JPH02194193A - Device for repairing metallic base - Google Patents
Device for repairing metallic baseInfo
- Publication number
- JPH02194193A JPH02194193A JP1290989A JP1290989A JPH02194193A JP H02194193 A JPH02194193 A JP H02194193A JP 1290989 A JP1290989 A JP 1290989A JP 1290989 A JP1290989 A JP 1290989A JP H02194193 A JPH02194193 A JP H02194193A
- Authority
- JP
- Japan
- Prior art keywords
- repaired
- plating
- nozzle
- electrode
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims description 22
- 239000007788 liquid Substances 0.000 claims description 4
- 229910021645 metal ion Inorganic materials 0.000 abstract description 3
- 150000002500 ions Chemical class 0.000 abstract description 2
- 238000012856 packing Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
この発明は、例えば金型、金属治工具あるいは機械の一
部などの補修に適用される金属地の補修C従来の技術]
従来、この種の金属地の補修するにおいては、例えば黒
鉛電極棒の先端部に綿布を巻き付けて、金属地の補修部
との間に電位差を設け、かつ、綿布にメッキ液を含浸さ
せて、根気良く往復動作させることにより、補修部上に
金属イオンからなるメッキ層を析出させているのが現状
である。[Detailed Description of the Invention] [Industrial Field of Application] This invention relates to a method for repairing metal bases applied to, for example, repairing molds, metal jigs, tools, or parts of machines. When repairing a metal base, for example, wrap a cotton cloth around the tip of a graphite electrode rod to create a potential difference between it and the repaired part of the metal base, impregnate the cotton cloth with plating solution, and patiently move it back and forth. At present, a plating layer made of metal ions is deposited on the repaired area.
[発明が解決しようとする課題]
しかしながら、このような従来構造の金属地の補修方法
、所謂”筆メッキ”と称されるものでは。[Problems to be Solved by the Invention] However, there is no method for repairing metal bases with such a conventional structure, so-called "brush plating."
根気のいる手作業であるために、補修作業が非常に面倒
で多大な労力と時間を要し、安定したメッキ層を補修部
上に局部的に肉盛り形成することができず、不注意によ
るメッキ密着不良が発生し易いばかりでなく、メッキ層
の厚みが増すと、補修面が荒れ易くなることから、厚肉
盛りが困難であるといった問題があった。Since the repair work is a painstaking manual process, it is extremely troublesome and requires a great deal of effort and time, and it is not possible to build up a stable plating layer locally on the repaired area, resulting in damage caused by carelessness. Not only is plating adhesion failure likely to occur, but as the thickness of the plating layer increases, the repaired surface becomes more likely to become rough, making it difficult to build up thick walls.
この発明は、上記の事情のもとになされたもので、その
目的とするところは、簡単な構成で、速やかにメッキ処
理による肉盛りを行なうことができるようにした金属地
の補修装置を提供することにある。The present invention was made under the above circumstances, and its purpose is to provide a metal base repair device that has a simple configuration and can quickly perform overlaying by plating. It's about doing.
[課題を解決するための手段]
上記した課題を解決するために、この発明は、メッキ処
理により金属地の補修部を局部的に肉盛″りする補修装
置であって、メッキ液が噴流・還流する内−外2重管構
造からなるノズル部と、このノズル部の内管の先端に設
けた電極部とを備え、前記ノズル部を金属地の補修部に
密着させ、かつ前記電極部と補修部の間に電位差を設け
るとともに、前記ノズル部から高温のメッキ液を前記電
極部と補修部の間に噴流させてなる構成としたものであ
る。[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention provides a repair device that locally builds up a repaired part of a metal base by plating, in which a plating liquid is jetted or The nozzle part has an inner-outer double pipe structure for reflux, and an electrode part is provided at the tip of the inner pipe of this nozzle part, and the nozzle part is brought into close contact with the repaired part of the metal base, and the electrode part and A potential difference is provided between the repair portions, and a high temperature plating solution is jetted from the nozzle portion between the electrode portion and the repair portion.
[作 用]
すなわち、この発明は、上記の構成とすることによって
、高温のメッキ液をノズル部から電極部と補修部の間に
噴流させてなるために、補修部にメッキ層が高速で析出
し、これによって、速やかに補修部が肉盛りされる。[Function] That is, with the above configuration, the present invention jets the high-temperature plating solution from the nozzle part between the electrode part and the repaired part, so that the plating layer is deposited on the repaired part at high speed. As a result, the repaired portion is quickly filled up.
[実 施 例]
以下、この発明を図示の一実施例を参照しながら詳細に
説明する。[Example] Hereinafter, the present invention will be described in detail with reference to an illustrated example.
第1図はこの発明に係る金属地の補修装置を示すもので
、図中1はノズル部である。このノズル部1は、金属地
の補修部Mに密着される外管2と。FIG. 1 shows a metal base repair apparatus according to the present invention, and numeral 1 in the figure is a nozzle section. This nozzle part 1 has an outer tube 2 that is tightly attached to a repaired part M made of metal.
この外管2内に挿通される内管3との2重管構造を有し
、前記内管3の先端には、電極部4が設けられている。It has a double tube structure with an inner tube 3 inserted into the outer tube 2, and an electrode section 4 is provided at the tip of the inner tube 3.
また、図中5は前記外管2の先端部に設けたパツキンで
ある。Further, numeral 5 in the figure is a gasket provided at the tip of the outer tube 2.
