JPH02189326A - Epoxy resin composition for sealing electronic component - Google Patents

Abstract

PURPOSE:To obtain the title composition having a high glass transition temperature, being lowly hygroscopic and difficultly causing package cracking due to soldering after moisture absorption by using an epoxy resin produced from a polyhydroxynaphthalene compound and an epihalohydrin. CONSTITUTION:The title composition is obtained by mixing an epoxy resin (A) produced from a polyhydroxynaphthalene compound obtained by the condensation of at least one hydroxynaphthalene compound selected from naphthol and dihydroxynaphthalene (e.g. 1,6-dihydroxynaphthalene) with an aldehyde and an epihalohydrin with a curing agent (B) comprising a compound having at least two phenolic hydroxyl groups (e.g. phenolic novolac), a cure accelerator (C) (e.g. triphenylphosphine) and an inorganic filler (e.g. fused silica powder). This composition has a high glass transition temperature of a cured resin, excellent heat resistance, high mechanical strengths, low hygroscopicity and difficulty causing package cracking due to soldering after moisture absorption.

Description

DETAILED DESCRIPTION OF THE INVENTION (IL) Object of the Invention (Field of Industrial Application) The present invention relates to an epoxy resin composition for encapsulating electronic components such as semiconductors. Specifically, it is an electronic component seal that has a high glass transition temperature (Tg), has high strength at solder reflow or solder bath immersion temperatures, has low hygroscopicity, and is resistant to package cracks due to soldering after moisture absorption. The present invention relates to an epoxy resin composition for stopping use.

(Prior Art) Epoxy resin compositions have been widely used for electronic parts such as coils, capacitors, transistors, and ICs. In particular, Kudo resin compositions with a high glass transition temperature, that is, excellent heat resistance, include epoxy resins in which lac is epoxidized with phenols and formaldehyde;
In particular, ortho-cresol nodelac I xy resin is used, and phenol-formaldehyde nobilac resin is used as the curing agent.

In recent years, as semiconductor devices have become more highly integrated and larger, and flat packages with more pins have been put into practical use and thinner, the stress applied to the arm cage and the sealing resin has increased. In particular, in a state where the sealing resin has absorbed moisture, it is necessary to use a no-dry flow or solder bath (215
In the process of passing the steel through the process (~260°C), it is subjected to strong thermal stress, resulting in the problem of cage cracks.

To solve this problem, it is necessary to raise the glass transition temperature of the resin so that it maintains sufficient strength even when processed with high-temperature solder, and to lower the water absorption rate of the resin to reduce moisture absorption of the sealing resin. However, a sufficiently high glass transition temperature cannot be obtained with the combination of orthocresol novilac epoxy resin and phenol novolac resin, which have been widely used in the past.

In order to solve the above problems, attempts have been made to increase the glass transition temperature using glycidyl ethers of polyphenols. However, when using glycisol ethers of polyphenols, the water absorption rate increases and cracks occur in the solder reflow test after moisture absorption.On the other hand, when using glycisol ethers of alkylphenols, the water absorption rate decreases, but the alkyl If the number of carbon atoms in the alkyl group is large, the glass transition temperature decreases, and the reactivity decreases due to steric hindrance of the alkyl substituent, slowing the curing time, leaving unreacted groups, and increasing the crosslink density. Because of this, there were drawbacks such as cracks occurring during solder reflow tests after moisture absorption.

(Problems to be Solved by the Invention) The present invention aims to improve the above-mentioned drawbacks of conventional epoxy resin compositions for encapsulating electronic components such as semiconductors, and in particular, to improve the above-mentioned disadvantages in epoxy resin compositions for encapsulating electronic components such as semiconductors. The object of the present invention is to provide an epoxy resin composition for encapsulating electronic components that is less likely to cause cracks due to soldering.

(b) Structure of the Invention (Means for Solving the Problems) As a result of various studies to solve the above-mentioned problems, the present inventors have solved the purpose by using a specific epoxy resin. I was able to accomplish this.

That is, the epoxy resin composition for sealing a component of the present invention is characterized by containing each of the following components (N to (l).

(A): An epoxy resin produced from epihalohydrin and a polyhydroxynaphthalene-based compound prepared by a cross-linking reaction between at least one hydroxynaphthalene compound selected from naphthol and dihydroxynaphthalene and an aldehyde.

