JPH02196840A - Polyethylene resin composition for covering electric wire - Google Patents
Polyethylene resin composition for covering electric wireInfo
- Publication number
- JPH02196840A JPH02196840A JP1693089A JP1693089A JPH02196840A JP H02196840 A JPH02196840 A JP H02196840A JP 1693089 A JP1693089 A JP 1693089A JP 1693089 A JP1693089 A JP 1693089A JP H02196840 A JPH02196840 A JP H02196840A
- Authority
- JP
- Japan
- Prior art keywords
- polyethylene resin
- resin
- electric wires
- pressure
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920013716 polyethylene resin Polymers 0.000 title claims description 23
- 239000011342 resin composition Substances 0.000 title claims description 11
- 239000011347 resin Substances 0.000 abstract description 14
- 229920005989 resin Polymers 0.000 abstract description 14
- 238000002156 mixing Methods 0.000 abstract description 5
- 238000007788 roughening Methods 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 16
- 238000000576 coating method Methods 0.000 description 16
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 6
- 239000005977 Ethylene Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 4
- 229920001519 homopolymer Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電線を被覆するために用いられる電線被覆用ポ
リエチレン樹脂組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a polyethylene resin composition for coating electric wires, which is used for coating electric wires.
銅線等の電線には、絶縁および表面の保護を目的として
、樹脂等の被覆材により被覆した被覆電線が使用されて
いる。従来このような電線の被覆材として、高圧法ポリ
エチレン樹脂が使用され、電線に直接被覆されている。BACKGROUND ART For electric wires such as copper wires, covered electric wires are used that are coated with a coating material such as resin for the purpose of insulation and surface protection. Conventionally, high-pressure polyethylene resin has been used as a coating material for such electric wires, and the electric wires are directly coated.
高圧法ポリエチレン樹脂による電線の被覆は。Electric wires are coated with high-pressure polyethylene resin.
電線をダイス内を通過させながら、押出機から溶融した
樹脂を押出し、通過する電線の周囲に樹脂を被覆する。While passing the electric wire through the die, molten resin is extruded from an extruder to coat the resin around the electric wire passing through.
ところが、このような高圧法ポリエチレン樹脂による電
線の被覆は、電線の引取速度が遅い場合は問題がないが
、高速度例えば８００ｍ／ｓｉｎ以上の速度で引取りな
がら被覆を行うと、電線に被覆された樹脂が波釘状に肌
荒れを生じ、被覆外観が悪いとともに、巻取ったときに
かさばり、より線を形成する場合などには樹脂がこすれ
て剥離しやすいという問題点があった。However, coating wires with such high-pressure polyethylene resin poses no problem if the wire is drawn at a slow speed, but if the wire is covered while being drawn at a high speed, for example, 800 m/sin or more, the wire may be coated. The resulting resin has a corrugated, rough surface, which gives the coating a poor appearance. It is also bulky when wound up, and when forming stranded wires, the resin is easily rubbed and peeled off.
本発明の目的は、高速で電線を引取りながら被覆を行う
場合でも、肌荒れを起こさず、優れた被覆外観を有し、
かさばりゃ剥離等が生じない電線被覆用ポリエチレン樹
脂組成物を提供することである。The object of the present invention is to have an excellent coating appearance without causing roughness even when coating the wire while pulling it at high speed,
It is an object of the present invention to provide a polyethylene resin composition for covering electric wires that does not cause peeling or the like if it is bulky.
本発明は、高圧法ポリエチレン樹脂９０〜９９重量％お
よびＭＦＲ（温度１９０℃、荷重２１．６聴ｆ）０．５
〜５．Ｏｇ７１０ｍｉｎの低中圧法ポリエチレン樹脂１
０〜１重量％を配合した電線被覆用ポリエチレン樹脂組
成物である。The present invention uses a high-pressure polyethylene resin of 90 to 99% by weight and an MFR (temperature of 190°C, load of 21.6 f) of 0.5.
~5. Og710min low and medium pressure polyethylene resin 1
This is a polyethylene resin composition for covering electric wires containing 0 to 1% by weight.
本発明において使用する高圧法ポリエチレン樹脂は、エ
チレンモノマーに酸素を添加し、高圧、高温にてラジカ
ル重合させる方法などの一般的な方法により製造される
低密度ポリエチレン樹脂であり、他の α−オレフィン
を含まないエチレンの単独重合体が好ましい。The high-pressure polyethylene resin used in the present invention is a low-density polyethylene resin produced by a general method such as adding oxygen to ethylene monomer and performing radical polymerization at high pressure and high temperature. A homopolymer of ethylene that does not contain is preferred.
