JPH02180552A - Polishing device - Google Patents
Polishing deviceInfo
- Publication number
- JPH02180552A JPH02180552A JP64000105A JP10589A JPH02180552A JP H02180552 A JPH02180552 A JP H02180552A JP 64000105 A JP64000105 A JP 64000105A JP 10589 A JP10589 A JP 10589A JP H02180552 A JPH02180552 A JP H02180552A
- Authority
- JP
- Japan
- Prior art keywords
- surface plate
- plate
- spherical
- shaft
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 14
- 230000003068 static effect Effects 0.000 claims abstract description 12
- 238000003754 machining Methods 0.000 claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
- 239000012530 fluid Substances 0.000 claims description 8
- 230000002706 hydrostatic effect Effects 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 230000003746 surface roughness Effects 0.000 abstract description 6
- 230000008878 coupling Effects 0.000 abstract description 5
- 238000010168 coupling process Methods 0.000 abstract description 5
- 238000005859 coupling reaction Methods 0.000 abstract description 5
- 239000011882 ultra-fine particle Substances 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 229910003460 diamond Inorganic materials 0.000 description 8
- 239000010432 diamond Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005461 lubrication Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
この発明は、被加工物を例えば表面粗さ数又ｒｍｓ程度
の球面に加工することのできる研磨装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a polishing apparatus that can process a workpiece into a spherical surface with a surface roughness of, for example, a number or rms.
（従来の技術）
近時、フロートポリジングによる超精密研磨が実用に供
されている。第４図は、フロートポリシング装置を示す
もので、ポリシャに相当する円板状の錫うップ囚が有底
円筒状の加工槽（均に同軸に収納されている。そして、
錫うップ囚の上面には、旋削−こより渦状溝（Ｑが形成
され、残りの部位は平面に仕上げられている。このよう
な加工槽（Ｂ）Ｊζ研磨液（至）を満し、この研磨ｉｎ
に浸漬した状態で、ホルダ（＠ 化取付けられた被加工
物■・・・を錫ラップ（４）に押し付け、毎分６０〜２
００回転で高精度回転すると、錫うップ囚の安定した回
転による遠心力で厚さ数μ鶏の液膜０が形成される。こ
の液膜（２）の動圧流体潤滑状態の平滑化作用により被
加工物■・・・は、錫うップ囚と接触せず、浮上した状
態で加工が進行する。この場合、錫うップ囚各部の平面
度を集櫃したものが被加工物（′ｙ１・・・に転写され
る。それだけに、錫ラップ（Ａ）の平面加工は、例えば
直径４６０ｍｍの場合１μ屡程度に高精度加工する必要
がある。(Prior Art) Recently, ultra-precision polishing by float polishing has been put into practical use. Fig. 4 shows a float polishing device, in which a disc-shaped tin container corresponding to a polisher is housed uniformly and coaxially in a cylindrical processing tank with a bottom.
A spiral groove (Q) is formed on the upper surface of the tin holder, and the remaining part is finished flat. This polishing in
While immersed in
When rotated with high precision at 00 rpm, a liquid film several microns thick is formed due to the centrifugal force caused by the stable rotation of the tin cap. Due to the smoothing effect of the hydrodynamic lubrication state of the liquid film (2), the workpiece (1) does not come into contact with the tin bubbly, and processing proceeds in a floating state. In this case, the flatness of each part of the tin wrap is transferred to the workpiece ('y1...).Therefore, the flatness of the tin wrap (A) is 1 μm when the diameter is 460 mm. It is often necessary to perform highly accurate machining.
ところで、錫うップ囚の平面加工は、この錫うップ囚を
定盤軸０に取り外し不可能なように固設した状態で、付
随のダイヤモンドエＡ（’Ｉ５Ｊこより行う。しかる後
、加工槽（Ｂ）を設けるようにしているので、錫うップ
囚の平面度は研磨時も保ハ・される。By the way, the planar processing of the tin-covered plate is carried out using the accompanying diamond air A ('I5J) while the tin-covered plate is fixed to the surface plate shaft 0 so as not to be removable.After that, Since the processing tank (B) is provided, the flatness of the tin plate is maintained even during polishing.