(Bl: A curing agent consisting of a compound having two or more phenolic hydroxyl groups in one molecule.

(q: hardening accelerator.

(JP: Inorganic filler.

In the present invention, the blending ratio of each component of (Al-(l) is (
B) The ratio of the curing agent is such that the OH group of the curing agent is 0.5 to 2.0 equivalents per 1 equivalent of the epoxy group of the (A) epoxy resin, and (C) the curing accelerator is The content of (D) inorganic optical beam material is 50 to 90% by weight based on the total resin composition.

In the present invention, the raw material hydroxynaphthalene compounds for obtaining polyhydroxynaphthalene compounds for producing N-epoxy resins include α-naphthol, β-naphthol, 1.5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1. 7-dihydroxynaphthalene,
2.6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 1.4-dihydroxynaphthalene, 1.
Examples include 2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, and 2,3-dihydroxynaphthalene. Among them, 1,6-dihydroxynaphthalene and 2,7-dihydroxynaphthalene are preferred.
9K 1,6-dihydroxynaphthalene is preferable because a polyhydroxynaphthalene compound, which is a condensate with an aldehyde, has excellent reactivity with epihalohydrin and the resulting epoxy resin has a low softening point.

These hydroxynaphthalene compounds may be reacted with aldehyde using one kind, or two or more kinds may be used in combination to react with aldehyde to produce the polyhydroxynaphthalene compound which is the raw material for producing the epoxy resin of the present invention. You may react. moreover.

These hydroxynaphthalene compounds contain relatively small amounts of phenols (e.g. phenol, cresol, xylenol, resorcinato), i.e. 30 moles or less, preferably 20 moles or less relative to the total amount of wholly aromatic hydroxy compounds. It may be used in combination to react with an aldehyde.

In the present invention, the raw material aldehyde for obtaining the polyhydroxynaphthalene compound for producing the epoxy resin (A) includes, for example, aliphatic aldehydes such as formaldehyde, acetaldehyde, propylaldehyde, and butyraldehyde, penzakf"human, and p-hydroxybenzaldehyde. , salicylaldehyde, vanillin, chlorbenzaldehyde.

Examples include aromatic alf' and 'f' such as glompenzaldehyde. Among them, formaldehyde, p-hydroxybenzaldehyde, salicylaldehyde and vanillin are preferred. One type of these aldehydes may be used for the reaction, or 211 or more may be used in combination for the reaction.

The reaction (condensation reaction) between a hydroxynaphthalene compound and an aldehyde to obtain this polyhydroxynaphthalene compound uses 1 to 40 mol, preferably 1.2 to 10 mol, of a biloxinaphthalene compound per 1 mol of aldehyde. In the presence of an acidic catalyst and optionally in the presence of a solvent, a temperature of 50 to 200°C, preferably 60 to 150°C in the case of aliphatic aldehydes and 60 to 190°C in the case of aromatic aldehydes. The reaction is carried out by allowing the reaction to take place for 1 to 8 hours.

After the reaction is complete, the catalyst is distilled off, washed with water, or neutralized with an alkali (e.g., caustic soda, caustic potash, calcium hydroxide, soda carbonate, sodium hydrogen carbonate, etc.), and then further distilled to remove moisture. By removing the unreacted hydroxynaphthalene compound, solvent, etc., the desired polyhydroxynaphthalene compound can be obtained. Its distillation is 250
It is desirable to carry out the process at a temperature below ℃.

Sulfuric acid is used as a catalyst in the above condensation reaction.

Mineral acids such as hydrochloric acid, nitric acid, bromic acid, and perchloric acid.

Paratoluenesulfone tRj Sulfone R such as benzenesulfonic acid, oxalic acid, succinic acid, malonic acid.

Carboxylic acids such as monochloroacetic acid and dichloroacetic acid are used. The amount of these catalysts used varies depending on the reaction conditions, etc., but is usually 0.01 to 20% by weight, preferably 0.1 to 20% by weight, based on the wholly aromatic hydroxy compound to be reacted.
It is 10 folds.

The above condensation reaction does not necessarily require the presence of a solvent, but if necessary, a solvent such as benzene, toluene, xylene, butyl ether, chlorine, tetrahydrof, ran, chlorobenzene, dichlorobenzene, butyl alcohol, etc. may be used. The reaction can be carried out using a solvent.