このような高圧法ポリエチレン樹脂としては、ＡＳＴＭ
０１２３ｇ（温度１９０℃、荷重２．１６ｋｇｆ）に
より測定されたＭＦＲ（メルトフローレート）が０．１
〜１．０ ｇ ／１０ｍｉｎ、好ましくは０．１５〜０
．５ｇ／１０ａ＋ｉｎ％ＡＳＴＭ０１５０５により測定
された密度が０．９１５〜０．９３０ ｇ ／ｃｘｌの
ものが好ましい、 ＭＦＲが上記範囲を越えると。As such high pressure polyethylene resin, ASTM
MFR (melt flow rate) measured at 0123g (temperature 190℃, load 2.16kgf) is 0.1
~1.0 g/10min, preferably 0.15-0
．． 5g/10a+in% Those with a density measured by ASTM 01505 of 0.915 to 0.930 g/cxl are preferred, if the MFR exceeds the above range.
押出時にたれやすく、上記範囲より小さいと動粘性が悪
くなり１作業上、成形上の問題がある。It tends to sag during extrusion, and if it is smaller than the above range, the kinematic viscosity deteriorates, causing problems in terms of work and molding.
本発明で使用する低中圧法ポリエチレン樹脂は、例えば
チーグラー・ナツタ触媒等による低圧法または中圧法に
より製造される高密度ポリエチレン樹脂であり、エチレ
ンの単独重合体、またはエチレンと炭素数３〜２０の
α−オレフィン２モル％以下との共重合体が使用できる
。上記の α−オレフィンとしてはプロピレン、ブテン
−１，ヘキセン−１，４−メチルペンテン−１などがあ
げられる。The low-medium pressure polyethylene resin used in the present invention is a high-density polyethylene resin produced by a low-pressure method or a medium-pressure method using a Ziegler-Natsuta catalyst, for example, and is a homopolymer of ethylene or a polymer of ethylene and 3 to 20 carbon atoms.
A copolymer with 2 mol% or less of α-olefin can be used. Examples of the above α-olefins include propylene, butene-1, hexene-1,4-methylpentene-1, and the like.
このような低中圧法ポリエチレン樹脂としては、ＡＳＴ
Ｍ ０１２３ｇ（温度１９０℃、荷重２１．６ｋｇｆ）
により測定したＭＦＲが０．５〜５．０ ｇ ／１０ｍ
ｉｎ、好ましくは１．０〜４、Ｏｇ／１０ｍｉｎのもの
が使用でき、ＡＳＴＭ ０１５０５により測定された密
度が０．９４０〜０．９６５ ｇ ／ ａｌのものが好
ましい。As such low-medium pressure polyethylene resin, AST
M 0123g (temperature 190℃, load 21.6kgf)
MFR measured by 0.5-5.0 g/10m
in, preferably 1.0 to 4 Og/10 min, and preferably has a density of 0.940 to 0.965 g/al as measured by ASTM 01505.
本発明の樹脂組成物は高圧法ポリエチレン樹脂９０〜９
９重量％、好ましくは９３〜９７重量％、および低中圧
法ポリエチレン樹脂１０〜１重量％、好ましくは７〜３
重量％を配合したものである。The resin composition of the present invention is a high-pressure polyethylene resin 90-9
9% by weight, preferably 93-97% by weight, and 10-1% by weight of low-medium pressure polyethylene resin, preferably 7-3% by weight.
% by weight.
本発明の樹脂組成物には、耐熱安定剤、耐候安定剤、難
燃剤、核剤、顔料、染料、滑剤、発錆防止剤等の各種配
合剤を配合することができる。The resin composition of the present invention may contain various additives such as a heat stabilizer, a weather stabilizer, a flame retardant, a nucleating agent, a pigment, a dye, a lubricant, and a rust inhibitor.
本発明の樹脂組成物を得る方法としては、前記各成分を
前記範囲で混合することにより得られる。The resin composition of the present invention can be obtained by mixing the above-mentioned components within the above-mentioned ranges.
混合方法としては種々公知の方法例えばヘンシェルミキ
サー、Ｖ−ブレンダー、リボンブレンダータンブラーブ
レンダー等で混合する方法、混合後さらに一軸押出機、
二軸押呂機、ニーダ−等により溶融混線後、造粒あるい
は粉砕する方法などがあげられる。As the mixing method, there are various known methods such as a Henschel mixer, a V-blender, a ribbon blender, a tumbler blender, etc. After mixing, a single screw extruder,
Examples include a method of melting and mixing using a twin-screw pusher, kneader, etc., followed by granulation or pulverization.
