JPH02188474A - Joining material for silicon nitride sintered body and joining method - Google Patents
Joining material for silicon nitride sintered body and joining methodInfo
- Publication number
- JPH02188474A JPH02188474A JP803089A JP803089A JPH02188474A JP H02188474 A JPH02188474 A JP H02188474A JP 803089 A JP803089 A JP 803089A JP 803089 A JP803089 A JP 803089A JP H02188474 A JPH02188474 A JP H02188474A
- Authority
- JP
- Japan
- Prior art keywords
- silicon nitride
- joining
- sintered body
- bonding material
- nitride sintered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052581 Si3N4 Inorganic materials 0.000 title claims abstract description 47
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 239000000463 material Substances 0.000 title claims abstract description 39
- 238000005304 joining Methods 0.000 title claims abstract description 8
- 238000000034 method Methods 0.000 title claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 18
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000843 powder Substances 0.000 claims abstract description 9
- 239000012298 atmosphere Substances 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 17
- 230000001590 oxidative effect Effects 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000203 mixture Substances 0.000 abstract description 5
- 238000002156 mixing Methods 0.000 abstract description 3
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 3
- 230000008646 thermal stress Effects 0.000 abstract description 2
- 229910004481 Ta2O3 Inorganic materials 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- 229910001936 tantalum oxide Inorganic materials 0.000 description 14
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 6
- 239000000292 calcium oxide Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は、接合温度が低く、かつ、高温下において高い
接合強度を有する窒化けい素の接合方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a method for bonding silicon nitride, which has a low bonding temperature and high bonding strength at high temperatures.
「従来の技術」
一般に、セラミックスは優れた耐熱性、耐蝕性、薬品性
、硬度・耐摩耗性、絶縁性を有していることが知られて
おり、これらの特徴を利用して製造部材としての研究開
発が活発にすすめられている。"Conventional technology" Ceramics are generally known to have excellent heat resistance, corrosion resistance, chemical resistance, hardness/abrasion resistance, and insulation properties, and these characteristics can be used to make them into manufacturing components. Research and development is being actively promoted.
特に窒化けい素は、ガスタービンローターやファンブレ
ードライナーなどの高温下で高強度かつ高耐摩耗性が要
求される部材や、さらには溶融金属や化学反応管の耐蝕
性ライニング部材などに好適な材料として注目されてい
る。In particular, silicon nitride is a material suitable for parts that require high strength and high wear resistance under high temperatures, such as gas turbine rotors and fan blade liners, as well as corrosion-resistant lining parts for molten metal and chemical reaction tubes. It is attracting attention as
しかしながら、このようなセラミックスにおいては複雑
な形状のものを一体的に製造することが非常に困難であ
るため、複雑形状の製品を得るには通常セラミックスど
うしを接合して製品を作製するのが普通である。However, it is extremely difficult to manufacture ceramics with complex shapes in one piece, so in order to obtain products with complex shapes, it is common to create products by bonding ceramics together. It is.
このようにセラミックスどうし、さらにはセラミックス
と金属とを接合する方法としては、現在ａ機質・無機質
接着剤を使用する接着剤法、セラミックス表面をメタラ
イズし、ろう材を用いて接合するろう材法などが知られ
ている。Currently, there are two ways to bond ceramics together, and even ceramics and metals: the adhesive method, which uses organic or inorganic adhesives, and the brazing method, which involves metallizing the surface of the ceramic and bonding it with a brazing material. etc. are known.
「発明か解決しようとする課題」
しかしながら、上記の有機接着剤による接合法では、そ
の使用温度が２００℃と低く、強度的にも１０ ｋｇ／
ｍｍ”以下と不十分である。またろう材法では、有機
接着材に比較して高温まで強い強度を示すものの、酸化
雰囲気下での使用温度がせいぜい６００℃以下であり、
窒化けい素の利点とされる１０００℃以上の使用に耐え
得るには未だ不十分である。``Problem to be solved by the invention'' However, in the above-mentioned bonding method using organic adhesive, the operating temperature is as low as 200°C, and the strength is 10 kg/
mm'' or less, which is insufficient.Furthermore, although the brazing filler metal method shows stronger strength up to high temperatures than organic adhesives, the operating temperature in an oxidizing atmosphere is at most 600°C or lower;
It is still insufficient to withstand use at temperatures above 1000°C, which is an advantage of silicon nitride.