The epoxy resin (A) in the present invention can be obtained by reacting the polyhydroxynaphthalene compound obtained as described above with epihalohydrin, and there are two typical methods for this reaction.

■ A one-step method in which a polyhydroxynaphthalene compound and excess epihalohydrin are subjected to an addition reaction in the presence of an alkali metal hydroxide, and the addition reaction of epichlorohydrin and the ring-closing reaction to form an epoxy ring are performed simultaneously.

(2) A two-step method in which a polyhydroxynaphthalene compound and excess epihalohydrin are subjected to an addition reaction in the presence of a basic catalyst, and then an alkali metal hydroxide is added to carry out a ring-closing reaction.

Examples of the epihalohydrin in the above reaction include Teha, epichlorohydrin, shrimp bromohydrin, β-methyl chlorohydrin, β-methyl shrimp bromohydrin, and β-methyl epiiodohydrin, but epichlorohydrin is generally preferred.

Further, as the alkali metal hydroxide in the above reaction, for example, caustic soda or caustic potash is used, and these are added to the reaction system as a solid or as a 40 to 50 weight water bath liquid.

Further, as the basic catalyst in the above reaction, for example, quaternary ammonium salts such as tetramethylammonium chloride, tetramethylammonium bromide, triethylmethylammonium chloride, tetraethylammonium iodide, and cetyltriethylammonium bromide are used.

In the above general method, the reaction is carried out at a temperature of 60 to 150°C, preferably 80 to 120°C. The alkali metal hydroxide is used in an amount of 0.8 to 1.5 moles, preferably 0.9 to 1.2 moles, per equivalent of hydroxyl group of the polyhydroxynaphthalene compound, etc.

In addition, in the above two-stage method, the first stage reaction is 90 to 1
It is carried out at a temperature of 50°C, preferably 100-140°C. The amount of epihalohydrin used is 1.3 to 2 hydroxyl groups per equivalent of the polyhydroxynaphthalene compound, etc.
0 times the molar amount, preferably 1.5 to 14 times the molar amount,
Epihalohydrin used in excess can be recovered by distillation and reused.

In addition, the basic catalyst has a 0.002 to 0.5
Used in mole-0 ratio.

The subsequent reaction is carried out at 60-150°C, preferably 80-12°C.
The reaction is carried out at 0°C, and the alkali gold hydroxide is used in an equimolar amount to 1.1 times the molar amount of the halohydrin produced. These first-stage and second-stage reactions may be carried out without a solvent, or with methyl in butyl ketone, cyclohexanone,
The reaction may be carried out in the presence of an inert organic solvent such as toluene.

After completion of the reaction in the one-step or two-step method, the reaction product is purified by washing with warm water to remove the alkali metal salts formed, such as common salt, and then distilling off the water. Alternatively, the above reaction product is dissolved in an organic solvent that is soluble or poorly soluble in water, such as methyl isobutyl ketone, cyclohexanone, toluene, etc., and the solution is brought into contact with water or hot water to remove inorganic impurities such as salt. After dissolving in the phase, evaporate the organic phase to remove the solvent′! The epoxy resin of the present invention is obtained by cleaving the PI.

Next, the curing agent (B) in the present invention has two or more phenolic hydroxyl groups in its molecule, preferably three or more phenolic hydroxyl groups. Specific examples include phenol, substituted phenol,
For example 0. - Obtained by condensing cresol, p-lusol, t-butylphenol, cumylphenol, vinylphenol, etc. with formaldehyde in the presence of an acidic catalyst. Examples include phenolic novolac resins.

In addition, polyphenol compounds such as resorcinol, phenol, etc., which are obtained by condensing the above-mentioned phenol or substituted phenol with an aldehyde other than formaldehyde, such as salicylaldehyde, vanillin, terephthalaldehyde, benzaldehyde, crotonaldehyde, glyoxal, etc., in the presence of an acidic catalyst are also available. These are polyenol compounds obtained by condensing hydroquinone and formaldehyde, polymers of vinylphenol or isopropenylphenol, and copolymers of vinylphenol or impropenylphenol with compounds having polymerizable unsaturated groups. Polyphenols are also used as (B) of the present invention.
Can be used as a hardening agent.