しかしながら、このような従来の研磨装置は、錫うップ
囚の取り外しが困難であることにより、錫うップ囚の加
工は、付随のダイヤモンド工具（Ｔ５のみに依存せざる
を得ない。したがって、このダイヤモンド工具（℃では
、錫うップ囚を平面にしか加工することができず、その
結果、フロートポリジングを行う被加工物（Ｆ５・・・
も平面研磨に限定されていた。However, with such conventional polishing equipment, it is difficult to remove the tin cap, so the machining of the tin cap must rely only on the accompanying diamond tool (T5. , this diamond tool (at ℃) can only process the tin-filled surface into a flat surface, and as a result, the workpiece (F5...
It was also limited to flat surface polishing.
（発明が解決しようとする課題）
本発明は、従来のフロートポリジング装置が平面加工し
かできないことに着目してなされたもので、球面の被加
工物も表面粗さ数Ｘｒｍｓに加工することのできる研磨
装置を提供することを目的とする。(Problems to be Solved by the Invention) The present invention was made by focusing on the fact that conventional float polishing machines can only process flat surfaces. The purpose is to provide a polishing device that can.
ＣＭＩＡｍを解決するための手段と作用）被加工物をフ
ロート・ポリシンクにより研磨する研磨装置において、
球面部位が形成された定盤を装置本体に容易に着脱でき
るように取付け、別設された加工機により上記球面部位
を球面加工するようにしたものである。Means and operation for solving CMIAm) In a polishing device that polishes a workpiece using a float polysink,
A surface plate on which a spherical portion is formed is attached to the main body of the device so as to be easily attachable and detachable, and the spherical portion is processed into a spherical surface using a separately provided processing machine.
（実施例） 以下、本発明の一実施例を図面を参照して詳述する。(Example) Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.
第１図及び第２図は、この実施例の研磨装置を示してい
る。この装置は、錫（Ｓｎ）製の定盤（υを保持して矢
印（２）方向に回転させる定盤保持部（３）と、公称径
７０Ｘのｓｉｏ、超微粒子を純水もしくは蒸留水中に２
〜３重量％含有する加工液（４）を収納して定盤（１）
と一体的に回転する加工液保持部（５）と、被加工物（
５）を保持して定盤（１）に対して当接させる被加工物
保持部（６）とからなりている。しかして、定盤保持部
（３）は、円板状の定盤（１）と、この定盤（１）を直
接支持する定盤基部（８）と、この定盤基部（８）が取
付けられる定盤軸（９７を有しこの定盤軸（９７を回転
自在に軸支する軸受部α１と、定盤軸（９Ｊを回転駆動
する回転駆動部優りとからなっている。そして、定盤（
１）は、中央部に円形の貫通孔α４が穿設されている。1 and 2 show the polishing apparatus of this embodiment. This device consists of a surface plate holder (3) that holds a surface plate (υ) made of tin (Sn) and rotates it in the direction of arrow (2), an sio glass with a nominal diameter of 70X, and ultrafine particles in pure water or distilled water. 2
A surface plate (1) containing processing liquid (4) containing ~3% by weight is stored.
A machining fluid holding part (5) that rotates integrally with the workpiece (
5) and a workpiece holding section (6) that holds the workpiece and brings it into contact with the surface plate (1). Therefore, the surface plate holding part (3) includes a disk-shaped surface plate (1), a surface plate base (8) that directly supports this surface plate (1), and a surface plate base (8) that is attached to the disk-shaped surface plate (1). The surface plate shaft (97) has a surface plate shaft (97) which is rotatably supported by the bearing part α1, and the surface plate shaft (9J) is rotatably driven by a rotary drive part. (
1) has a circular through hole α4 bored in the center.
