JPH02205058A - Cooling structure of semiconductor chip - Google Patents
Cooling structure of semiconductor chipInfo
- Publication number
- JPH02205058A JPH02205058A JP2385989A JP2385989A JPH02205058A JP H02205058 A JPH02205058 A JP H02205058A JP 2385989 A JP2385989 A JP 2385989A JP 2385989 A JP2385989 A JP 2385989A JP H02205058 A JPH02205058 A JP H02205058A
- Authority
- JP
- Japan
- Prior art keywords
- leaf spring
- semiconductor chip
- semiconductor element
- heat sink
- cooler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 35
- 238000001816 cooling Methods 0.000 title claims abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、冷却器に半導体素子を固定する板バネをネジ
で取付けずに、冷却器側に設けた溝に、板バネを挿入す
ることにより、取付が自由にでき、この板バネの突起形
状により、板バネがはずれないことを特徴とした、半導
体の冷却器取付構造に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method of inserting a leaf spring for fixing a semiconductor element to a cooler into a groove provided on the cooler side, without attaching the leaf spring with screws. This invention relates to a semiconductor cooler mounting structure characterized in that it can be mounted freely and that the leaf spring does not come off due to the protruding shape of the leaf spring.
従来の装置は、特開昭６１−５０３９７号公報に記載の
ように、圧着用バネをフック部と孔により放熱板に固定
することにより、発熱素子を基板に実装する方法をとり
、直接１発熱素子をヒートシンクにネジ止メせず、部品
リードにストレスが加わらないような配慮をとっていた
。As described in Japanese Unexamined Patent Publication No. 61-50397, the conventional device uses a method of mounting a heating element on a board by fixing a compression spring to a heat sink using a hook part and a hole, and directly generates one heat. The device was not screwed to the heat sink, and care was taken to avoid adding stress to the component leads.
上記従来技術は冷却器への半導体の取付性について、取
付の簡易性、特に着脱の容易性の配慮がなされなかった
が１本発明の目的は、半導体素子の固定を簡易化しよう
とするものである。The above-mentioned conventional technology did not take into account the ease of mounting, especially the ease of attaching and detaching the semiconductor to the cooler. However, the purpose of the present invention is to simplify the fixing of the semiconductor element. be.
冷却器側に板バネ取付用の溝を設ける必要があるが、こ
の方法は、はじめから溝付の冷却器を成形しておけばよ
い。成形は切削加工で行なうか、冷却器自体を型で押出
成形する方法のいずれかとなるが、押出成形した溝付冷
却器も容易に供給できる。Although it is necessary to provide a groove for attaching the leaf spring on the cooler side, this method suffices if the cooler with grooves is formed from the beginning. Molding can be done either by cutting or by extrusion molding the cooler itself, but extruded grooved coolers can also be easily supplied.
半導体素子の形状により、冷却器の形状、取付用の板バ
ネの形状も、個々に対応が取れる。特に小容量発熱の半
導体素子の冷却器としての取付としては簡易的で、基板
に半導体を実装する場合の冷却器の取付構造として実用
に供するものでふある。Depending on the shape of the semiconductor element, the shape of the cooler and the shape of the leaf spring for attachment can be individually tailored. In particular, it is easy to install as a cooler for a semiconductor element that generates a small amount of heat, and it can be put to practical use as a cooler mounting structure when a semiconductor is mounted on a board.
冷却器としてここであつかうちのは１通常、押出し成形
用アルミ材のヒートシンクが対象となるが、成形アルミ
ヒートシンクに半導体素子を取り付けるために、板バネ
取付用の溝を設けるか、この溝へ板バネを挿入し、半導
体素子を一定の圧力で加圧して固定するかがキーポイン
トとなる。加圧力が大きければ、板バネの着脱も難かし
く、半導体素子を破損することにもなり、適度の圧力を
有する板バネの設計も必要となる。As a cooler, we are using an extruded aluminum heat sink.In order to attach a semiconductor element to a molded aluminum heat sink, it is necessary to provide a groove for attaching a plate spring, or insert a plate spring into this groove. The key point is to insert the semiconductor element and apply a constant pressure to secure it. If the pressing force is large, it will be difficult to attach and detach the leaf spring, and the semiconductor element may be damaged, so it is necessary to design a leaf spring with an appropriate pressure.
以下、本発明の一実施例を第１図、第２図、第３図で説
明する。An embodiment of the present invention will be described below with reference to FIGS. 1, 2, and 3.
本実施例の構成を第１図に示す。半導体素子２を冷却す
るヒートシンク１と及び半導体素子を固定する板バネ４
からなっており、ヒートシンク１のフィン側とは反対側
の背面方向にヒートシンクのつばｌｃ、ｌｂを設ける。The configuration of this embodiment is shown in FIG. A heat sink 1 that cools the semiconductor element 2 and a leaf spring 4 that fixes the semiconductor element.
The ribs lc and lb of the heat sink are provided on the back side of the heat sink 1 opposite to the fin side.
そのつばの先端に板バネ４を挿入する溝２ａ、２ｂを設
け、板バネ４の中央部の複数突起部により半導体素子の
ケースを押えるものである。Grooves 2a and 2b into which the leaf spring 4 is inserted are provided at the tip of the collar, and the case of the semiconductor element is held down by a plurality of protrusions at the center of the leaf spring 4.
半導体素子をヒートシンク背面に実装し、溝、２ｃ、２
ｂに板バネ４を挿入して、半導体素子３を板バネ４のバ
ネ圧で固定する。The semiconductor element is mounted on the back of the heat sink, and the grooves, 2c, 2
A plate spring 4 is inserted into b, and the semiconductor element 3 is fixed by the spring pressure of the plate spring 4.
