JPH02196454A - Semiconductor package - Google Patents

Abstract

PURPOSE:To eliminate the necessity of a cooling system of a large scale, to eliminate deviation in heat distribution and to enable an effective heat design by providing a semiconductor package itself with a radiator to dissipate heat on the surface of the package. CONSTITUTION:A radiator 9 to dissipate heat on a surface of a semiconductor package 1 is attached to the package 1 itself which is airtightly sealed or resin- sealed. A cooling means is provided to the semiconductor package 1 itself to cool the semiconductor package 1 itself by the radiator 9. Therefore, the semiconductor package 1 is constituted so that it can be cooled without requiring a heat dissipation means such as an air cooling radiating fan besides the radiator 9. For example, a cooling fan 12 is contained inside a radiation base 10 of the radiator 9, and the cooling fan 12 is interconnected with a driving motor 13 which is provided to an upper part of the radiation base 10 through a driving shaft 14 at a center of the radiation base 10, and revolves inside the radiation base 10 through an operation of the driving motor 13 to diffuse heat produced on a surface of a package base 2 and to release it externally through an open window 11.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention differs from the conventional method in which heat radiation fins are attached to the surface of a semiconductor package and cooling air is sent to the fins from a heat radiation fan to cool the entire system. The present invention relates to a semiconductor package in which the semi-integrated package itself (individual semiconductor packages in the system) is provided with a cooling means, and therefore can be cooled without the need for air blowing by the above-mentioned heat dissipation fan.

[Conventional technology]

Conventional heat dissipation (cooling) means for computers involves mounting a large number of semiconductor packages, each fully equipped with heat dissipation fins, on a mounting board such as a printed wiring board, using plug-in mounting, etc., and generally using a heat dissipation fan to cool the heat dissipation fins. A method of blowing and cooling air is used.

Examples of literature describing the installation of heat dissipation vents and ins and the above-mentioned cooling means include Nikkei Electronics 4, September 24, 1984 issue, p. 280-28, published by Nikkei McGraw-Hill.
5 and Kogyo Kenkyukai Co., Ltd., published on January 15, 1980.
Examples include IC mounting technology Jp211 to Jp240.

[Problem to be solved by the invention]

However, the above-mentioned cooling means requires a large fan for blowing air, which necessitates a large-scale cooling system.Although the area near the fan is well cooled, the semiconductor package located far away is If you look at the entire system, the heat dissipation performance will be poor, and if you look at the whole system, the heat dissipation will be uneven.
32-bit CPU (central control unit) with power consumption of about W
For example, if you place an SRAM of about 0.1 W per LSI around it, the CPU in the center is the one that needs cooling the most, but the surrounding area is cooled too much. Although there are an increasing number of systems in which the areas that require cooling are limited,
The drawback is that it cannot handle this.

An object of the present invention is to provide a technique that can eliminate the drawbacks of such conventional techniques.

The above and other objects and novel features of the present invention are:
It will become clear from the description of this specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows.

In the present invention, a heat radiator such as a small electric fan (cooling fan) driven by a drive motor is attached to the semiconductor package itself to cool the package itself.

[Effect]

As a result, the semiconductor package itself is cooled by the radiator, so there is no need to attach a radiator fin and cool the fin by blowing air with a radiator fan, as in the conventional method.Therefore, there is no need for a radiator fan or fins. In the present invention, the heat sink is attached to each semiconductor package and cools it, so it is possible to operate the heat sink of the package in a place where heat radiation is particularly required, and when blowing air with a conventional heat radiation fan, it is possible to Unbalanced heat radiation can be eliminated.

Furthermore, since there is no need for a heat dissipation fan that dissipates heat from the entire system as in the prior art, there is no need for a large-scale cooling system.

〔Example〕

Next, embodiments of the present invention will be described based on the drawings.

FIG. 1 is a partially sectional side view showing an embodiment of the present invention, in which a chip 4 is fixed in a cavity 3 of a package paste 2 in a semiconductor package 1. As shown in FIG.

The package base 2 is made of a multilayer circuit board, for example, a ceramic board.

The chip 4 is made of, for example, a silicon single crystal substrate, and a large number of circuit elements are formed within this chip using well-known techniques to provide one circuit function. A concrete example of a circuit element is, for example, a transistor (MOS), and these circuit elements form, for example, a logic circuit and a memory circuit function.