そして、この定盤（１）の下端面は平面に、また、上端
面は球面０によりそれぞれダイヤモンド切削されている
。この球面α１ζは、渦巻状のｍｕ４・・・が、溝幅１
箇、Ｒさ０．５〜１園、ピッチ１．５〜２讃で刻設され
ている。また、溝Ｉ・・・以外の部分は、表面粗さが３
μｍ８２程度に加工されている。一方、定盤基部＋８）
は、定盤＜１）と同一外径の円板に形成され中央部ｔｃ
ｐ通孔時より径小の貫通孔α９が穿設され定盤（１）が
接着剤により感層される例えば銅調の基板−と、中央上
部に基板端の貫通孔−が嵌合する円柱状の突出部顛が同
軸に突設され基板はｅよりも外径が大きく且つ高さが基
板αｅと同一の底板伍榎と、貫通孔αの内に同軸に遊挿
され且つ突出部αηの外径よりも大きな外径を有する円
板状の締結板−を介して突出部−に螺着され基板αＱを
締結板−と底板顛とｌζより挾持固定ｒる第１のボルト
（至）・・・とからなりている。他方、軸受部αｌは、
図示せぬ支持部材に固設された静圧軸受体（２１）と、
この静圧軸受体Ｑ１）によりスラスト方向及びラジアル
方向に静圧軸支される定盤軸（９１と、静圧軸受体ｆ２
Ｄにて静圧を発生させる高圧を供給する高圧空気供給部
四と、定盤軸（９７の上端部に同軸に取付けられ且つ定
盤軸（９）よりも外径がわずかに大きい取付板（至）と
、底盤α場を介して取付板（至）に螺着され定盤基部（
８）を軸受部α・と、取付板＠と底板餞とを一体的に連
結する第２のボルト（至）と、取付板（至）と底板−と
の間に介挿されたリング状のパツキン（ハ）とからなり
ている。The lower end surface of this surface plate (1) is diamond cut into a flat surface, and the upper end surface is diamond cut into a spherical surface. This spherical surface α1ζ has a spiral mu4... with a groove width of 1
It is carved with a radius of 0.5 to 1 inch and a pitch of 1.5 to 2 degrees. In addition, the surface roughness of the parts other than the groove I is 3.
It is processed to about 82 μm. On the other hand, surface plate base +8)
is formed into a disk with the same outer diameter as the surface plate <1), and the central part tc
A through-hole α9 with a smaller diameter than that for the P-hole is drilled, and the surface plate (1) is sensitively layered with adhesive.For example, a copper-like board is formed, and the through-hole at the end of the board fits into the circle in the upper center. The base plate has a column-shaped protruding part protruding coaxially and has a larger outer diameter than e and the same height as the base plate αe, and a protruding part αη that is loosely inserted coaxially into the through hole α. A first bolt (to) which is screwed onto the protrusion via a disc-shaped fastening plate having an outer diameter larger than the outer diameter, and clamps and fixes the board αQ between the fastening plate and the bottom plate. It consists of... On the other hand, the bearing part αl is
a static pressure bearing body (21) fixed to a support member (not shown);
A surface plate shaft (91) supported by static pressure in the thrust direction and radial direction by this static pressure bearing Q1) and a static pressure bearing f2
A high-pressure air supply unit 4 that supplies high pressure to generate static pressure at D, and a mounting plate that is coaxially attached to the upper end of the surface plate shaft (97) and has a slightly larger outer diameter than the surface plate shaft (9). ) is screwed to the mounting plate (to) via the bottom plate α field and the surface plate base (to).
8), a second bolt (to) that integrally connects the bearing part α, the mounting plate @ and the bottom plate, and a ring-shaped bolt inserted between the mounting plate (to) and the bottom plate. It consists of Patsukin (ha).
しかして、静圧軸受体ａυは、定盤軸＋９７をスラスト
方向に非接触軸支する静圧スラスト軸受部（図示せず。Therefore, the hydrostatic bearing body aυ is a hydrostatic thrust bearing portion (not shown) that pivotally supports the surface plate shaft +97 in the thrust direction in a non-contact manner.
