JPH02172240A - Manufacture of electronic part - Google Patents

Manufacture of electronic part

Info

Publication number
JPH02172240A
JPH02172240A JP32644188A JP32644188A JPH02172240A JP H02172240 A JPH02172240 A JP H02172240A JP 32644188 A JP32644188 A JP 32644188A JP 32644188 A JP32644188 A JP 32644188A JP H02172240 A JPH02172240 A JP H02172240A
Authority
JP
Japan
Prior art keywords
resin
electrode lead
case
bonded
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32644188A
Other languages
Japanese (ja)
Inventor
Kazukuni Kajiwara
梶原　一訓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP32644188A priority Critical patent/JPH02172240A/en
Publication of JPH02172240A publication Critical patent/JPH02172240A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE:To prevent a resin film from attaching to a surface to be wire-bonded of an electrode lead and enable highly reliable electric connection by a method wherein at the time of resin-molding of a case, resin is injected into a die cavity and molded while a position to be bonded of the electrode lead is interposed with pressure applied by a resin filling die from front and rear. CONSTITUTION:At the time of resin molding of a case, if an electrode lead 12 is to be fitted into a groove 22 of a first die 19, the rear of a region to be bonded of the electrode lead 12 is mounted on a top face 26a of each protrusion 26 provided on a lower die. By applying pressure to both dies 19, 20 from upward and downward with pressing force F with a second die 20 aligned, the region to be bonded on the electrode lead 12 is kept interposed strongly by dies from front and rear, and a cavity 24 is filled with resin in this state. Therefore, no resin enters the electrode surface, preventing the resin film from attaching. This secures and simplifies electrical connection between the electrode lead 12 and a function element 17, enabling highly reliable electronic parts to be obtained.

Description

【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） この発明は、電子部品の製造方法に係わり、とくにその
樹脂製ケースを貫通して板状電極リードが設けられ、こ
れと内部の機能素子とをワイヤボンディングする構造の
部品の樹脂モールド方法に関する。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a method of manufacturing an electronic component, and particularly relates to a method of manufacturing an electronic component, in which a plate-shaped electrode lead is provided through a resin case of the electronic component. The present invention relates to a resin molding method for parts having a structure in which internal functional elements are wire-bonded.

（従来の技術） モールドされた樹脂製ケースの内部に半導体ベレットな
どの機能素子を収容し、その電極とケースの一部を気密
に貫通する板状導電体リード電極の被ボンディング位置
でワイヤボンディングされた電子部品は広い分野で使用
されている。(Prior art) A functional element such as a semiconductor pellet is housed inside a molded resin case, and wire bonding is performed at the bonding position of a plate-shaped conductive lead electrode that hermetically passes through a part of the case and the electrode. Electronic components are used in a wide range of fields.

その−例は、第６図乃至第８図に示すように、モールド
成形された樹脂製ケース１１の一部を気密に貫通して、
複数個の板状導電体製電極リード１２〜１６が設けられ
、中央の電極リード１４からケースの底部１１ａに延長
されたパッド部１４ｅ上に、半導体ベレット１７が固定
されている。そして、各電極リードの被ボンディング位
置１２ａ−１ｅａと、半導体ベレット１７の電極とが、
ワイヤ１８によりボンディングされ、電気的に接続され
ている。ケース１１の底部Ｌｌａと上蓋１１ｂとは、接
着剤により接合部１１ｃで気密接合されている。なお、
ケースの内部空間Ｓには、不活性ガスが充填されている
。As shown in FIGS. 6 to 8, an example thereof is to airtightly penetrate a part of a molded resin case 11,
A plurality of plate-shaped conductor electrode leads 12 to 16 are provided, and a semiconductor pellet 17 is fixed on a pad portion 14e extending from the central electrode lead 14 to the bottom portion 11a of the case. Then, the bonding positions 12a-1ea of each electrode lead and the electrode of the semiconductor pellet 17 are
They are bonded and electrically connected by wires 18. The bottom Lla of the case 11 and the top lid 11b are hermetically sealed together at a joint 11c using an adhesive. In addition,
The internal space S of the case is filled with inert gas.

このような電子部品の製造にあたっては、第９図に示す
ような金型１９および２０を使用して樹脂モールドする
。すなわち図の下方の第１金型１９には、ケースの底部
に対応する形状、寸法の凹部２１、および電極リードの
一部を保持する溝２２が形成されている。図の上方の第
２金型２０には、ケースの周壁を形成するための環状溝
２３が設けられている。In manufacturing such electronic components, resin molding is performed using molds 19 and 20 as shown in FIG. That is, the first mold 19 in the lower part of the figure is formed with a recess 21 having a shape and size corresponding to the bottom of the case, and a groove 22 for holding a part of the electrode lead. The second mold 20 in the upper part of the figure is provided with an annular groove 23 for forming the peripheral wall of the case.

