JPH02173289A - Gold plated material having superior wear resistance - Google Patents
Gold plated material having superior wear resistanceInfo
- Publication number
- JPH02173289A JPH02173289A JP32480388A JP32480388A JPH02173289A JP H02173289 A JPH02173289 A JP H02173289A JP 32480388 A JP32480388 A JP 32480388A JP 32480388 A JP32480388 A JP 32480388A JP H02173289 A JPH02173289 A JP H02173289A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- wear resistance
- gold
- alloy
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010931 gold Substances 0.000 title claims abstract description 24
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 19
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 title claims abstract description 18
- 238000007747 plating Methods 0.000 claims abstract description 47
- 239000000956 alloy Substances 0.000 claims abstract description 10
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 8
- 229910017392 Au—Co Inorganic materials 0.000 claims abstract description 6
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 44
- 229910052759 nickel Inorganic materials 0.000 claims description 22
- 230000003746 surface roughness Effects 0.000 abstract description 5
- 238000003756 stirring Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 239000008186 active pharmaceutical agent Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910001200 Ferrotitanium Inorganic materials 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、挿抜回数の多いコネクタのコンタクトとして
重要な特性である耐摩耗性を改善した金めつき材に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a gold-plated material with improved wear resistance, which is an important property for contacts of connectors that are frequently inserted and removed.
金は非常に安定した金属で優れた耐食性を示す。 Gold is a very stable metal and exhibits excellent corrosion resistance.
又、金めつきは接触力が小さくても安定した接触が得ら
れるため、回路電圧、電流が小さい場合のコネクタや挿
抜回数の多いコネクタのコンタクトには金めつきが施さ
れている。Furthermore, since gold plating allows stable contact even with small contact force, gold plating is applied to connectors used when the circuit voltage and current are small, and contacts of connectors that are frequently inserted and removed.
銅あるいは銅合金素材に金めつきを施す場合、下地めっ
きとしてニッケルめっきを行う例が多い。When gold plating is applied to copper or copper alloy materials, nickel plating is often used as the base plating.
これはニッケル下地めっきを極端に薄くしなければ、Ｃ
ｕ−Ａｕの拡散防止の効果があり、また、ニッケルが硬
いためコネクタの挿抜寿命特性も向上するからである。This is unless the nickel base plating is made extremely thin.
This is because it has the effect of preventing diffusion of u-Au, and because nickel is hard, the insertion and removal life characteristics of the connector are also improved.
ＯＡ機器の普及に伴い、その外部メモリーとして種々の
カードが使用されるようになってきた。With the spread of office automation equipment, various cards have come to be used as external memory.
従来、外部メモリーとしてフロッピィディスクが使用さ
れていたが、ＩＣ技術の著しい向」−によりＯＡ機器の
小型化やメモリ容はの増加がなされ。Traditionally, floppy disks were used as external memory, but with the remarkable advances in IC technology, office automation equipment has become smaller and memory capacity has increased.
フロッピィディスクの代わりとしてＲＯＭカードやバッ
クアップバッテリー内５４ ＲＡ Ｍカードなどが使用
される例が増えてきた。この理由は、これらのカードは
フロッピィディスクと比べると容量は小さいが、サイズ
が小さく、かつ磁気や埃に強いため持ち運びがし易い、
保管し易いという利点があるからである。ROM cards and 54 RAM cards in backup batteries are increasingly being used in place of floppy disks. The reason for this is that although these cards have a smaller capacity than floppy disks, they are small and resistant to magnetism and dust, making them easy to carry.
This is because it has the advantage of being easy to store.
これらのカードと本体とは、コネクタにより接触、導通
が行われている。これらのカードはフロッピィディスク
と同様に用いられるため挿抜回数が多く、摩耗により接
触不良が起こり、故障を起こす大きな原因となることは
良く知られている。These cards and the main body are brought into contact and electrically connected through connectors. Since these cards are used in the same way as floppy disks, they are inserted and removed many times, and it is well known that contact failure occurs due to wear, which is a major cause of failure.
