JPH0217891U - - Google Patents
Info
- Publication number
- JPH0217891U JPH0217891U JP1988095729U JP9572988U JPH0217891U JP H0217891 U JPH0217891 U JP H0217891U JP 1988095729 U JP1988095729 U JP 1988095729U JP 9572988 U JP9572988 U JP 9572988U JP H0217891 U JPH0217891 U JP H0217891U
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- heat generating
- motherboard
- copper foil
- dissipation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988095729U JPH0217891U (enExample) | 1988-07-21 | 1988-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988095729U JPH0217891U (enExample) | 1988-07-21 | 1988-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217891U true JPH0217891U (enExample) | 1990-02-06 |
Family
ID=31320438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988095729U Pending JPH0217891U (enExample) | 1988-07-21 | 1988-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217891U (enExample) |
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1988
- 1988-07-21 JP JP1988095729U patent/JPH0217891U/ja active Pending