JPH02179487A - Inspecting head for double-surface circuit board - Google Patents

Abstract

PURPOSE:To make it possible to inspect the circuit patterns on both surfaces of a circuit board accurately at the same time by accurately positioning the double-surface circuit board to be inspected with a receiving plate at first, bringing probes into contact with the surfaces elastically from the upper and lower sides, and performing the inspection. CONSTITUTION:A plurality of double-surface circuit boards P are transferred on a receiving plate 4 from a carrier. The board is set with a sucking device 10 so that the board is not moved. When an upper head 2 is lowered, at first the lower end part of a guide shaft 16 which is made to extend from the lower surface of a pushing plate 14 intrudes into the recess part of the upper end of a guide shaft 6 of the plate 4. Thus, the relative positions of the plate 4 and the plate 14 are set. Both surfaces of the shafts 6 and 16 are in contact. When the head 2 is further lowered, a first spring 7 is compressed, and a positioning pin 9 is lifted and set at an accurate position. When the head 2 is further lowered, a second spring 17 is compressed, and an upper plate 13 and the plate 14 become contact state. The board P is held between the plate 4 and the plate 14. Under this state, the upper end of a lower probe 8 is elastically brought into contact with the circuit pattern of the lower surface of the board P. The lower end of an upper probe 18 is elastically brought into contact with the circuit pattern on the upper surface. Thus, both upper and lower surfaces are inspected at the same time.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an inspection head for double-sided circuit boards.

[Prior Art] Conventionally, an inspection head constituting a circuit board inspection device is installed on a conveyance path for the circuit board to be inspected, and the circuit board placed on a carrier is moved under the inspection head by the conveyance means. When passing, the head descends and the probe provided on the inspection head comes into contact with the circuit pattern on the top surface of the circuit board, thereby inspecting the circuit board.

[Problem to be solved] The above inspection head contacts the probe with the circuit board placed on the carrier, and it is difficult to inspect a single-sided circuit board with a simple circuit configuration. However, even in this case, since the carrier is provided with a certain amount of margin for guiding the substrate, accurate positioning is difficult and highly accurate inspection cannot be expected. Furthermore, in order to inspect a double-sided circuit board, after inspecting the pattern on the top side, the circuit board must be turned over, etc., and then taken to another inspection process, and the pattern on the bottom side must be inspected. There are problems such as an increase in the number of steps. Even with this method, high-precision inspection is impossible, so it is not suitable for inspecting small double-sided circuit boards that have high-precision circuits on both sides, such as camera circuit boards. be.

An object of the present invention is to provide a double-sided circuit board inspection head that can inspect both sides of a double-sided circuit board simultaneously and with high precision.

[Means for Solving the Problems] In order to achieve the above object, the double-sided circuit board inspection head of the present invention is provided with an upper plate and a lower plate that are vertically opposed to each other and that are relatively moved forward and backward. A plurality of upper probes and lower probes are provided on opposing surfaces of the upper and lower plates to be retractable against spring force, and are capable of elastic contact with the upper and lower pattern surfaces of the double-sided circuit board. The circuit board can be mounted on the board, and has a through hole through which the lower probe can pass, while the upper surface of the lower probe is resiliently pressed by a first spring above the lower board so that the upper surface is located above the upper end of the lower probe during normal operation. It is temporarily implanted at the bottom of the receiving plate and protrudes upward from the through hole formed in the receiving plate, and has a tapered tip so that it can fit into the positioning hole formed on the circuit board. The positioning pin has a through hole through which the upper probe can penetrate, and is pushed by a second spring under the upper plate so that the lower surface is located below the lower end of the upper probe during normal operation, and the circuit board and a backing plate formed with a relief hole into which a positioning pin protruding from the circuit board can fit while in contact with the upper surface of the circuit board.

Further, in order to advance the retreat of the receiving plate, the spring force of the second spring is made larger than that of the first spring.

[Function] When a double-sided circuit board is placed on a predetermined position on a receiving plate and a contact plate is brought into contact with the receiving plate via the circuit board, the upper probe and the lower probe touch the circuit patterns on both sides of the board. be inspected at the same time. The positioning pin with a tapered tip is
Before the backing plate comes into contact with the receiving plate via the circuit board, it is fitted into the positioning hole of the circuit board on the receiving plate to accurately position the circuit board. If the spring force of the second spring is greater than that of the first spring, the position of the circuit board can be adjusted before the circuit board is clamped and fixed between the backing plate and the receiving plate. This makes it easier.