「課題を解決するための手段」
この発明では、酸化カルシウム（Ｃａｏ ）と、無水け
い酸（Ｓ＋Ｏｔ）と、酸化タンタル（Ｔａｓｋ５）とを
含有してなる接合材により、窒化けい素焼結体を接合す
るようにして上記課題を解決した。"Means for Solving the Problem" In this invention, silicon nitride sintered bodies are bonded using a bonding material containing calcium oxide (Cao), silicic anhydride (S+Ot), and tantalum oxide (Task 5). The above problem was solved in this way.
すなわち、本発明者は上記課題を解決するべく鋭意研究
の結果、酸化カルシウム（Ｃａｏ ）と無水けい酸（Ｓ
ｉＯ２）と酸化タンタル（ＴａｚＯｓ）とからなる接合
材が窒化けい素焼結体どうしの接合に対して有効である
ことを見い出すとともに、この接合材に窒化けい素（ｓ
ｉｉＮ＋）を添加することによってさらに接合強度が向
上することを見い出した。That is, as a result of intensive research in order to solve the above problems, the present inventor has developed calcium oxide (Cao) and silicic anhydride (S).
It was discovered that a bonding material consisting of tantalum oxide (TazOs) and tantalum oxide (TazOs) is effective for bonding silicon nitride sintered bodies together.
It has been found that the addition of iiN+) further improves the bonding strength.
以下、本発明を具体的に説明する。The present invention will be specifically explained below.
本発明の請求項Ｉ１．：記載した接合材を作製するには
、まず酸化カルシウム（Ｃａｏ ）、無水けい酸（Ｓｉ
ｎ、）、酸化タンタル（Ｔ ａｅｏ ｓ）の各粉末また
はこれらの混合粉末を用意し、均一に混合する。ここで
粉末を用意するにあたっては、酸化カルシウム（ＣａＯ
）、無水けい酸（Ｓｉｎ−）、酸化タンタル（ＴａｔＯ
ｓ）のうちの２種もしくは３種の粉末を混合し、−已然
処理した後粉砕して再度粉末としたしのを使用Ｊ−るの
が好ましい。またこの場合、酸化力ルンウム、無水けい
酸、酸化タンタルの代わりに、熱処理過程において酸化
物となるカルシウム、けい素、タンタルのそれぞれの化
合物を使用してもよい。Claim I1. : To produce the described bonding material, first, calcium oxide (Cao), silicic anhydride (Si
), tantalum oxide (Taeos) powder, or a mixed powder thereof are prepared and mixed uniformly. In preparing the powder here, calcium oxide (CaO
), silicic anhydride (Sin-), tantalum oxide (TatO
It is preferable to mix two or three of the powders of s), process the mixture, and then grind it to form a powder again. Moreover, in this case, each compound of calcium, silicon, and tantalum, which become oxides during the heat treatment process, may be used instead of oxidizing aluminum, silicic anhydride, and tantalum oxide.
酸化カルシウムと無水けい酸との重量比は、酸化カルシ
ウムｌに対し無水けい酸が０．２〜５、ｏ１好ましくは
０．５〜２．０とされ、これ以外の範囲では融点が高く
なり良好な結合状態が得られず不適である。特に酸化カ
ルシウムの比が高い場合には、接合材の熱膨張率が大き
くなり、接合界面において窒化けい素との熱膨張差に起
因して亀裂が生じる。The weight ratio of calcium oxide and silicic anhydride is 0.2 to 5, preferably 0.5 to 2.0, silicic anhydride to calcium oxide l, and outside of this range, the melting point will be high and it will be good. It is unsuitable because a suitable bonding state cannot be obtained. In particular, when the ratio of calcium oxide is high, the coefficient of thermal expansion of the bonding material increases, and cracks occur at the bonding interface due to the difference in thermal expansion with silicon nitride.