そのため本体とカードの接触に用いられるコネクタには
優れた耐摩耗性が要求される。Therefore, the connector used to connect the main body and the card is required to have excellent wear resistance.
また、従来のキャッシュカード、クレジットカードに代
わるカードとしてＩｓ○規格のＩＣカードが注目されて
おり、今後、更に普及するものと考えられる。その使用
頻度は１１回／日として約４０００回／年となる。その
・カードと端末との接触部にも当然耐摩耗性が要求され
る。ところが、現在の技術ではこれらの要求を満足する
ものは得られていないのが現状である。Furthermore, IC cards of the Is○ standard are attracting attention as cards that can replace conventional cash cards and credit cards, and are expected to become even more popular in the future. The frequency of use is approximately 4000 times/year, assuming 11 times/day.・Abrasion resistance is naturally required for the contact area between the card and the terminal. However, the current state of the art is that nothing that satisfies these requirements has been achieved.
Ｃ問題点が解決するための手段〕
本発明者等は上記問題点を解決するため鋭意検討した結
果、金めつきの下地の表面粗さが金めつきコンタクトの
摩耗特性に写える影響が大きいことを知見し、本発明に
至った。Means for Solving Problem C] As a result of intensive studies to solve the above problem, the present inventors have found that the surface roughness of the gold-plated base has a large influence on the wear characteristics of the gold-plated contact. This discovery led to the present invention.
コネクタのコンタクトにバネ材として使用される銅合金
としては、ベリリウム銅、チタン鋼、りん青銅、黄銅、
洋白等多種あるが、本発明はこれらの銅合金の中でもビ
ッカース硬度が２３０以下であり、かつ素材表面の十点
平均粗さが０．８０μｍ以下である銅合金に下地めっき
として１．０μｍ以上５．０μｍ以下の光沢ニッケルめ
っきを施し、その上に金めつき又はＡ ｕ −Ｇ ｏ合
金めっきを施すことを特徴とする耐摩耗性に優れた金め
つき材である。Copper alloys used as spring materials for connector contacts include beryllium copper, titanium steel, phosphor bronze, brass,
There are many types of copper alloys such as nickel silver, but the present invention uses copper alloys that have a Vickers hardness of 230 or less and a ten-point average roughness of the material surface of 0.80 μm or less as a base plating of 1.0 μm or more. This is a gold-plated material with excellent wear resistance, characterized by applying bright nickel plating of 5.0 μm or less, and then applying gold plating or Au-Go alloy plating thereon.
金めつきの耐摩耗性は表面の金めつきが厚い程良好であ
り、下地が硬い程良好である。また、金めつきを厚くす
るより下地を硬くする方が耐摩耗性向上の効果が大きい
ことは良く知られている。The wear resistance of gold plating is better as the gold plating on the surface is thicker, and the harder the base is, the better. It is also well known that making the base harder is more effective in improving wear resistance than making the gold plating thicker.
そこで、耐摩耗性が必要なコクタクトには高硬度の材料
を用いれば良いのであるが、電気伝導度や曲げ性等の特
性値が悪く、コクタクトを小型化した場合など適当でな
いことがある。コクタクトの素材を選択の際、耐摩耗性
よりも電気伝導度や曲げ性等の特性が優先するので、ビ
ッカース硬度が２３０以下の銅合金を使用する。Therefore, it is possible to use a material with high hardness for a contact act that requires wear resistance, but it may not be suitable when the contact act is miniaturized due to poor characteristic values such as electrical conductivity and bendability. When selecting the material for the Cotact, properties such as electrical conductivity and bendability take precedence over wear resistance, so a copper alloy with a Vickers hardness of 230 or less is used.