[Example] An example of the present invention will be described below with reference to the drawings.

As shown in FIG. 1, the double-sided circuit board inspection head according to the present invention consists of a lower head 1 and a lower head 2, which face each other at a predetermined interval and can move forward and backward relative to each other.
At the same time, it is possible to inspect circuit boards for success or failure. While the circuit boards are placed on a carrier and transported along a transport path (not shown), a plurality of circuit boards are transferred one by one from the carrier to the upper surface of the lower head 1 of the inspection section by appropriate means.

First, the structure of the lower head 1 will be explained with reference to FIG. 1.2. The lower plate 3 of the lower head 1 has a lower mounting (not shown) fixed to the upper surface of the plate, and a plurality of lower probes 8 are mounted on a surface 3a facing the upper plate 13 (described later). It is provided in a predetermined position.

Each lower probe 8 is retractable against the force of a spring (not shown).

Above the lower plate 3, a receiving plate 4 cannot be separated from the lower plate 3:
They are connected by support shafts 5 of the number of ships, and the first springs (compression springs) 7 of the number of stages are fitted to the support shafts 5, and the receiving plate 4 is connected to the lower plate 3. It is firing against the enemy.

As shown in FIG. 5, the lower probes 8 are inserted into through holes 4a provided at corresponding positions in the receiving plate 4.

The upper surface of the receiving plate 4 is located above the tip of the lower probe 8 during normal times, and when the receiving plate 4 compresses the first spring 7 and retreats (descends), the upper surface of the lower probe 8... The tip can come into elastic contact with the circuit pattern on the lower surface of the double-sided circuit board P set on the upper surface of the receiver 4.

Further, on the upper surface of the lower plate 3, the tip is formed into a tapered part 9a as shown in FIG. ! Several positioning pins 9... are implanted. The positioning pins 9 are inserted through through holes 4b provided at corresponding positions on the receiving plate 4, and are provided in such a state that only the tapered portion 9a slightly protrudes from the upper surface of the receiving plate during normal operation.

The receiving plate 4 is provided with a suction device 10 for suctioning and holding the circuit board P on the receiving plate 4 at the center of the position where the double-sided circuit board P is placed.

The structure of the upper head 2 is similar to that of the lower head 1 as shown in the first figure, and is arranged symmetrically. That is, the upper plate 13 of the upper head 2 has an upper mounting (not shown) fixed to the lower surface of the plate, and a surface 13 of the upper plate 13 facing the lower plate 3 is fixed to the lower surface of the plate.
A is provided with a plurality of upper probes 18 at predetermined positions. The configuration of each upper probe 18 is the same as that of the lower probe 8.

'' Below the second plate 13, a backing plate 14 is irremovably connected to the upper plate 13 by a number of support shafts 15, and a plurality of second springs are attached to the support shafts 15. (compression spring)
17... are fitted, causing the backing plate 14 to spring against the upper plate 13.

As shown in FIG. 5, the upper probe 18...
It is inserted into a through hole 14a provided at a corresponding position. Guess it! The lower surface of 1214 is the upper probe 1 during normal times.
8, and the backing plate 14 is located below the tip of the second
When the springs 17 are compressed and the upper probes 18 are moved back (raised), the tips of the upper probes 18 can come into elastic contact with the circuit pattern on the upper surface of the double-sided circuit board P set on the upper surface of the receiving plate 4.

The backing plate 14 is provided with an escape hole 14b for the positioning pin 9 at a position corresponding to the entry path of the positioning pin 9 implanted in the lower plate 3.

The receiving plate 4 and the backing plate 14 each have a guide shaft 6.1.
6 is fixed to the sleeves 6a and 16a, which are both fixed to the lower plate 3 and the upper plate 13, and are slidably passed through the sleeves 6a and 16a. The guide shaft 6.16 is used to determine the relative position of the lower bed 1 and the upper head 2 during assembly, and is also used to initially push down the receiving plate 4 from the guide shaft 16 via the guide shaft 6 during operation. used.

The spring force of the second spring 17 is set larger than the spring force of the first spring 7 to facilitate fine adjustment of the position of the circuit board P as described later.

Next, the operation of the present invention will be explained.