酸化タンタルの配合量は、０．１〜８０ｗｔ％、好まし
くは５〜４０ｖｔ％とされる。すなわち、０１ｖｔ％以
下では後述するような酸化タンタル配合の効果がなく、
８０ｗｔ％以上では接合材全体の融点が高くなって接合
温度が上昇するとともに、接合時における酸化タンタル
の還元に伴う酸素の発生が顕著となり、良好な接合材が
得られないためである。The amount of tantalum oxide blended is 0.1 to 80 wt%, preferably 5 to 40 wt%. In other words, below 0.1vt%, there is no effect of tantalum oxide compounding as will be described later.
This is because if the content exceeds 80 wt%, the melting point of the entire bonding material becomes high and the bonding temperature rises, and oxygen generation due to the reduction of tantalum oxide during bonding becomes significant, making it impossible to obtain a good bonding material.
このような配合の接合材にあっては、酸化カルシウムと
無水けい酸とに第三成分として酸化タンタルを添加した
ので、接合材の融点が低下し、窒化けい素との濡れ性が
向上する。また、窒化けい素の接合にあたり、窒化けい
素から接合材への窒素固溶量の増加に伴って結合相の強
度が増加し、さらに熱膨張率の低下によって窒化けい素
との接合時における熱応力が低減する。In the bonding material having such a composition, since tantalum oxide is added as a third component to calcium oxide and silicic anhydride, the melting point of the bonding material is lowered and the wettability with silicon nitride is improved. In addition, when bonding silicon nitride, the strength of the binder phase increases with the increase in the amount of solid solution of nitrogen from silicon nitride to the bonding material, and furthermore, due to the decrease in the coefficient of thermal expansion, the heat generated during bonding with silicon nitride increases. Stress is reduced.
また、本発明の請求項４に記載した接合材を作製するに
は、酸化カルシウム、無水けい酸、酸化タンタルに加え
て窒化けい素（ｓｉｉＮ４）粉を添加する。ここで、酸
化カルシウム、無水けい酸、酸化タンタルの配合につい
ては先に説明した請求項１に記載の接合材と同様である
。また、窒化けい素粉の添加量は０．Ｏ１〜８０ｖＬ％
、好ましくはｌＯ〜５０ｖｔ％とされ、８０ｗｔ％を越
えると融点が高くなり過ぎて好ましくない。Furthermore, in order to produce the bonding material according to claim 4 of the present invention, silicon nitride (siiN4) powder is added in addition to calcium oxide, silicic anhydride, and tantalum oxide. Here, the blending of calcium oxide, silicic anhydride, and tantalum oxide is the same as that of the bonding material according to claim 1 described above. In addition, the amount of silicon nitride powder added was 0. O1~80vL%
, preferably 10 to 50 wt%; if it exceeds 80 wt%, the melting point becomes too high, which is not preferable.
このような配合の接合材にあっては、窒化けい素粉を添
加することによって接合材中の窒素量が増加し、これに
より結合相の強度が増加するとともに、熱膨張率の低下
によって窒化けい素との接合時における熱応力が低減す
る。In a bonding material with such a composition, adding silicon nitride powder increases the amount of nitrogen in the bonding material, which increases the strength of the binder phase, and reduces the coefficient of thermal expansion of silicon nitride. Thermal stress during bonding with the base material is reduced.
これらの接合材を用いて窒化けい素焼給体を接合するに
は、まず窒化けい素焼給体表面に接合材を塗布し、非酸
化雰囲気にて熱処理を施して接合材を溶融被覆せしめ、
その後窒化けい素焼給体を接合する。ここで、接合材を
一旦溶融し、その後窒化けい素焼給体を接合するのは以
下の理由による。すなわち、酸化タンタルは非化学虫論
的・化合物となり易い化合物であるため、非酸化雰囲気
中にて加熱されて酸素ガスを発生し易く、また窒化けい
素との反応でもガスを発生する。したがって、上記接合
材を介して窒化けい素焼給体を直接（−回で）接合した
場合には、発生したガスにより接合界面に気泡が生成し
、接合強度が低下するからである。To bond a silicon nitride burner using these bonding materials, first apply the bonding material to the surface of the silicon nitride burner, heat treat it in a non-oxidizing atmosphere to melt and coat the bonding material,
After that, the silicon nitride heat source is joined. Here, the reason why the bonding material is once melted and then the silicon nitride burner is bonded is as follows. That is, since tantalum oxide is a non-chemical compound that easily forms into compounds, it easily generates oxygen gas when heated in a non-oxidizing atmosphere, and also generates gas when reacted with silicon nitride. Therefore, if the silicon nitride burner is directly bonded (-times) via the bonding material, bubbles will be generated at the bonding interface due to the generated gas, and the bonding strength will be reduced.