従来、ニッケル下地めっきは、Ｃｕ−Ａｕの拡散防止お
よび下地の高硬度化による耐摩耗性の向とに有効である
と考えられている。本発明者は拡散防止の観点からでは
なく、耐摩耗性向上の観点から試験を行い、耐摩耗性向
上のためには、Ａｕめっきの下地表面粗さが重要であり
、その下地表面は滑らかな程耐摩耗性は良いことを知見
した。Conventionally, nickel base plating is considered to be effective in preventing Cu-Au diffusion and improving wear resistance by increasing the hardness of the base. The present inventor conducted tests not from the perspective of preventing diffusion, but from the perspective of improving wear resistance, and found that the roughness of the base surface of Au plating is important for improving wear resistance, and that the base surface must be smooth. It was found that the wear resistance is good.
下地としてニッケルめっきを施す場合、ニッケルめっき
表面は素材表面が滑らかな程滑らかになる。When applying nickel plating as a base, the nickel plating surface becomes smoother as the material surface is smoother.
本発明において下地のニッケルめっきを光沢ニッケルめ
っきとするのは光沢ニッケルめっきは一般的に無光沢ニ
ッケルめっきと比べて硬く、また、表面のレベリング能
力があり、めっき面を平滑にするからである。しかしな
がら１表面の十点平均粗さ（Ｒｚ）が０，８０μｍを超
える銅素材に光沢ニッケルめっきを施し、その表面を十
分に滑らかとするには、光沢ニッケルめっきを５．０μ
ｍより厚く施さなければならないが、加工性の面から５
゜０μｍより厚く施せないので銅素材表面の十点平均粗
さ（Ｒｚ）を０．８０μｍ以下とする。又、このような
銅素材に光沢ニッケルめっきを施す場合は、そのめっき
厚が １．０μｍ以上が有効であることを知見した。ま
た、５．０μｍより厚い場合、曲げ加工時にクラックが
発生し易いので、ニッケルめっき厚みは １．０μｍ以
上から５．０μ［ｎ以下とする。In the present invention, bright nickel plating is used as the underlying nickel plating because bright nickel plating is generally harder than matte nickel plating, and also has surface leveling ability to smooth the plated surface. However, in order to apply bright nickel plating to a copper material whose surface has a ten-point average roughness (Rz) of more than 0.80 μm, and to make the surface sufficiently smooth, the bright nickel plating must be applied to a surface roughness of 5.0 μm.
It must be applied thicker than m, but from the viewpoint of workability, it is
Since it cannot be applied thicker than 0 μm, the ten-point average roughness (Rz) of the surface of the copper material should be 0.80 μm or less. In addition, we have found that when bright nickel plating is applied to such a copper material, it is effective to have a plating thickness of 1.0 μm or more. Further, if the thickness is greater than 5.0 μm, cracks are likely to occur during bending, so the thickness of the nickel plating should be from 1.0 μm or more to 5.0 μm or less.
金めつきもしくはＡｕ−Ｃｏ合金めっきの厚さは特に要
件としないが、実用上から又経済的にも一般産業機器用
のコネクタとしては０．３〜０．７μｍ程度で良い。The thickness of the gold plating or Au--Co alloy plating is not particularly required, but from a practical and economical point of view, a thickness of about 0.3 to 0.7 μm is sufficient for connectors for general industrial equipment.
なお、代表的な光沢ニッケル、Ａｕ及びＡｕ−Ｃｏ合金
めっき浴及びめっき条件は特に限定されるものではない
が、−例をあげると下記の通りである。Note that typical bright nickel, Au, and Au-Co alloy plating baths and plating conditions are not particularly limited, but examples are as follows.