第２図は第１図の上面図で、断面Ａ−Ａが第３図であり
、基板５に半導体素子を実装したものである。ヒートシ
ンク１は別個に基板に固定して保持する。FIG. 2 is a top view of FIG. 1, and the cross section AA is shown in FIG. 3, in which a semiconductor element is mounted on a substrate 5. The heat sink 1 is separately fixed and held on the substrate.
本発明は半導体素子をヒートシンクに取付けるにあたっ
て、ヒートシンクに板バネ取付は用の溝を設は組立を容
易化したものである。The present invention facilitates assembly by providing a groove for attaching a leaf spring to the heat sink when attaching a semiconductor element to the heat sink.
第４図は板バネの中央部を切り曲げて、突起部を出した
板バネで取付時、挿入しやすくし、この突起で板バネが
抜は落ちないようにした一例である。Fig. 4 is an example of a plate spring in which the center part is cut and bent to have a protrusion to make it easier to insert the plate spring during installation, and the protrusion prevents the plate spring from falling out.
従来のヒートシンクへの半導体の取付構造は、第５図の
ように、固定ネジもしくは板バネをヒートシンクにネジ
固定し、半導体素子を取付けてい、 ３ 。The conventional structure for mounting a semiconductor on a heat sink is as shown in Figure 5, in which a fixing screw or a plate spring is fixed to the heat sink and the semiconductor element is mounted.
九。Nine.
上記は、半導体素子を１個実装した時の一例であるが、
多数個実装して多段突起板バネで実施することも可能で
ある。The above is an example when one semiconductor element is mounted.
It is also possible to implement a multi-stage protrusion leaf spring by mounting a large number of them.
本発明はヒートシンクの一部に板バネを取付ける溝を設
け、この溝に突起を有した板バネを挿入するだけで、半
導体素子をヒートシンクへの取付性を簡易化した構造を
特長とするものである。The present invention has a structure in which a groove for attaching a leaf spring is provided in a part of the heat sink, and the semiconductor element can be easily attached to the heat sink by simply inserting the leaf spring having a protrusion into the groove. be.
本発明によれば、半導体素子の冷却器への固定が容易で
、板バネの加圧力を均一に保てば、半導体素子に無理な
圧力を加えずに、半導体素子の冷却効果を高めることが
できる。作業性面でもすぐれ、取付が簡易化という面で
実用に供するものである。According to the present invention, it is easy to fix the semiconductor element to the cooler, and if the pressing force of the leaf spring is kept uniform, the cooling effect of the semiconductor element can be enhanced without applying unreasonable pressure to the semiconductor element. can. It is excellent in terms of workability and can be put to practical use because it simplifies installation.
板バネについては、各素子に対応して、適当な形状の寸
法のものを供給することも可能となる。As for leaf springs, it is also possible to supply leaf springs with appropriate shapes and dimensions corresponding to each element.
第１図は本発明の一実施例の斜視図、第２図は、第１図
の上面図、第３図は第２図のＡ−Ａ断面図、第４図は板
バネの他の例を示す斜視図、第５図は従来例の斜視図で
ある。
１・・・ヒートシンク、
１ｃＬ・・・ツバ、ｌｂ・・・ツバ、
２α・・・溝、２ｂ・・・溝、
３・・・半導体素子、４・・・板バネ、４α・・・板バ
ネ、５・・・基板、
６・・・ヒートシンク、７・・・固定ネジ。Fig. 1 is a perspective view of one embodiment of the present invention, Fig. 2 is a top view of Fig. 1, Fig. 3 is a sectional view taken along line A-A in Fig. 2, and Fig. 4 is another example of a leaf spring. FIG. 5 is a perspective view of a conventional example. 1... heat sink, 1cL... collar, lb... collar, 2α... groove, 2b... groove, 3... semiconductor element, 4... plate spring, 4α... plate spring , 5... Board, 6... Heat sink, 7... Fixing screw.
Claims (1)
バネ取付用の溝を設け、半導体素子加圧用の板バネを円
滑に挿入することができる一方、挿入した板バネが、反
対方向に抜けない構造を特徴とする半導体素子の冷却構
造。1. In order to fix the semiconductor device to the cooler, a groove for attaching a leaf spring is provided in the cooler, and the leaf spring for pressurizing the semiconductor device can be inserted smoothly. A cooling structure for semiconductor devices that is characterized by its unique structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2385989A JPH02205058A (en) | 1989-02-03 | 1989-02-03 | Cooling structure of semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2385989A JPH02205058A (en) | 1989-02-03 | 1989-02-03 | Cooling structure of semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02205058A true JPH02205058A (en) | 1990-08-14 |
Family
ID=12122165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2385989A Pending JPH02205058A (en) | 1989-02-03 | 1989-02-03 | Cooling structure of semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02205058A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0855943A (en) * | 1994-08-10 | 1996-02-27 | Hounetsukino O S:Kk | Electronic equipment heat radiator and manufacture thereof |
| EP0855089A4 (en) * | 1995-10-13 | 1999-05-19 | Thermalloy Inc | Solderable transistor clip and heat sink |
-
1989
- 1989-02-03 JP JP2385989A patent/JPH02205058A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0855943A (en) * | 1994-08-10 | 1996-02-27 | Hounetsukino O S:Kk | Electronic equipment heat radiator and manufacture thereof |
| EP0855089A4 (en) * | 1995-10-13 | 1999-05-19 | Thermalloy Inc | Solderable transistor clip and heat sink |
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