JPH0217854U - - Google Patents

Info

Publication number
JPH0217854U
JPH0217854U JP9534488U JP9534488U JPH0217854U JP H0217854 U JPH0217854 U JP H0217854U JP 9534488 U JP9534488 U JP 9534488U JP 9534488 U JP9534488 U JP 9534488U JP H0217854 U JPH0217854 U JP H0217854U
Authority
JP
Japan
Prior art keywords
semiconductor device
soldering
circuit board
printed circuit
external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9534488U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9534488U priority Critical patent/JPH0217854U/ja
Publication of JPH0217854U publication Critical patent/JPH0217854U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP9534488U 1988-07-18 1988-07-18 Pending JPH0217854U (US20050075337A1-20050407-C00081.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9534488U JPH0217854U (US20050075337A1-20050407-C00081.png) 1988-07-18 1988-07-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9534488U JPH0217854U (US20050075337A1-20050407-C00081.png) 1988-07-18 1988-07-18

Publications (1)

Publication Number Publication Date
JPH0217854U true JPH0217854U (US20050075337A1-20050407-C00081.png) 1990-02-06

Family

ID=31320009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9534488U Pending JPH0217854U (US20050075337A1-20050407-C00081.png) 1988-07-18 1988-07-18

Country Status (1)

Country Link
JP (1) JPH0217854U (US20050075337A1-20050407-C00081.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009124095A (ja) * 2007-11-12 2009-06-04 Samsung Sdi Co Ltd 半導体パッケージ及びその実装方法
JP2017041541A (ja) * 2015-08-20 2017-02-23 三菱電機株式会社 高周波高出力用デバイス装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009124095A (ja) * 2007-11-12 2009-06-04 Samsung Sdi Co Ltd 半導体パッケージ及びその実装方法
US8319319B2 (en) 2007-11-12 2012-11-27 Samsung Sdi Co., Ltd. Semiconductor package and mounting method thereof
JP2017041541A (ja) * 2015-08-20 2017-02-23 三菱電機株式会社 高周波高出力用デバイス装置

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