）と、定盤軸（９７をラジアル方向に非接触軸支する静
圧ラジアル軸受部（図示せず。）とか６なっている。ま
た、高圧空気供給部翰は、高圧空気を案内する案内管（
至）と、この案内管（ハ）を介して高圧空気を発生する
高圧空気源翰とからなりている。また、回転駆動部ａυ
は、定盤軸［９７の下端部に連結されたカップリング（
至）と、このカップリングに接続された減速装置（至）
と、この減速装置（イ）及びカップリング（２）を介し
て定盤軸（９）を回転駆動するモータ（至）とからなっ
ている。さら番ζ、加工液保持部（５）は、底板顛の周
辺部上面に取付けられ且つ底板α樽の外径よりもわずか
に小さい貫通孔を形成する鍔板０１）が底部に設けられ
ている円筒状の保持筒（至）と、鍔板６υを介して底板
（１１に螺着され保持筒（至）を底板ａｌに固着する等
配して設けられた第３のボルト（至）・・・と、これら
第３のポル）Ｍ・・・の外側位置にて保持筒（至）と底
板−との間に介挿され加工液（４）の外部への漏出を封
止するリング状のパツキン（ロ）とからなっている。さ
らに、前記被加工物保持部（６）は、被加工物（５）が
接着される貼着皿（至）と、この貼着皿（至）の背面中
央部に設けられたカンザシ軸受部（至）と、このカンザ
シ軸受部（至）に接離自在に嵌合する球体部（ロ）が下
端部に設けられた棒状の揺動軸（至）と、この揺動軸（
至）が上下方向位置調整自在に取付けられこの揺動軸（
至）を矢印（至）方向１こ駆動するクランク機構（４Ｑ
とからなっている。 ゛噌噸噌雫國キつぎに上記構成の
研磨装置の作動について述べる。) and a static pressure radial bearing (not shown) that supports the surface plate shaft (97) in a radial direction in a non-contact manner.In addition, the high-pressure air supply section has a guide pipe that guides the high-pressure air. (
(1) and a high-pressure air source that generates high-pressure air through this guide tube (3). In addition, the rotation drive unit aυ
is a coupling (
) and the reduction gear connected to this coupling (to)
and a motor (to) that rotationally drives the surface plate shaft (9) via the reduction gear (a) and the coupling (2). Counter plate ζ, the machining fluid holding part (5) is attached to the upper surface of the peripheral part of the bottom plate and has a flange plate 01) at the bottom that forms a through hole slightly smaller than the outer diameter of the bottom plate α barrel. A cylindrical holding cylinder (to) and third bolts (to) which are equally spaced and screwed onto the bottom plate (11) through a collar plate 6υ and fixing the holding cylinder (to) to the bottom plate al...・A ring-shaped ring is inserted between the holding cylinder (to) and the bottom plate at the outer position of these third poles) M... to seal the leakage of the machining fluid (4) to the outside. It consists of Patsukin (ro). Furthermore, the workpiece holding part (6) includes a sticking plate (to) to which the workpiece (5) is adhered, and a Kanzashi bearing part (to) provided at the center of the back of this sticking plate (to). (to)), a rod-shaped swing shaft (to) with a spherical part (b) attached to the lower end that is removably fitted into this Kanzashi bearing part (to), and this swing shaft (to).
) is attached so that its position can be adjusted in the vertical direction, and this swing shaft (
A crank mechanism (4Q) that drives the
It consists of Next, the operation of the polishing apparatus having the above structure will be described.
まず、錫製の定盤＋１）の上端面を図示せぬダイヤモン
ド旋盤を用いて、凸状の球面（を国を形成する。First, a convex spherical surface is formed on the upper end surface of the tin surface plate +1 using a diamond lathe (not shown).