Furthermore, the polyhydroxynaphthalene compound which is a raw material for producing the epoxy resin (A) of the present invention can also be used as the (Bl curing agent) of the present invention.

In the present invention, the blending ratio of the curing agent (B) is preferably 0.5 to 2.0 equivalents of Of-f groups in the curing agent compound to 1 equivalent of the epoxy group in the epoxy resin (A). The amount is 0.7 to 1.5 equivalents.

In the present invention, the curing accelerator (Q) accelerates the reaction between the epoxy resin (A) and the curing agent (fB), thereby accelerating curing. Examples of the curing accelerator include secondary amines, tertiary amines, imidazole, 1.8-
Diaza-bicyclo-(5,4,0)/decene-7, these carboxylic acids, these BF5 salts, organic phosphines, organic phosphine alkyls? v-), 91 phosphites, amine alkyl borates, silane compounds, and the like. Specific examples include 2-(dimethylaminomethyl)phenol, 2,4.6-)lis(tumethylaminomethyl)phenol, benzyltumethylamine,
tertiary amines such as α-methylbenzyldimethylamine; imidazoles such as 2-methylimidazole, 2-phinidylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4methylimidazole; Class, BF, Piperidine, BF
・Monoethylamine, BF, ・2-methylimidazole, 2-ethylhexanoate of 2,4.6-)lis(dimethylaminemethyl)phenol, 1.8-diazabicyclo-(5,4,0)undecene-7 2-ethylhexanoate, 2-methylimidazole acetate,
Triphenylphosphine, tetraphenylphosphine tetraphenyl ester, 1,8-diazabicyclo-(5
, 4,0) undecene-7 (D tetraphenylpyrate, tetraphenylrate of pyridine, triphenylphosphine oxyto, triphenylphosphite, tetramethoxysilane, methyltrimethoxysilane and other silanes, N-p- Examples include chlorophenyl-N,N'-trimethylurea, isopropyl tridodecylbenzenesulfonyl titanate, tetraoctyl bis(ditridecyl phosphere F)) titanate, and the like.

The blending ratio of these (C) curing accelerators is as described above.
, 0.01 to 20% by weight based on tAl epoxy resin,
Preferably it is 0.1 to 5% by weight.

In the present invention, the inorganic filler may be any inorganic filler that is commonly used.

Examples of the inorganic filler include fused silica powder.

Crystalline silica powder 1 Examples include quartz glass powder, talc, calcium silicate powder, zirconium silicate powder, alumina powder, calcium carbonate powder, clay powder, barium sulfate powder, and glass fiber. In particular, silica-based solvents such as Shiriura are preferred. One type of inorganic filler may be used, or two or more types may be used in combination.

(As mentioned above, the blending ratio of the inorganic filler is 50 to 90% by weight, preferably 60 to 85% by weight, based on the total resin composition.
Weight%.

In addition to the above-mentioned components (N to (D)), the epoxy resin composition of the present invention may further contain various other components as required. For example, to improve the adhesion between the inorganic filler and the resin. Coupling agents for increasing fluidity, flow additives and mold release agents for increasing fluidity and improving mold releasability, flame release agents for increasing flame retardancy, and the like can be blended.

Examples of the coupling agent include β-(3,4-
epoxycyclohexyl)ethyltrimethoxysilane,
γ-glycidoxyzorobyl methyljethoxysilane, N
- Silane coupling agents such as β-(aminoethyl)-γ-amine methyltrimethoxysilane, titanium coupling agents such as isopropyl tridodecylbenzenesulfonyl titanate, and tetraisoglopyrubis(dioctylphosphite) titanate. etc. can be mentioned. These coupling agents are mixed with the inorganic filler at a ratio of 1:1 or less. Furthermore, the filler and filler to be blended may be treated with these coupling agents in advance.

Examples of the current wJp4 conditioner and release agent include various waxes, such as carnauba wax, fossil wax montan wax (ester, carboxylic acid, and metal soap type), and oxidized polyethylene wax.

Examples include oleic acid, stearic acid, and their amide compounds. These are used in a proportion of 5 times tS or less based on the total resin composition.

