodisulfonic acid triammonium salt derivatives and nitrilosulfonic acid triammonium salt derivatives. There is. Further, thermally dissociable acidic curing agents such as ammonium chloride, ammonium sulfamate, and zinc chloride, which dissociate with heat to generate acids, can also be used.
耐トラツキング性の改良に効果のあるアミノ樹脂は積層
板の基材樹脂であるフェノール樹脂との共縮合反応が起
こりにくいためにメチロール基が残存し、はんだ浴に浮
かべた時に分解反応が起こりはんだふれを起こしてしま
う、即ちはんだ耐熱性を低下させることになる。本発明
においては積層板の加熱加圧成形前の接着剤の段階でア
ミノ樹脂の硬化を進めておくことににより積層成形時に
金属箔と積層板の間に発生するガスが少なくなり、はん
だ耐熱性が向上するものと思われる。Amino resin, which is effective in improving tracking resistance, is difficult to co-condensate with the phenol resin, which is the base resin of the laminate, so methylol groups remain, and when it is floated in a solder bath, a decomposition reaction occurs and causes solder smearing. This results in a decrease in soldering heat resistance. In the present invention, by curing the amino resin at the adhesive stage before hot-pressing the laminate, less gas is generated between the metal foil and the laminate during lamination molding, and the soldering heat resistance is improved. It seems that it will.
以下、本発明を実施例に基づいて詳細に説明するが、本
発明はこれに限定されるものではない。Hereinafter, the present invention will be explained in detail based on Examples, but the present invention is not limited thereto.
実施例１〜３、比較例１〜２
表１に示す樹脂配合で溶剤に均一に溶解させて、金属箔
張り積層板用接着剤を得た。この接着剤をロールコータ
で厚さ３５μｍの銅箔に塗布し、乾燥硬化させて接着剤
厚み４０μｍの接着割付ｗ４箔を得た。二〇銅箔の接着
剤側にフェノール樹脂含浸基材８枚を重ねて積層体とし
ステンレス鏡板に挟んで１６０°Ｃ１１００ｋｇ／ｃ＋
Ｉ！で６０分間加熱加圧成形して銅張り積Ｉｉｉ板を得
た。この銅張り積層板の特性を示す。Examples 1 to 3, Comparative Examples 1 to 2 The resin compositions shown in Table 1 were uniformly dissolved in a solvent to obtain adhesives for metal foil-clad laminates. This adhesive was applied to a copper foil having a thickness of 35 μm using a roll coater, and was dried and cured to obtain an adhesion layout W4 foil having an adhesive thickness of 40 μm. 20 8 sheets of phenolic resin-impregnated base material are stacked on the adhesive side of copper foil to make a laminate and sandwiched between stainless steel mirror plates at 160°C 1100kg/c+
I! A copper-clad laminate III board was obtained by heating and pressure molding for 60 minutes. The characteristics of this copper-clad laminate are shown below.
実施例と比較例のはん耐熱性、耐トラ・ンキング性は表
１で明白なるように本発明のものははんだ耐熱性、耐ト
ラツキング性を両立させることが可能であり、本発明の
優れていることを確認した。As is clear from Table 1, the soldering heat resistance and tracking resistance of the Examples and Comparative Examples show that the products of the present invention are able to achieve both soldering heat resistance and tracking resistance, and are superior to the present invention. I confirmed that there is.
本発明の金属張り積層板用接着剤は金属張り積層板のは
んだ耐熱性を低下させずに耐トラツキング性を向上させ
ることができ、その工業的価値は極めて大である。The adhesive for metal-clad laminates of the present invention can improve the tracking resistance of metal-clad laminates without reducing their solder heat resistance, and has extremely great industrial value.
Claims (1)
ミノ樹脂からなる樹脂組成物にアミノ樹脂の硬化剤とし
て酸性硬化剤を添加したことを特徴とする金属箔張り積
層板用接着剤。 ２、アミノ樹脂がアルキル化メラミン樹脂である請求項
１記載の金属箔張り積層板用接着剤。 ３、酸性硬化剤が加水分解型酸性硬化剤又は熱解離型酸
性硬化剤である請求項１又は２記載の金属箔張り積層板
用接着剤[Scope of Claims] 1. An adhesive for metal foil-clad laminates, characterized in that an acidic curing agent is added as a curing agent for the amino resin to a resin composition consisting of a polyvinyl acetal resin, a phenoxy resin, and an amino resin. 2. The adhesive for metal foil laminates according to claim 1, wherein the amino resin is an alkylated melamine resin. 3. The adhesive for metal foil laminates according to claim 1 or 2, wherein the acidic curing agent is a hydrolyzable acidic curing agent or a thermally dissociable acidic curing agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16972688A JPH0220584A (en) | 1988-07-07 | 1988-07-07 | Adhesive for metal-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16972688A JPH0220584A (en) | 1988-07-07 | 1988-07-07 | Adhesive for metal-clad laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0220584A true JPH0220584A (en) | 1990-01-24 |
Family
ID=15891713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16972688A Pending JPH0220584A (en) | 1988-07-07 | 1988-07-07 | Adhesive for metal-clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0220584A (en) |
-
1988
- 1988-07-07 JP JP16972688A patent/JPH0220584A/en active Pending
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