（１）光沢ニッケルめっき
硫酸ニッケル ３５０ ＫＩＱ塩化ニッケ
ル ４５ｇＩＱはう酸 ４０ｇ
ＩＱ
ＹニッケルＲＨ−１（８忙メタルブレーティングｔ４ｆ
Ｇ） １ｇＩＱＹニッケルＲ１１−２（） ｌｏｇ
／ＱｐＨ４
温 度 ５０℃陰極電流密度
ｔｏ Ａ／ｄイかくはん
スターシーかくはん（２）金めつき
テンペレックス７０２ （８本エレクトロプレテイン
グ・エンジニャーズケ糾）（金属金 ｔ６ｇ、ｌ）
ｐ Ｈ６，７
比 重 １８ Ｂｅ温 度
６０℃陰極電流密度
３ ＡＩｄｒｄかくはん スターシ
ーかくはん（３）金合金（Ａｕ−Ｃｏ）めっき
Ｅ−Ａｕ−９（日鉱メタルブレーティング（４１）金属
金 １４ ｇＩＱ
コバルト ０．２ｇＩＱ
Ｈ
温 度
６０ ℃
比 重 １１ Ｂｅ陰極電流密
度 ３ Ａ／ｄボかくはん
スターシーかくはん〔実施例〕
次に実施例について具体的に説明する。(1) Bright nickel plated nickel sulfate 350 KIQ nickel chloride 45gIQ phosphoric acid 40g
IQ Y nickel RH-1 (8 busy metal brating t4f
G) 1gIQY Nickel R11-2() log
/QpH4 Temperature 50℃ Cathode current density to A/d I Stirring
Starsea Stirring (2) Gold-plated Temperex 702 (8 pieces Electroplating Engineer's Stir) (Metallic gold T6g, l) pH 6,7 Specific gravity 18 Be temperature 60℃ Cathode current density
3 AIdrd stirring Starcy stirring (3) Gold alloy (Au-Co) plating E-Au-9 (Nikko Metal Blating (41) Metallic gold 14 gIQ Cobalt 0.2gIQ H Temperature 60 ℃ Specific gravity 11 Be cathode current density 3 A/d boiler stirring
Starsea Stirring [Example] Next, an example will be specifically described.
表面粗さの異なる厚さＯ，ｌｎ＋ｍのりん青銅（Ｃ５２
１０）を通常の脱脂、酸洗した後、前記（１）の光沢め
っき浴にて所定の厚さ（第１表記載）のニッケルめっき
を施した後、その−Ｈに前記（２）または（，３）のめ
っき浴、めっき条件で金あるいはＡ ｕ −Ｃ，０めっ
きを所定の厚さ（第１表記載）施した。Phosphor bronze (C52) with different surface roughness and thickness O, ln+m
After normal degreasing and pickling of 10), nickel plating is applied to a predetermined thickness (listed in Table 1) in the bright plating bath of (1), and then the -H is treated with (2) or ( Gold or Au-C,0 plating was applied to a predetermined thickness (listed in Table 1) using the plating bath and plating conditions of , 3).
摩耗試験はＪＩＳ Ｈ８５０３’］、往復運動摩耗試験
法にほぼ準拠して行った。、ＩＩＳ Ｉ＋ ８５０３９
．往復運動摩耗試験法では試料（本試験ではＣ５２１０
にめっきしたもの）を研摩紙で摩耗するようになってい
るが、本実施例では実際の条件に近い試験を行うために
研摩紙の代わりに、銅箔にニッケル下地めっき、金めつ
きを上記と同様の条件で施したものを用いて試験を行い
評価した。耐摩耗性の評価はＪＩＳ Ｈ８５０３９，往
復運動摩耗試験法と同様にした。The abrasion test was conducted in accordance with JIS H8503', a reciprocating abrasion test method. , IIS I+ 85039
．． In the reciprocating wear test method, the sample (in this test, C5210
However, in this example, in order to conduct a test close to the actual conditions, the copper foil with nickel base plating and gold plating was used instead of the abrasive paper. Tests were conducted and evaluated using the same conditions as above. Wear resistance was evaluated in the same manner as JIS H85039, reciprocating wear test method.
ここに、ＷＲ：耐摩耗性（ＤＳ／μｍ）Ｎ ：試験ＤＳ
数（ＯＳ）
ｔｌ：予備摩耗後の試料の金めつきの厚さ（μｆｆ１）
Ｌ２：試験後の試料の金めつきの厚さ（μｍ）試料のめ
っき仕様および試験結果を第１表に示す。Here, WR: Wear resistance (DS/μm) N: Test DS
Number (OS) tl: Thickness of gold plating on sample after preliminary wear (μff1)
L2: Thickness of gold plating of sample after test (μm) The plating specifications and test results of the sample are shown in Table 1.