As the flame retardant, boric acid compounds such as lead borate, chlorium metaborate, phosphorus, triphenyl phosphate),
) IJ (bromopropyl) phosphate, triphenylphosphine oxyto, and other phosphorus compounds, which are usually used in a proportion of 80% by weight or less based on the total resin composition.

Antimony compounds such as antimony trioxide, triphenylstibine, and trimethylstibine can also be used as the flame retardant, and these are used in an amount of 5% by weight or less based on the total resin composition.

Furthermore, in order to make the resin composition of the present invention flame retardant, some of the epoxy resins used may be halogenated epoxy resins, such as brominated phenol black type epoxy resins, brominated bisphenol A type epoxy resins, etc. A method of directly mounting with resin or the like can be used.

In the NIXY resin composition of the present invention, a flexibility imparting component which imparts flexibility to a sealing material such as an IC and reduces stress on an element such as an IC can be added (using a suitable method).
It can be made to contain. For example, the flexibility-imparting component may be mixed into the resin composition, or the epoxy resin or curing agent used can be reacted with the flexibility-imparting component in advance. Examples of the flexibility-imparting component include various silicone resins, butadiene-acrylonitrile copolymer resins, carboxyl group-containing butadiene-acrylonitrile copolymer resins, and other copolymer components.

Furthermore, the resin composition of the present invention may contain a pigment such as carzen black for the purpose of coloring, etc., and the proportion thereof is 10% by weight or less based on the total resin composition.

Next, the resin composition of the present invention can be produced according to a conventional method. For example, (A1-(Each component of seaweed is finely pulverized and tri-blended together with the other ingredients listed above, which are blended as necessary), or pulverized after being melted and mixed using a heated roll or an extruder. In addition, the pulverized resin composition of the present invention can be compression molded into tablets used for molding, depending on necessity.

The transfer bottom method is usually the most typical method for sealing electronic components such as semiconductors using the resin composition of the present invention.

(Examples, etc.) The following is a detailed description of polyhydroxynaphthalene compound synthesis examples, polyhydroxyphenol compound synthesis examples, epoxy resin production examples, examples, and comparative examples.

Polyhydroxynaphthalene compound synthesis side
- 1,440 g (10 mol) of naphthol, 1,440 g of chlorobenzene, and 20 g of oxalic acid were charged, and 600.9 (7 mol) of 35% formalin was gradually added dropwise at 90°C. Next, the temperature was gradually raised to 1] QC, and after reacting for 8 hours, the solvent was distilled off, and the mixture was further heated to 5 m
The reaction mixture was heated to 200° C. while reducing the pressure to Hg, water and unreacted substances were distilled off, and the resulting compound was extracted from the reactor to obtain 1500 g of a polyhydroxynaphthalene compound. This compound has a softening point of 170°C and a hydroxyl equivalent of 14
It was 9.

Polyhydroxynaphthalene Compound Synthesis Example 2 Into a reactor similar to that used in Synthesis Example 1, 1,600 g (10 moles) of 1,6-di and droxynaphthalene, 20 g of oxalic acid, and 200 g of water were charged, and 35% by weight formalin was added. Add 6009 and heat gradually to avoid sudden reaction until about 100~
The reaction was carried out at a temperature of 120° C. for 8 hours. After the reaction, 600 g of water was added and stirred at about 100°C. After removing the above water by decantation, the mixture was heated to 1.5 m Hg.
After heating to 200° C. while reducing the pressure at t, the product was extracted. The obtained polyhydroxynaphthalene compound was 17001! It had a softening point of 168° C. and a hydroxyl equivalent of 83.

Polyhydroxynaphthalene Compound Synthesis Example 3 In a reactor similar to that used in Synthesis Example 1, α-naphthol 1440y
(10 mol), p-hydroxybenzaldehyde 732
g (6 mol), p-) luenesulfonic acid 5I was charged,
Gradually heat the reaction at 115°C for 1 hour, and then continue to react for 18
After heating to 0°C and reacting for 8 hours, the product was extracted, cooled and ground. Add 4,000 ml of hot water to the resulting pulverized material.
5111 Hg, stirred and washed, filtered,
It was dried under reduced pressure at 100°C. The produced polyhydroxynaphthalene compound had a molecular weight of 2080.9, a softening point of 250° C. or higher, and a hydroxyl equivalent of 134.