そして、上記接合方法によれば、最終接合温度より高い
温度で一旦熱処理することにより、接合時におけるガス
の発成量を低減することができ、気泡の少ない接合材を
得ることか可能となる。According to the above bonding method, by once performing heat treatment at a temperature higher than the final bonding temperature, the amount of gas generated during bonding can be reduced, making it possible to obtain a bonding material with fewer bubbles.
「実施例」
以下、本発明を請求項４に記載した発明の一実施例に基
づいて詳細に説明する。"Example" Hereinafter, the present invention will be described in detail based on an example of the invention set forth in claim 4.
まず、酸化カルシウム（ＣａＯ）と無水けい酸（ＳｉＯ
７）と酸化タンタル（Ｔ ａｙＯｓ ）とα−窒化けい
素（α−Ｓ １３Ｎ ４ ）とを第１表に示した１〜５
の組成に配合し、メノー乳鉢で混合するとと乙に市販の
スクリーンオイルを加えてペースト化した一次に、寸法
が２０Ｘ２０Ｘ２０ｍｍの立法体形の窒化けい素を２個
用意し、これらの−表面にそれぞれ上記ペーストを塗布
して乾燥した。次いで、窒素雰囲気中にて１４３０℃で
熱処理し、窒化けい素焼給体表面に反応相を生成せしめ
た。First, calcium oxide (CaO) and silicic anhydride (SiO
7), tantalum oxide (T ayOs ), and α-silicon nitride (α-S 13N 4 ) as shown in Table 1.
After mixing in an agate mortar and adding commercially available screen oil to make a paste, prepare two cube-shaped silicon nitride pieces with dimensions of 20 x 20 x 20 mm, and place the above on each surface. Apply the paste and let it dry. Next, heat treatment was performed at 1430° C. in a nitrogen atmosphere to generate a reaction phase on the surface of the silicon nitride burner.
その後、窒化けい素焼給体の反応相面どうしを合わせ、
常圧下で接合を行った。After that, the reactive phase surfaces of the silicon nitride firing body are aligned,
Bonding was performed under normal pressure.
接合後、一体化した試料から３Ｘ４Ｘ４０ｍｍの試験片
を切りだし、４点曲げ強度試験（下スパン３３０ｍｍ、
上スパン長１０ｍｍ、クロスヘツドスピード０ 、５
ｍｍ／ ｗｉｎ ）により接合強度を測定し、その結果
を第１表に示した。After joining, a 3x4x40mm test piece was cut out from the integrated sample and subjected to a 4-point bending strength test (bottom span 330mm,
Upper span length 10mm, crosshead speed 0, 5
The bonding strength was measured by mm/win) and the results are shown in Table 1.
第１表に示した結果より、本発明の接合材を用いて接合
された窒化けい素試料は、優れた接合強度を有している
ことが確認された。From the results shown in Table 1, it was confirmed that the silicon nitride samples bonded using the bonding material of the present invention had excellent bonding strength.
第１表
■
実施例
第８表−２
以下余白
＝４；−
「発明の効果」
以上説明したように、本発明における窒化けい素焼縮体
の接合材は、金属酸化物あるいは金属酸化物・窒化物混
合体からなるものであり、これを窒化けい素に溶融被覆
せしめ、この溶融体に窒化けい素あるいは金属等を接合
することにより、最終の接合温度を低く抑えることがで
き、かつ優れた接合強度を存する窒化けい素焼縮体の接
合体を得ることかできる。Table 1 ■ Examples Table 8 - 2 Below margin = 4; By melting and coating silicon nitride with this mixture and bonding silicon nitride or metal to this melt, the final bonding temperature can be kept low and an excellent bond can be achieved. It is possible to obtain a bonded body of sintered silicon nitride that has strength.