これから判るように、本発明例Ｎ（１１〜４は、耐摩性
（ＷＲ）が１６，０００〜４０，０００ （ＤＳ／ μ
ａ＋）と大きく、特にＡｕ−Ｃｏ合金めっきしたＮａ３
，４は特に耐摩耗性が優れている。As can be seen, the present invention examples N (11 to 4) have wear resistance (WR) of 16,000 to 40,000 (DS/μ
a+), especially Au-Co alloy plated Na3
, 4 have particularly excellent wear resistance.
一方、Ｎα５は、素材表面粗さ（Ｒｚ）を１．１μｍと
粗くしたもの、Ｎａ６は下地光沢めっき厚み０．５μｍ
と薄くしたものであるが、いずれも耐摩耗性が劣ってい
ることが判る。On the other hand, Nα5 has a roughened material surface roughness (Rz) of 1.1 μm, and Na6 has a base gloss plating thickness of 0.5 μm.
However, it can be seen that both have poor wear resistance.
以下余白
第 １ 表
荷 重 ７００ｇ
摩耗回数 ２００００Ｓ
〔発明の効果〕
以上示したように、本発明により耐摩耗比に優れた金め
つき材が得られ、コネクタのコンタクト等の用途に好適
に用いられる。Margin No. 1 Surface load: 700g Number of wear: 20,000S [Effects of the invention] As shown above, the present invention provides a gold-plated material with an excellent wear resistance ratio, which can be suitably used for connector contacts, etc. .
Claims (1)
十点平均粗さが０．８０μｍ以下である銅合金素材に下
地めっきとして１．０μｍ以上５．０μｍ以下の光沢ニ
ッケルめっきを施し、その上に金めっき又はＡｕ−Ｃｏ
合金めっきを施すことを特徴とする耐摩耗性に優れた金
めっき材。A copper alloy material with a Vickers hardness of 230 or less and a ten-point average roughness of the material surface of 0.80 μm or less is coated with bright nickel plating with a thickness of 1.0 μm or more and 5.0 μm or less as a base plating, and then gold plated on top of it. Plating or Au-Co
Gold-plated material with excellent wear resistance characterized by alloy plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32480388A JPH02173289A (en) | 1988-12-24 | 1988-12-24 | Gold plated material having superior wear resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32480388A JPH02173289A (en) | 1988-12-24 | 1988-12-24 | Gold plated material having superior wear resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02173289A true JPH02173289A (en) | 1990-07-04 |
Family
ID=18169852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32480388A Pending JPH02173289A (en) | 1988-12-24 | 1988-12-24 | Gold plated material having superior wear resistance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02173289A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001234361A (en) * | 2000-02-24 | 2001-08-31 | Ibiden Co Ltd | Highly corrosion resistant nickel-gold plating |
| US7238432B2 (en) * | 2003-08-25 | 2007-07-03 | Dowa Mining Co., Ltd. | Metal member coated with metal layers |
| JP2008248371A (en) * | 2007-03-30 | 2008-10-16 | Dowa Metaltech Kk | High corrosion resistance, and gold plating member of high productivity |
-
1988
- 1988-12-24 JP JP32480388A patent/JPH02173289A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001234361A (en) * | 2000-02-24 | 2001-08-31 | Ibiden Co Ltd | Highly corrosion resistant nickel-gold plating |
| JP4490542B2 (en) * | 2000-02-24 | 2010-06-30 | イビデン株式会社 | IC card with terminals |
| US7238432B2 (en) * | 2003-08-25 | 2007-07-03 | Dowa Mining Co., Ltd. | Metal member coated with metal layers |
| JP2008248371A (en) * | 2007-03-30 | 2008-10-16 | Dowa Metaltech Kk | High corrosion resistance, and gold plating member of high productivity |
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