The bonding pads of the chip 4 and the leads 5 protruding from the bottom surface of the package space 2 are electrically connected to each other by internal wiring 7 within the space 2 via bonding wires 6. The bonding wire 6 is made of, for example, an Au wire.

A cap 8 is attached to the center of the bottom of the package paste 2 to hermetically seal the chip 4 and the like.

The cap 8 is made of, for example, a ceramic material.

A heat sink 9 is mounted on the upper surface of the package paste 2.

An open window 11 is provided on the heat radiation base 10 of the heat radiator 9.

Heat sink9. A cooling fan 12 is housed inside the heat dissipation base 10, and the cooling fan 12 is connected to a drive motor 13 provided on the upper part of the heat dissipation base 10 via a drive shaft 14 of the shaft of the heat dissipation base 10. The drive motor 13 is provided with an O drive motor 13 which is circulated inside the heat dissipation base 10 by the operation of the drive motor 13, diffuses the heat generated on the surface of the package paste 2, and radiates the heat to the outside through the open window 11. is driven by a drive power source 15 installed on the top surface of the heat dissipation base 10 for driving a drive motor.

The drive motor 13 is covered with a cover 16 .

The semiconductor package 1 to which the heat sink 9 is attached is mounted on a mounting board 17 such as a printed wiring board.

Here, an embodiment in which one package 1 is mounted is shown, but normally, a large number of packages 1 are mounted on the mounting board 17.

In particular, for those requiring heat dissipation on the substrate 17, the driving power source 15 may be turned on and the driving motor 13 may be pressed to operate.

When the operation of the drive motor 13 generates noise and affects the chip 4, it is preferable to provide a bypass capacitor 18 on the top surface of the package base 2 as shown in the figure for noise countermeasures.

Bypass capacitors 18 are connected to the leads 5, the chip 4, and the internal wiring 7j, and are further connected to the drive motor 13, although not shown.

According to the present invention, as described above, the radiator 9 equipped with one cooling fan 12 is attached to the semiconductor package 1 itself, and the cooling fan 12 of the radiator 9 cools the package base 2.
Since the pressure is applied to dissipate the heat generated on the surface, there is no need to use a cooling method that blows air from a heat dissipation fan to the heat dissipation fins of the conventional semiconductor package, and there is no need for a large-scale cooling system. If the cooling fan 12 is operated for a large number of semiconductor packages with heat sinks 9 mounted on the semiconductor package that require heat dissipation, the heat distribution will not be uneven. It is also possible to arrange the semiconductor package 1 equipped with the heat sink 9 only in the area, and thermal design can be carried out efficiently.

Although the invention made by the present inventor has been specifically explained based on Examples above, the present invention is not limited to the above Examples, and it is possible to make various changes without departing from the gist of the invention. not.

For example, in the above embodiments, the radiator is configured with a cooling fan, but there are also radiators that use pressure elements such as blowers, radiators that utilize the Beltier effect, and i! It may be a blower that uses deionization, or it may be any other device that moves the heated air that remains in the boundary layer on the surface of the package.

The present invention can be applied to various semi-integrated packages in addition to the bin grid array semiconductor package exemplified in the seventh example above.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

According to the present invention, an extremely advantageous technique can be provided when considering thermal design.

[Brief explanation of the drawing]

FIG. 1 is a partially sectional side view showing an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Semiconductor package, 2... Package base, 3... Cavity, 4... Chip, 5... Lead, 6... Bonding wire, 7... Internal wiring,
Total... Cap, 9... Heat radiator, 10... Heat radiation base, 11... Open window, 12... Cooling fan, 13...
- Drive motor, 14... Drive shaft, 15... Drive power supply, 16... Cover 17... Mounting board, 18
...Bypass capacitor.

Claims (2)

[Claims] 1. A radiator capable of dissipating heat on the surface of the package is attached to the semiconductor package itself that is hermetically sealed or resin-sealed, and the semiconductor package itself is cooled by the radiator. A semiconductor package that is equipped with a cooling means and can be cooled without requiring a heat radiation means such as an air cooling fan in addition to the heat radiator. 2. 2. The semiconductor package according to claim 1, wherein the radiator is a cooling fan and includes a driving motor for driving the fan and a driving power source for driving the motor.