つぎに、この球面α罎に溝Ｉ・・・を刻設する。そして
、この球面０を形成した定盤（１）を基板αｅに接着剤
により接着する。ついで、この基板１１９の貫通孔α埼
を底板ａ樽の突出部αηに嵌合する。ついで、締結仮置
を突出部αη及び基板−の上面にかぶせ、第１のボルト
四・・・ζこよりこの締結仮置を突出部１ηに締結する
ことにより、基板ｔｔｅを締結板０と底板α呻とにより
挟圧・固定する。つぎに、加工液保持部（５）により形
成された収納空間’４０内に、定盤（１）が完全に浸漬
するまで加工液（４）を満たす。一方、貼着皿（至）に
は被加工物置を接着剤により接着する。この被加工物置
の被加工面１′ＩＪは、あらかじめダイヤモンド・ラッ
ピングにより表面粗さが０．０３５μｓ＋Ｒｚの凹状の
球面に前加工されている。つぎに、この貼着皿（至）に
貼り着けられた被加工物置を加工液（４）に浸漬した後
、定盤（１）上に当接させた状態で、揺動軸（至）の球
体部（至）を貼着皿（至）のカンザシ軸受部（至）に嵌
入・保合させる。しかして、高圧空気源（至）から案内
管（至）を介して高圧空気を静圧軸受体（財）に供給し
、定盤軸＋９７を静圧軸支する。ついで、モータ（７）
を起動して、減速装置−及びカップリング（至）を介し
て、定盤軸（９Ｊに取付けられている定盤（１）を例え
ば毎分６０〜２００回転で回転させる。同時に、前記ク
ランク機構顛により揺動軸（至）を矢印Ｏ１方向に駆動
する。すると、貼着皿Ｔ、３９は、厚さ数μ風の液膜Ｑ
３を介して定盤（１）の球面０に当接した状態で、矢印
Ｃ３１方向に揺動するとともに、毎分６０〜２００回転
している定盤（１）に追従して、つれまわり回転する。Next, grooves I... are carved in this spherical surface α. Then, the surface plate (1) on which the spherical surface 0 is formed is bonded to the substrate αe with an adhesive. Next, the through hole α of this substrate 119 is fitted into the protrusion αη of the barrel of the bottom plate a. Next, by covering the upper surface of the protruding part αη and the board - with a temporary fastening part, and fastening this temporary fastening part to the protruding part 1η through the first bolts 4...ζ, the board tte is connected to the fastening plate 0 and the bottom plate α. Clamp and fix by groaning. Next, the storage space '40 formed by the machining liquid holding part (5) is filled with the machining liquid (4) until the surface plate (1) is completely immersed. On the other hand, the workpiece is adhered to the attachment plate (to) using an adhesive. The work surface 1'IJ of this work shed has been preprocessed into a concave spherical surface with a surface roughness of 0.035 μs+Rz by diamond lapping. Next, after immersing the workpiece attached to the sticking plate (to) in the machining liquid (4), the swing shaft (to) is placed in contact with the surface plate (1). Fit and secure the spherical part (to) into the Kanzashi bearing part (to) of the adhesive plate (to). Thus, high-pressure air is supplied from the high-pressure air source (to) to the static pressure bearing body through the guide pipe (to), and the surface plate shaft +97 is supported by the static pressure bearing body. Next, the motor (7)
is activated, and the surface plate (1) attached to the surface plate shaft (9J) is rotated at a speed of, for example, 60 to 200 revolutions per minute, via the reduction gear and the coupling. The swing axis (to) is driven in the direction of arrow O1 by the screen.Then, the adhesive plate T, 39 is covered with a liquid film Q of several μm thick.
While in contact with the spherical surface 0 of the surface plate (1) through 3, it swings in the direction of arrow C31 and rotates around following the surface plate (1) which is rotating at 60 to 200 revolutions per minute. do.
すなわち、定盤（１）の高速回転により被加工面（４３
には、定盤（１）の球面α［有］により液膜（ハ）が形
成される。In other words, the surface plate (1) rotates at high speed to
A liquid film (c) is formed by the spherical surface α of the surface plate (1).