As described above, while the double-sided circuit boards P to be inspected are placed on a carrier and transported along a transport path (not shown), a plurality of double-sided circuit boards P are transferred from the carrier onto the receiving plate 4 by an appropriate means, and the suction device 10 It is set so that it does not move easily. At this time, the tapered part 9a at the tip of the positioning pin 9
The only part is fitted into the positioning hole of the circuit board P as shown in the fifth figure. Next, when the upper head 2 is lowered by a drive cylinder (not shown), the lower end of the guide shaft 16 protruding from the lower surface of the backing plate 14 enters the recess at the upper end of the guide shaft 6 of the receiving plate 4. Receive plate 4 and back plate 1
4, and the end surfaces of both guide shafts 6.16 come into contact. When the upper head 2 further descends, the guide shaft 1
6 acts on the receiving plate 4 via the guide shaft 6, and first the first spring 7 with a weak spring force is compressed and the receiving plate 4 is compressed.
is pushed down against this spring force. This lowering causes the positioning pin 9 to rise relatively from the position shown in FIG. 5, and its shaft portion protrudes upward from the positioning hole of the circuit board P. At this time, the circuit board P is only held in position by the suction device 10, so when the shaft portion of the positioning pin 9 fits into the hole, its position is finely adjusted and set at an accurate position. will be done. Further, the upper head 2 continues to descend, and the first spring 7 finishes being compressed (as shown in the third figure).
Then, the second spring 17 is compressed, and the upper plate 13 and the backing plate 14 come into contact with each other (as shown in the fourth figure). Further, the double-sided circuit board P is sandwiched between the receiving plate 4 and the backing plate 14.

In this state, the upper end of the lower probe 8 is connected to the double-sided circuit board P.
At the same time, the lower end of the upper probe 18 comes into elastic contact with the circuit pattern on the upper surface, and the circuit patterns on both the upper and lower surfaces of the double-sided circuit board P are simultaneously inspected.

When the inspection of the circuit patterns on both sides is completed, the upper head 2 is raised and, contrary to the above, the backing plate 14 is first moved to the second spring 1.
7 returns to its original position, then the receiving plate 4 returns to its original position, and the double-sided circuit board P is attached to the positioning pin 9 at 16.
Freed from bondage. Then, the suction of the suction device IO is stopped, and the circuit board P that has been inspected is returned to the original transport line.

[Effects] As explained above, in the present invention, the double-sided circuit board to be inspected is first accurately positioned on the receiving plate and then inspected by elastically contacting the probe from above and below, so that accurate inspection is possible. It is possible to simultaneously inspect circuit patterns on both sides of a circuit board, and is extremely effective in increasing the accuracy and efficiency of circuit board inspection.

[Brief explanation of the drawings] Figure 1 is a cross-sectional view of the main parts, Figure 2 is a cross-sectional view of the receiving plate on which the circuit board is placed, and Figures 3 and 4 are the steps taken before inspecting the circuit board. Each stage is a sectional view, and FIG. 5 is an enlarged sectional view of the main part. 3. ・Lower plate, 3a. .Opposing surface, 4. .Receiving plate, 4a. .Through hole, 4b--receiving hole, 7.. 1st
Spring, 8. Lower probe, 9. Locating pin, 13. Upper plate, 13a. Opposing surface, 14.
・Backing plate, 14a...Through hole, 14b・・Escape hole, 17・
・Second spring, 18... ψ bottom probe, P... Double-sided circuit board, h... Positioning hole. that's all

Claims (2)

[Claims] (1) An upper plate and a lower plate that are provided vertically facing each other and that can be moved forward and backward relative to each other; and an upper plate and a lower plate that are provided on opposing surfaces of the upper plate and the lower plate so that they can retract against spring force. It has a plurality of upper probes and lower probes that can come into elastic contact with the upper and lower pattern surfaces of the double-sided circuit board, the circuit board can be placed on the upper surface, and a through hole through which the lower probe can penetrate. a receiving plate that is resiliently pressed by a first spring above the lower plate so that the upper surface is located higher than the upper end of the lower probe; a positioning pin that protrudes upward from the formed through hole and has a tapered tip and that can be fitted into a positioning hole formed in the circuit board; and a one side having a through hole through which the upper probe can pass. , the lower surface of the upper probe is pressed by a second spring below the upper plate so that it is located below the lower end of the upper probe during normal times, and the probe protrudes from the circuit board while being in contact with the upper surface of the circuit board. A double-sided circuit board inspection head comprising: a backing plate having a relief hole into which the positioning pin can fit; (2) The double-sided circuit board inspection head according to claim 1, wherein the spring force of the second spring is greater than that of the first spring.