JPH0217325U - - Google Patents
Info
- Publication number
- JPH0217325U JPH0217325U JP1988096665U JP9666588U JPH0217325U JP H0217325 U JPH0217325 U JP H0217325U JP 1988096665 U JP1988096665 U JP 1988096665U JP 9666588 U JP9666588 U JP 9666588U JP H0217325 U JPH0217325 U JP H0217325U
- Authority
- JP
- Japan
- Prior art keywords
- laser
- parts
- dividing
- marking device
- predetermined pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010330 laser marking Methods 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 1
Landscapes
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Description
第１図は本考案の実施例によるレーザマーキン
グ装置の概略構成図、第２図は第１図のレーザマ
ーキング装置によるマーキング方法を示す概略図
、第３図は従来のレーザマーキング装置の概略構
成図、第４図は第３図のレーザマーキング装置に
よるマーキング方法を示す概略図、第５図は２連
タイプのＩＣフレームの概略図である。
主要部分の符号の説明、３……レーザ発振器、
５……マスク、６……結像レンズ、９１，９２…
…プリズム。
FIG. 1 is a schematic diagram of a laser marking device according to an embodiment of the present invention, FIG. 2 is a schematic diagram showing a marking method using the laser marking device of FIG. 1, and FIG. 3 is a schematic diagram of a conventional laser marking device. , FIG. 4 is a schematic diagram showing a marking method using the laser marking device of FIG. 3, and FIG. 5 is a schematic diagram of a double type IC frame. Explanation of symbols of main parts, 3... Laser oscillator,
5...Mask, 6...Imaging lens, 91, 92...
…prism.
Claims (1)
部品に対して同時に所定パターンをマーキングす
るレーザマーキング装置であつて、前記レーザを
Ｎ分割する分割手段と、前記分割手段によりＮ分
割されたレーザを前記所定パターンを介して前記
部品の夫々に同時に照射するレーザ照射手段とを
有することを特徴とするレーザマーキング装置。 A laser marking device that simultaneously marks a predetermined pattern on N parts (N is an integer of 2 or more) by irradiating a laser, the laser marking device comprising a dividing means for dividing the laser into N parts, and a dividing means for dividing the laser into N parts. and a laser irradiation means for simultaneously irradiating each of the parts with a laser beam in the predetermined pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988096665U JPH0217325U (en) | 1988-07-21 | 1988-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988096665U JPH0217325U (en) | 1988-07-21 | 1988-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217325U true JPH0217325U (en) | 1990-02-05 |
Family
ID=31321717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988096665U Pending JPH0217325U (en) | 1988-07-21 | 1988-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217325U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH049293A (en) * | 1990-04-27 | 1992-01-14 | Canon Inc | Projecting device |
| JP2007119181A (en) * | 2005-10-28 | 2007-05-17 | Toray Ind Inc | Method of manufacturing sheet roll, sheet roll, and device for manufacturing sheet roll |
| KR102264066B1 (en) * | 2021-03-17 | 2021-06-14 | 신봉근 | System of smart controller for Injection molding machine by image analysis with AI and operating method thereof |
-
1988
- 1988-07-21 JP JP1988096665U patent/JPH0217325U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH049293A (en) * | 1990-04-27 | 1992-01-14 | Canon Inc | Projecting device |
| JP2007119181A (en) * | 2005-10-28 | 2007-05-17 | Toray Ind Inc | Method of manufacturing sheet roll, sheet roll, and device for manufacturing sheet roll |
| KR102264066B1 (en) * | 2021-03-17 | 2021-06-14 | 신봉근 | System of smart controller for Injection molding machine by image analysis with AI and operating method thereof |
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