そして、前記内管3からは、メッキ液Wが前記金属地の
補修部Mに向は噴流されるようになっているとともに、
この噴流後のメッキ液Wは、前記外管2に設けた排出口
6から排出されて還流されるようになっている。The plating solution W is jetted from the inner tube 3 toward the repaired portion M of the metal base, and
The plating solution W after this jet flow is discharged from a discharge port 6 provided in the outer tube 2 and is circulated.
すなわち、上記した補修装置は、まず、ノズル部1を金
属地の補修部Mに密着させて、電極部4との間に電位差
を設け、次いで、前記ノズル部1の内管3から高温のメ
ッキ液Wを前記電極部4と金属地の補修部Mの間に噴流
させることにより、金属イオンからなるメッキ層を金属
地の補修部M上に析出させてなるものである。この場合
、メッキ液Wのイオン濃度を高くシ、温度を上げ、更に
流速を速くすることによって、短時間で金属地の補修部
M上にメッキ層を析出させることが可能になる。That is, the above-mentioned repair device first brings the nozzle part 1 into close contact with the repair part M of the metal base, creates a potential difference between the nozzle part 1 and the electrode part 4, and then removes high-temperature plating from the inner tube 3 of the nozzle part 1. By jetting the liquid W between the electrode portion 4 and the repaired portion M of the metal base, a plating layer made of metal ions is deposited on the repaired portion M of the metal base. In this case, by increasing the ion concentration of the plating solution W, raising the temperature, and further increasing the flow rate, it becomes possible to deposit a plating layer on the repaired portion M of the metal base in a short time.
に、前記ノズル部から高温のメッキ液を前記電極部と補
修部の間に噴流させてなる構成としたことから、補修部
に安定したメッキ層を高速で析出させることができ、こ
れによって、補修部を速やかに肉盛りすることができる
というすぐれた効果を奏するものである。Furthermore, since the structure is such that a high-temperature plating solution is jetted from the nozzle part between the electrode part and the repair part, a stable plating layer can be deposited at high speed on the repair part. This has the excellent effect of being able to quickly fill up the parts.
第1図はこの発明に係る金属地の補修装置の一実施例を
概略的に示す断面図
である。
[発明の効果]
以上の説明から明らかなように、この発明によれば、メ
ッキ処理により金属地の補修部を局部的に肉盛りする補
修装置であって、メッキ液が噴流・還流する内外2重管
構造からなるノズル部と、このノズル部の内管の先端に
設けた電極部とを備え、前記ノズル部を金属地の補修部
に密着させ、かつ前記電極部と補修部の間に電位差を設
けるととも1 ・
3 ・
5 ・
W・
M ・
ノズル部。
内管、
パツキン。
メッキ液。
金属地の補修部。
2・・・外管、
4・・・電極部、
6・・・排出口、FIG. 1 is a sectional view schematically showing an embodiment of a metal base repair apparatus according to the present invention. [Effects of the Invention] As is clear from the above description, according to the present invention, there is provided a repair device that locally builds up a repaired portion of a metal base by plating, and includes two inner and outer parts where a plating solution is jetted and circulated. It includes a nozzle part made of a double pipe structure and an electrode part provided at the tip of the inner pipe of this nozzle part, and the nozzle part is brought into close contact with the repaired part of the metal base, and a potential difference is created between the electrode part and the repaired part. 1, 3, 5, W, M, and nozzle parts. Inner tube, Patsukin. plating liquid. Repair part of metal base. 2... Outer tube, 4... Electrode part, 6... Outlet,
Claims (1)
りする補修装置であって、メッキ液が噴流・還流する内
外2重管構造からなるノズル部と、このノズル部の内管
の先端に設けた電極部とを備え、前記ノズル部を金属地
の補修部に密着させ、かつ前記電極部と補修部の間に電
位差を設けるとともに、前記ノズル部から高温のメッキ
液を前記電極部と補修部の間に噴流させたことを特徴と
する金属地の補修装置。(1) A repair device that locally builds up the repaired part of a metal base by plating, and includes a nozzle part with a double inner and outer pipe structure through which the plating liquid flows and flows, and the tip of the inner pipe of this nozzle part. the nozzle part is brought into close contact with the repaired part of the metal base, and a potential difference is provided between the electrode part and the repaired part, and a high-temperature plating solution is applied from the nozzle part to the electrode part and the repaired part. A metal base repair device characterized in that a jet is made to flow between the repaired parts.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1290989A JPH02194193A (en) | 1989-01-20 | 1989-01-20 | Device for repairing metallic base |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1290989A JPH02194193A (en) | 1989-01-20 | 1989-01-20 | Device for repairing metallic base |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02194193A true JPH02194193A (en) | 1990-07-31 |
Family
ID=11818482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1290989A Pending JPH02194193A (en) | 1989-01-20 | 1989-01-20 | Device for repairing metallic base |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02194193A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004001102A1 (en) * | 2002-06-25 | 2003-12-31 | Integran Technologies Inc. | Process for in-situ electroforming a structural layer of metallic material to an outside wall of a metal tube |
CN101949045A (en) * | 2009-07-09 | 2011-01-19 | 住友化学株式会社 | The treatment process of mould |
-
1989
- 1989-01-20 JP JP1290989A patent/JPH02194193A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004001102A1 (en) * | 2002-06-25 | 2003-12-31 | Integran Technologies Inc. | Process for in-situ electroforming a structural layer of metallic material to an outside wall of a metal tube |
CN101949045A (en) * | 2009-07-09 | 2011-01-19 | 住友化学株式会社 | The treatment process of mould |
JP2011017056A (en) * | 2009-07-09 | 2011-01-27 | Sumitomo Chemical Co Ltd | Treatment method for mold |
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