この液膜的は、定盤の高速回転により、動圧流体潤滑状
態を呈し、被加工面（４）は、定盤（１）の球面αｊか
ら数μ陽浮上した状態となり、液膜（４３中の８ｉ０２
超微粒子によりフロート・ポリシンクが進行する。Due to the high-speed rotation of the surface plate, this liquid film exhibits a hydrodynamic lubrication state, and the workpiece surface (4) is in a state of floating several micrometers upward from the spherical surface αj of the surface plate (1), and the liquid film (43 Inside 8i02
Float polysink progresses due to ultrafine particles.
その結果、定盤（１）の球面（１３）が被加工面（４２
に転写され、その表面粗さは数Ｘｒｍｓになる。As a result, the spherical surface (13) of the surface plate (1) is
The surface roughness is several Xrms.
以上のように、この実施例の研磨装置は、定盤（１）が
、加工機本体から容易に着脱できるようになっているの
で、取り外した定盤を容易に着脱できる結果、定盤（１
）を専用の球面加工機（例えばＮＣダイヤモンド旋盤）
により任意曲率の球面に加工することができる。したが
って、従来、平面加工にしか適用できなかったフロート
・ボリシングの超高精密球面加工への適用が可能となる
。As described above, in the polishing apparatus of this embodiment, the surface plate (1) can be easily attached and detached from the main body of the processing machine, so that the removed surface plate can be easily attached and detached.
) using a dedicated spherical processing machine (e.g. NC diamond lathe)
It is possible to process a spherical surface with arbitrary curvature. Therefore, it becomes possible to apply float boring, which was conventionally only applicable to flat surface machining, to ultra-high precision spherical surface machining.
なお、定盤（１）の材質は、錫に限ることなく鋼（Ｃｕ
）でもよい。また、加工液に添加する砥粒としては、例
えば公称径５０ＡのＣｅＯ，（２酸化セリウム）でもよ
い。さらに、軸受部α呻は、静圧気体軸受でなく１靜圧
油軸受でもよい。さらにまた、上記実施例に招いては、
被加工物置への凹球面の形成を例示しているが、第３図
に示すように、凹球面一を有する定盤６１）を用いるこ
とにより、凸球面の形成も可能となる。The material of the surface plate (1) is not limited to tin, but may also be steel (Cu).
) is also fine. Further, as the abrasive grains added to the machining fluid, for example, CeO (cerium dioxide) having a nominal diameter of 50A may be used. Further, the bearing part α may be a static pressure oil bearing instead of a static pressure gas bearing. Furthermore, referring to the above embodiment,
Although the formation of a concave spherical surface on the workpiece shed is illustrated, as shown in FIG. 3, by using a surface plate 61) having a concave spherical surface, it is also possible to form a convex spherical surface.
本発明の研磨装置は、フロート ポリシング用の定盤を
着脱自在な構造とし、且つ、被加工物をカンザシ軸受を
介して揺動させるようにしているので、従来、平面仕上
げにしか適用できなかりたフロート・ポリシンク加工を
超高精密球面加工にも適用できるようになる。その結果
、これまで、製作がきわめて困離とされていた特殊光学
部品の超高ｎ度生産が可能となる。The polishing device of the present invention has a structure in which the surface plate for float polishing is removable, and the workpiece is oscillated via a kanzashi bearing, so conventionally it could only be applied to flat surface finishing. Float polysink processing can now be applied to ultra-high precision spherical processing. As a result, it becomes possible to produce ultra-high n-degrees of special optical components, which were previously extremely difficult to manufacture.
