JPH0217845U - - Google Patents
Info
- Publication number
- JPH0217845U JPH0217845U JP9680588U JP9680588U JPH0217845U JP H0217845 U JPH0217845 U JP H0217845U JP 9680588 U JP9680588 U JP 9680588U JP 9680588 U JP9680588 U JP 9680588U JP H0217845 U JPH0217845 U JP H0217845U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- semiconductor
- specifications
- housed
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はこの考案に係る半導体パツケージの一
例を示す平面図、第２図はこの考案に係る半導体
パツケージの他の例を示す平面図、第３図はこの
考案に係る半導体パツケージを適用したＩＣをプ
リント基板に実装した状態を示す斜視図、第４図
は従来の半導体パツケージを示す平面図、第５図
は従来の半導体パツケージを適用したＩＣをプリ
ント基板に実装した斜視図である。
１，１Ａ……半導体パツケージ、２……接続ピ
ン、３……凹部、１０……ＩＣ、２０……プリン
ト基板、Ｇ……グランド、Ｖｃｃ……電源。
FIG. 1 is a plan view showing an example of a semiconductor package according to this invention, FIG. 2 is a plan view showing another example of a semiconductor package according to this invention, and FIG. 3 is an IC to which the semiconductor package according to this invention is applied. FIG. 4 is a plan view showing a conventional semiconductor package, and FIG. 5 is a perspective view showing an IC mounted on a printed circuit board using the conventional semiconductor package. 1, 1A... Semiconductor package, 2... Connection pin, 3... Recess, 10... IC, 20... Printed circuit board, G... Ground, Vcc... Power supply.
Claims (1)
パツケージにおいて、 上記半導体パツケージの表面若しくは裏面に、
その内部機能、仕様などに関する表示がなされた
ことを特徴とする半導体パツケージ。[Scope of claim for utility model registration] In a semiconductor package in which a semiconductor element such as a chip is housed, on the front or back surface of the semiconductor package,
A semiconductor package characterized by displaying information regarding its internal functions, specifications, etc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9680588U JPH0217845U (en) | 1988-07-21 | 1988-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9680588U JPH0217845U (en) | 1988-07-21 | 1988-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217845U true JPH0217845U (en) | 1990-02-06 |
Family
ID=31321914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9680588U Pending JPH0217845U (en) | 1988-07-21 | 1988-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217845U (en) |
-
1988
- 1988-07-21 JP JP9680588U patent/JPH0217845U/ja active Pending
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