本発明の樹脂組成物は従来の高圧法ポリエチレン樹脂と
同様に電線の被覆に使用される１本発明の樹脂組成物に
よる電線の被覆は、電線をダイス内を通過させながら、
押出機から溶融した樹脂を押出し、通過する電線の周囲
に樹脂を被覆する。The resin composition of the present invention can be used for coating electric wires in the same way as conventional high-pressure polyethylene resins.1 The resin composition of the present invention can be used to coat electric wires while passing the electric wire through a die.
Molten resin is extruded from an extruder, and the resin is coated around the electric wire passing through.
この場合、被覆電線を高速度例えば８００ｍ／ｗｉｎ以
上の速度で引取りながら被覆を行うことができ、この場
合でも被覆された樹脂が枝打状になって肌荒れが生じる
ことはなく、優れた被覆外観が得られる。In this case, the coating can be carried out while pulling the coated wire at a high speed, for example, 800 m/win or more, and even in this case, the coated resin does not become twig-like and rough, and the coating is excellent. Appearance is obtained.
本発明によれば、高圧法ポリエチレン樹脂に高分子量の
低中圧法ポリエチレン樹脂を配合したので、高速で電線
を引取りながら被覆を行う場合でも、肌荒れを起こさず
、優れた被覆外観を有し、かさばりゃ剥離等が生じない
被覆電線が得られる。According to the present invention, since the high molecular weight low-medium pressure polyethylene resin is blended with the high-pressure polyethylene resin, even when coating is performed while pulling the wire at high speed, the coating does not cause roughness and has an excellent coating appearance. A covered electric wire that is bulky and does not peel or the like can be obtained.
以下、実施例により本発明を説明する。 The present invention will be explained below with reference to Examples.
表１に示す高圧法ポリエチレン栖脂（エチレンの単独重
合体）および低圧法ポリエチレン樹脂（エチレンが９９
モル％とブテン−１が１モル％の共重合体）からなる樹
脂組成物を１８０〜２５０℃で溶融して押出し、０．４
■φの軟銅線を１０００ｍ／ｌ１ｉｎの速度でダイスを
通過させて引取りながら１００〜１５０μｍの厚さに被
覆し、電線被覆の表面粗さを測定し、１．０μｍ以下を
合格（０）、１．０μｍを超えるものを不合格（Ｘ）と
した、結果を表１に示す、
表１の結果より。High-pressure polyethylene resin (ethylene homopolymer) and low-pressure polyethylene resin (ethylene is 99%
A resin composition consisting of a copolymer containing 1 mol% of mol% and butene-1) was melted at 180 to 250°C and extruded to obtain a
■ φ annealed copper wire is passed through a die at a speed of 1000 m/l 1 inch and coated with a thickness of 100 to 150 μm while being taken off, and the surface roughness of the wire coating is measured. If it is 1.0 μm or less, it passes (0), Those exceeding 1.0 μm were judged as rejected (X). The results are shown in Table 1. From the results in Table 1.
実施例のものはいずれも被覆 の表面粗さは１．０μ■以下で、 被覆外観が優れてい ることがわかる。All examples are covered The surface roughness of is less than 1.0μ■, Excellent coating appearance I understand that.
Claims (1)
ＭＦＲ（温度１９０℃、荷重２１．６ｋｇｆ）０．５〜
５．０ｇ／１０ｍｉｎの低中圧法ポリエチレン樹脂１０
〜１重量％を配合した電線被覆用ポリエチレン樹脂組成
物。(1) High-pressure polyethylene resin 90 to 99% by weight and MFR (temperature 190°C, load 21.6 kgf) 0.5 to
5.0g/10min low and medium pressure polyethylene resin 10
A polyethylene resin composition for covering electric wires containing ~1% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1693089A JPH02196840A (en) | 1989-01-26 | 1989-01-26 | Polyethylene resin composition for covering electric wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1693089A JPH02196840A (en) | 1989-01-26 | 1989-01-26 | Polyethylene resin composition for covering electric wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02196840A true JPH02196840A (en) | 1990-08-03 |
Family
ID=11929843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1693089A Pending JPH02196840A (en) | 1989-01-26 | 1989-01-26 | Polyethylene resin composition for covering electric wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02196840A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014500335A (en) * | 2010-09-30 | 2014-01-09 | ダウ グローバル テクノロジーズ エルエルシー | Reusable thermoplastic insulator with improved breakdown strength |
-
1989
- 1989-01-26 JP JP1693089A patent/JPH02196840A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014500335A (en) * | 2010-09-30 | 2014-01-09 | ダウ グローバル テクノロジーズ エルエルシー | Reusable thermoplastic insulator with improved breakdown strength |
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