Polyhydroxynaphthalene Compound Synthesis Example 4 Into the same reactor as used in Synthesis Example 1, 1,600 g (10 moles) of 1,6-hydroxynaphthalene, p-hydroxypenzaldehyde 67119 (5.5 moles), p-) Prepare luenesulfone fi 5.9 and gradually heat to 1
After reacting at 40°C for 1 hour, further heating to 180°C and reacting for 8 hours, the product was extracted, cooled and pulverized. The pulverized product was stirred and washed with 4,000.9 g of hot water, filtered, and dried under reduced pressure at 5 mHg and 100°C.

The polyhydroxynaphthalene compound produced is 2100.9
It had a softening point of 175°C and a hydroxyl equivalent of 91.

Polyhydroxynaphthalene compound synthesis example 5 Suritylaldehyde 7 instead of p-hydroxybenzaldehyde
32.9 (6 mol) was used, otherwise the reaction was carried out in the same manner as in Synthesis Example 3, and the post-treatment was carried out in the same manner to obtain a polybitroxynaphthalene compound 2090. ! I got i'. Its softening point was 250°C or higher, and its hydroxyl equivalent was 132.

Polyhydroxynaphthalene compound synthesis example 6 Instead of p-hydroxybenzaldehyde, /9=IJn836
Polyhydroxynaphthalene compound 2255.9 was obtained in the same manner as in Synthesis Example 4 except that '(5.5 mol) was used. Its softening point is 165°C, and its hydroxyl equivalent is 109
Met.

Epoxy resin production example 1 In a reactor equipped with a stirring device and a reflux condenser, compounds 300, 9. epichlorohydrin 222
1.8 g of 0,9, tetramethylammonium chloride was charged, and the mixture was reacted for 2 hours under heating and reflux. Next, the contents were cooled to 60° C., and a water removal device was attached, and 88 g of sodium hydroxide was added thereto to carry out a ring-closing reaction. The reaction product was filtered and further washed with water to remove by-produced common salt, and 370 g of epoxy resin was prepared. Its epoxy equivalent is 2361
The softening point was 115°C. In addition, the remaining epichlorohydrin was recovered by distilling the tear fluid under reduced pressure.

Epoxy Resin Production Example 2 245 g of an epoxy resin was produced in the same manner as in Production Example 1 except that 170 g of the compound obtained in Synthesis Example 2 was used as a substitute for the compound obtained in Synthesis Example]. The obtained epoxy resin had an epoxy equivalent of 173 and a softening point of 80°C.

Epoxy Resin Production Example 3 335 g of an epoxy resin was produced in the same manner as in Production Example 1 except that Compound 2709 obtained in Synthesis Example 3 was used as a substitute for the compound obtained in Synthesis Example 1. The epoxy resin No. 7 had an epoxy equivalent of 228 and a softening point of 105°C.

Epoxy resin production example 4 Epoxy resin 260I was obtained in the same manner as in production example 1 except that compound 185y obtained in synthesis example 4 was used as substitute 9 of the compound obtained in synthesis example 1.

The epoxy resin had an epoxy equivalent of 175 and a softening point of 50°C.

Epoxy Resin Production Example 5 In place of the compound obtained in Synthesis Example 1, 270 g of the compound obtained in Synthesis Example 5 was used, but in the same manner as in Production Example 1 except for that, 333 g of an epoxy resin was obtained.

The epoxy resin had an epoxy equivalent of 224 and a softening point of 95°C.

Epoxy Resin Production Example 6 In place of the compound obtained in Synthesis Example 1, compound 2209 obtained in Synthesis Example 6 was used, but in the same manner as in Production Example 1 except for that, 290 g of an epoxy resin was obtained.

The epoxy resin has an epoxy equivalent weight of 200. The softening point was 45°C.

Synthesis example of polyhydroxyphenol compound! In a reactor similar to that used in Synthesis Example 1, phenol 1504.9 (
16 mol), salicylaldehyde 244. F (2 moles)
was charged, and the contents were heated to 80°C while stirring. Next, 26 g of concentrated hydrochloric acid was gradually added dropwise from the dropping funnel, and the temperature was raised to 100° C. while controlling to prevent excessive heat generation, and the mixture was reacted at 100° C. for 3 hours. Next, the reflux condenser of the reactor was replaced with a cooling separator, and the inside of the system was heated to 150°C.
The mixture was further heated to 190°C under a reduced pressure of 5 w Hg to distill off hydrochloric acid, water, and unreacted phenol.
f! Rehydroxyphenol compound 6089 was obtained.