そこで、各電極リード１２〜ＩＧを第１金型１９の溝２
２に嵌める。なお各電極リードのケース周壁中に位置す
る部分には樹脂が入り込んでモールドされリードがケー
スから抜けるのを防止するための透孔１２ｂ・・・が形
成されている。そして第２金型２０を合致させ、両全型
１９．２０を上下から加圧力Ｆで加圧し、キャビティ２
４内に樹脂を充填し、固化する。Therefore, each electrode lead 12 to IG is connected to the groove 2 of the first mold 19.
Fit into 2. Note that the portion of each electrode lead located in the case peripheral wall is filled with resin and molded to form a through hole 12b for preventing the lead from coming out of the case. Then, the second mold 20 is aligned, and both molds 19 and 20 are pressurized from above and below with a pressure F to form the cavity 2.
4 is filled with resin and solidified.

（発明が解決しようとする課題） 従来のこのような製造方法によると、７１極リードのワ
イヤボンディングすべき位置の電極面１２ａは、第２金
型２０に密着しているはずであるが、電極リード自身が
薄くて曲りやすく、またリードの電極面１２ａと金型と
の接触面を押し開くように注入樹脂が両者間に入り込み
やすい。そのため、第１０図に示すように樹脂モールド
されたケース内のボンディングすべき電極面１２ａに、
薄い樹脂膜２５が付着したままになってしまう。この樹
脂膜２５を除去することは容易でなく、半導体素子との
ワイヤボンディングが困難となり、あるいは信頼性の高
い接続ができないという不都合がある。(Problems to be Solved by the Invention) According to such a conventional manufacturing method, the electrode surface 12a of the 71-pole lead at the position where wire bonding is to be performed should be in close contact with the second mold 20, but the electrode surface 12a should be in close contact with the second mold 20. The lead itself is thin and bendable, and the injected resin easily enters between the electrode surface 12a of the lead and the mold by pushing open the contact surface between them. Therefore, as shown in FIG. 10, on the electrode surface 12a to be bonded in the resin-molded case,
The thin resin film 25 remains attached. It is not easy to remove this resin film 25, which makes wire bonding with a semiconductor element difficult or makes it impossible to make a highly reliable connection.

この発明は、以上のような不都合を解消し、ケース内に
延長された電極リードのワイヤボンディングすべき面に
樹脂膜が付着せず、信頼性の高い電気的接続ができる電
子部品の製造方法を提供することを目的とする。The present invention eliminates the above-mentioned disadvantages and provides a method for manufacturing electronic components that allows highly reliable electrical connection without the resin film adhering to the surface of the electrode lead extended into the case where wire bonding is to be performed. The purpose is to provide.

［発明の構成］ （課題を解決するための手段） この発明は、板状の導電体電極リードを一部に貫通させ
内部に機能素子を収容するケースの樹脂モールドの際に
、電極リードの披ボンディング位置を表裏両面から樹脂
充填用金型で加圧挟持しながら樹脂を金型のキャビティ
内に注入しモールドする電子部品の製造方法である。[Structure of the Invention] (Means for Solving the Problems) The present invention provides a method for displaying electrode leads when resin molding a case in which a plate-shaped conductive electrode lead is partially penetrated and a functional element is housed inside. This is a method of manufacturing electronic components in which resin is injected into the cavity of the mold and molded while the bonding position is held under pressure between the front and back surfaces of the resin filling mold.

（作　用） この発明によれば、ケース内の電極リードのワイヤボン
ディングすべき面は、金型で表裏両面から加圧挟持され
て金型面と確実に密着されるので、この電極面には樹脂
が流入せず、樹脂膜が付着しないようにできる。それに
より、電極リードと機能素子との電気的接続が確実、容
品にできて信頼性の高い電子部品を得ることができる。(Function) According to the present invention, the surface of the electrode lead in the case to which wire bonding is to be performed is held under pressure by the mold from both the front and back sides and is securely brought into close contact with the mold surface. It is possible to prevent the resin from flowing in and the resin film from adhering. Thereby, the electrical connection between the electrode lead and the functional element can be ensured, and a highly reliable electronic component can be obtained.

また、電極リードをかなり薄くすることもでき、また比
較的や柔かい材料を使用することも可能である。It is also possible to make the electrode leads considerably thinner and to use relatively softer materials.

（実施例） 以下図面を参照してその実施例を説明する。なお同一部
分は同一符号であられす。(Example) An example will be described below with reference to the drawings. Identical parts are designated by the same reference numerals.