第１図は本発明の一実施例の研磨装置の全体構成図、第
２図は同じく要部拡大断面図、第３図は本発明の他の実
施例の説明図、第４図はフロート・ポリシンクの説明図
である。
（１）・・・定盤。
（３）・・・定盤保持部（定盤保持駆動手段）。
（４）・・・加工液。
（５）・・・加工液保持部（加工液保持手段）。
（６）・・・被加工物保持部（被加工物保持駆動手段゛
）。
（９１・・・定盤軸。
鵠・・・軸受部。
代理人 弁理士 則 近 憲 佑
同 松山光速
簀 ２
図
算 １
閃
茅 Ｊ
区FIG. 1 is an overall configuration diagram of a polishing apparatus according to an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view of the main parts, FIG. 3 is an explanatory diagram of another embodiment of the present invention, and FIG. 4 is a float FIG. 2 is an explanatory diagram of polysync. (1)...Surface plate. (3) ... Surface plate holding section (surface plate holding drive means). (4)...Processing fluid. (5) Machining liquid holding section (processing liquid holding means). (6) Workpiece holding section (workpiece holding drive means). (91... Surface plate shaft. 鵠... Bearing part. Agent Patent attorney Nori Chika Ken Yudo Matsuyama Kosokusui 2 Illustrated calculation 1 Senka J Ward
Claims (5)
研磨装置において、球面部位が形成された定盤と、定盤
を底部に収納するとともに上記被加工物を研磨する加工
液を少なくとも上記定盤を覆う量だけ収納する加工液保
持手段と、上記定盤及び上記加工液保持手段を着脱自在
に保持して回転駆動する定盤保持駆動手段と、上記被加
工物を保持して上記加工液中に浸漬されている定盤の球
面部位に当接させるとともに上記球面部位に沿って揺動
させる被加工物保持駆動手段とを具備することを特徴と
する研磨装置。(1) A polishing device that polishes a workpiece using a float polysink, which includes a surface plate on which a spherical part is formed, and a surface plate that is housed at the bottom, and a processing liquid for polishing the workpiece is supplied to at least the surface plate. a machining fluid retaining means for storing an amount to cover the machining fluid; a surface plate holding drive means for removably holding and rotating the surface plate and the machining fluid retaining means; A polishing apparatus comprising workpiece holding and driving means that is brought into contact with a spherical part of a surface plate that is immersed and is caused to swing along the spherical part.
から取り外した状態で球面加工されていることを特徴と
する請求項（１）記載の研磨装置。(2) The polishing apparatus according to claim 1, wherein the spherical portion of the surface plate is processed into a spherical surface while the surface plate is removed from the surface plate holding and driving means.
る貼付皿と、この貼付皿の背部に設けられたカンザシ軸
受と、このカンザシ軸受に嵌入する球体部が下端部に設
けられた揺動軸と、この揺動軸を支持して揺動させる揺
動機構とを有することを特徴とする請求項（１）記載の
研磨装置。(3) The workpiece holding and driving means includes a pasting plate on which the workpiece is pasted, a ring bearing provided on the back of the pasting plate, and a rocker provided at its lower end with a spherical part that fits into the ring bearing. The polishing apparatus according to claim 1, further comprising a rotating shaft and a swinging mechanism that supports and swings the swinging shaft.
取付けられる定盤軸と、この定盤軸を静圧軸支する静圧
軸受と、この静圧軸受により軸支された定盤軸を回転駆
動する回転機構とを有することを特徴とする請求項（１
）記載の研磨装置。(4) The surface plate holding drive means includes a surface plate shaft to which the surface plate is removably attached to the upper end, a hydrostatic bearing that supports the surface plate shaft with hydrostatic pressure, and a surface plate supported by the static pressure bearing. Claim (1) characterized in that it has a rotation mechanism that rotationally drives the surface plate shaft.
) described polishing equipment.
記載の研磨装置。(5) Claim (1) characterized in that the surface plate is made of tin.
The polishing device described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP64000105A JPH02180552A (en) | 1989-01-05 | 1989-01-05 | Polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP64000105A JPH02180552A (en) | 1989-01-05 | 1989-01-05 | Polishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02180552A true JPH02180552A (en) | 1990-07-13 |
Family
ID=11464810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP64000105A Pending JPH02180552A (en) | 1989-01-05 | 1989-01-05 | Polishing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02180552A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5204507A (en) * | 1990-08-14 | 1993-04-20 | Tsubakimoto Chain Co. | Work rotating device for laser beam machine tool |
-
1989
- 1989-01-05 JP JP64000105A patent/JPH02180552A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5204507A (en) * | 1990-08-14 | 1993-04-20 | Tsubakimoto Chain Co. | Work rotating device for laser beam machine tool |
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