This compound had a softening point of 110° C. and a hydroxyl equivalent of 96 by microscopy.

Epoxy resin production example I In place of the compound obtained in synthesis example 1, a synthesis example! Epoxy resin 4049 was obtained in the same manner as in Production Example 1 except that 292 g of the compound obtained in Example 1 was used.

The epoxy resin had an epoxy equivalent of 167 and a softening point of 43°C.

Examples 1 to 6 Comparative Examples I to ■ As epoxy resins, each epoxy resin obtained in Epoxy Resin Production Examples 1 to 6, Epoxy Resin Production Examples! The epoxy resin obtained in Table 1, a commercially available O-cresol nomelac edexy resin, and a commercially available brominated phenol nogelac epoxy resin were used as shown in Table 1, and a curing agent, as shown in Table 1, was used. Blend the curing accelerator, inorganic filler and other compounding agents, and roll it to 70 to 110 using two rolls.
The mixture was kneaded at a temperature of 0.degree. C., and the mixed material was cooled, pulverized, and pressure-molded into tablets using a tablet machine.

Each of the obtained tablets was molded using a transfer molding machine at 180° C. and a pressure cuff of 0 Yu/cM for 2.3 minutes, and then post-cured at 180° C. for 6 hours. The glass transition temperature, bending strength, bending elastic modulus, and linear expansion coefficient of each of the obtained cured resins were as shown in the first difference.

Further, using each resin composition, a semiconductor element was placed on a die-dending grate of 8m×B■.

80 pin Qua with a size of 14w x 20m x 2.25m
d. A flat package was formed.

After each of the obtained knot cages was allowed to absorb moisture for 72 hours at 85°C and 85% RHi, it was subjected to a 215°C pot-face soldering process for 90 seconds, and the presence or absence of cracks was examined. Similarly, a semiconductor element was placed on a 6.4 wn x 6.4 tm die bonding plate, a flat package was formed, and after the same moisture absorption treatment, it was heated to 260°C. The samples were immersed in a powder bath for 10 seconds, and the occurrence of cracks was examined. The results are shown in Table 1.

Notes to Table 1: ・1...Product name of Yuka Shell Epoxy Co., Ltd. Epicoat 1801 Epoxy equivalent weight 210 Middle 2...Nippon Kayaku Co., Ltd. Brand name Prene, epoxy equivalent weight 285 Middle 3...Aurayo Kagakusha Co., Ltd. Product name: Tamanol 752, hydroxyl equivalent: 104 ㎟4...Silicone resin obtained by condensation of dimethyldimethoxysilane and γ-glycidoxysolobyltrimethoxysilane-5...Nippon Unicar Co., Ltd. Product name: NUC Silicone A- 186 6th grade...Evaluation criteria are as follows.

O: Pass ×: Fail As is clear from the results in Table 1, the epoxy resins of each example had significantly superior cured resin physical properties overall, and particularly It has a high glass transition temperature, has excellent heat resistance, and significantly reduces the occurrence of crack cage cracks during soldering after absorbing moisture.

(C) Effects of the Invention The epoxy resin composition of the present invention has a high glass transition temperature of the cured resin, has excellent heat resistance, has high mechanical strength, and has low hygroscopicity, so that it can be molded easily. Since the occurrence of cracks is extremely low even in the 71-under treatment after the cage absorbs moisture, it is suitable for sealing electronic components such as transistors and ICs, especially those components that require heat resistance.

Claims (1)

[Claims] (1) An epoxy resin composition for encapsulating electronic components, characterized by containing each of the following components (A) to (D). (A): An epoxy resin produced from epihalohydrin and a polyhydroxynaphthalene compound obtained by a condensation reaction of at least one hydroxynaphthalene compound selected from naphthol and dihydroxynaphthalene with an aldehyde. (B): Curing agent consisting of a compound having two or more phenolic hydroxyl groups in one molecule (C): Curing accelerator (D): Inorganic filler