また、本発明における接合方法によれば、上記接合材を
用いることにより高強度の窒化けい常接合体を作製する
ことができる。Furthermore, according to the bonding method of the present invention, a high-strength silicon nitride bonded body can be produced by using the above-mentioned bonding material.
Claims (8)
Ｏ＿２）と、酸化タンタル（Ｔａ＿２Ｏ＿５）とを含有
してなることを特徴とする窒化けい素焼結体用接合材。(1) Calcium oxide (CaO) and silicic anhydride (Si
1. A bonding material for silicon nitride sintered bodies, characterized in that it contains tantalum oxide (Ta_2O_5) and tantalum oxide (Ta_2O_5).
ウム（ＣａＯ）に対して無水けい酸（ＳｉＯ＿２）の割
合が０．２〜５．０重量比であることを特徴とする窒化
けい素焼結体用接合材。(2) The bonding material according to claim 1, characterized in that the ratio of silicic anhydride (SiO_2) to calcium oxide (CaO) is 0.2 to 5.0 by weight. Bonding material for the body.
ル（Ｔａ＿２Ｏ＿５）の割合が０．１〜８０重量％であ
ることを特徴とする窒化けい素焼結体用接合材。(3) The bonding material for a silicon nitride sintered body according to claim 1, wherein the proportion of tantalum oxide (Ta_2O_5) is 0.1 to 80% by weight.
（Ｓｉ＿３Ｎ＿４）粉を０．０１〜８０重量％添加した
ことを特徴とする窒化けい素焼結体用接合材。(4) A bonding material for a silicon nitride sintered body according to claim 1, characterized in that 0.01 to 80% by weight of silicon nitride (Si_3N_4) powder is added thereto.
材を塗布し、熱処理により接合材を溶融被覆せしめた後
、窒化けい素焼結体を接合することを特徴とする窒化け
い素焼結体の接合方法。(5) Silicon nitride sintering, characterized in that the bonding material according to claim 1 is applied to the surface of the silicon nitride sintered body, the bonding material is melted and coated by heat treatment, and then the silicon nitride sintered body is bonded. How to join the body.
材を塗布し、熱処理により接合材を溶融被覆せしめた後
、窒化けい素焼結体を接合することを特徴とする窒化け
い素焼結体の接合方法。(6) Silicon nitride sintering, characterized in that the bonding material according to claim 4 is applied to the surface of the silicon nitride sintered body, the bonding material is melted and coated by heat treatment, and then the silicon nitride sintered body is bonded. How to join the body.
雰囲気を非酸化雰囲気もしくは真空雰囲気で行うことを
特徴とする窒化けい素焼結体の接合方法。(7) A method for joining silicon nitride sintered bodies according to claim 5, characterized in that the heat treatment is performed in a non-oxidizing atmosphere or a vacuum atmosphere.
雰囲気を非酸化雰囲気もしくは真空雰囲気で行うことを
特徴とする窒化けい素焼結体の接合方法。(8) A method for joining silicon nitride sintered bodies according to claim 6, characterized in that the heat treatment is performed in a non-oxidizing atmosphere or a vacuum atmosphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP803089A JPH02188474A (en) | 1989-01-17 | 1989-01-17 | Joining material for silicon nitride sintered body and joining method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP803089A JPH02188474A (en) | 1989-01-17 | 1989-01-17 | Joining material for silicon nitride sintered body and joining method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02188474A true JPH02188474A (en) | 1990-07-24 |
Family
ID=11681942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP803089A Pending JPH02188474A (en) | 1989-01-17 | 1989-01-17 | Joining material for silicon nitride sintered body and joining method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02188474A (en) |
-
1989
- 1989-01-17 JP JP803089A patent/JPH02188474A/en active Pending
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