ｍ１図および第２図に示すように、下側の第１金型１９
の、電極リードの被ワイヤボンディング領域１２ａの真
下となる位置に、円柱状の突出部２Ｂを一体形成しであ
る。この突出部２Ｂの頂面２６ａは、この上に載る電極
リード１２の幅寸法より小さい寸法であり、リードから
外にはみ出さないようになっている。なお、図の下方の
第１金型１９には従来例と同様に、ケースの底部に対応
する形状、寸法の凹部２１、および電極リードの一部を
保持する溝２２が形成されている。また図の上方の第２
金型２０には、ケースの周壁を形成するための環状溝２
３が設けられている。As shown in Figure m1 and Figure 2, the lower first mold 19
A cylindrical protrusion 2B is integrally formed at a position directly below the wire bonding region 12a of the electrode lead. The top surface 26a of the protrusion 2B has a width smaller than the width of the electrode lead 12 placed thereon, so that it does not protrude from the lead. Note that, like the conventional example, a recess 21 with a shape and size corresponding to the bottom of the case, and a groove 22 for holding a part of the electrode lead are formed in the first mold 19 at the bottom of the figure. Also, the second
The mold 20 has an annular groove 2 for forming the peripheral wall of the case.
3 is provided.

ケースの樹脂モールド成形にあたっては、各電極リード
１２〜１Ｂを第１金型１９の溝２２に鉄める。この場合
、各電極リードの被ボンディング領域の裏面は下側の金
型に設けられている各突出部２６の頂面２８ａに載せら
れる。そして図の上側から第２金型２０を合致させ、両
金型１９．２０を上下から加圧力Ｆで加圧する。それに
より、各電極リードの披ボンディング領域は表裏両側か
ら金型で強く挟持された状態のままであり、この状態で
キャビティ２４内に樹脂が充填される。そして樹脂が固
化される。When resin molding the case, each electrode lead 12 to 1B is fitted into the groove 22 of the first mold 19. In this case, the back surface of the bonding region of each electrode lead is placed on the top surface 28a of each protrusion 26 provided on the lower mold. Then, the second mold 20 is aligned from the top of the figure, and both molds 19 and 20 are pressurized with a pressure F from above and below. As a result, the bonding area of each electrode lead remains strongly held between the molds from both the front and back sides, and the cavity 24 is filled with resin in this state. The resin is then solidified.

こうしてできたケース１１は、第３図に示すように、底
部１１ａの一部に金型の突出部に対応する穴２７が残る
が、これは電極リード１２で気密に塞がれている。そし
て各電極リードの被ボンディング面１２ａ・・・には樹
脂膜がまったく付着しない。As shown in FIG. 3, the case 11 thus produced has a hole 27 remaining in a part of the bottom 11a corresponding to the protrusion of the mold, but this hole is hermetically closed with the electrode lead 12. Further, no resin film adheres to the bonding surface 12a of each electrode lead.

このケースＵは、第４図および第５図に示すようにその
内部に半導体ベレットのような機能素子１７を収容し、
所定電極と各リードの彼ボンディング領域とをボンディ
ングワイヤ１８で電気的に接続し、蓋１１ｂを被せて気
密接合する。こうして電子部品を完成する。As shown in FIGS. 4 and 5, this case U accommodates a functional element 17 such as a semiconductor pellet therein,
A predetermined electrode and a bonding region of each lead are electrically connected by a bonding wire 18, and a lid 11b is placed on the cap 11b for an airtight connection. In this way, the electronic component is completed.

なお、ケースの一部に形成された孔２７は、そのままで
もよいし、あるいは適当な樹脂を詰めて塞いでもよい。Note that the hole 27 formed in a part of the case may be left as is, or may be filled with a suitable resin and closed.

［発明の効果］ 以上説明したようにこの発明によれば、ケース内の電極
リードの披ボンディング面が、表裏両面から金型で挟持
され、密着された状態で樹脂が充填されるので、この電
極リードの被ボンディング面には樹脂膜が付着しない。[Effects of the Invention] As explained above, according to the present invention, the bonding surfaces of the electrode leads in the case are held between the front and back sides by the molds, and the resin is filled in a state where they are in close contact with each other. No resin film adheres to the bonding surface of the lead.

それにより、電極リードと機能素子との電気的接続が確
実、容易にでき、信頼性の高い電子部品を得ることがで
きる。Thereby, electrical connection between the electrode lead and the functional element can be made reliably and easily, and a highly reliable electronic component can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの発明の実施例を示す樹脂モールド工程での
要部縦断面図、第２図は第１図の２−２における横断面
図、第３図は成形されたケースを示す縦断面図、第４図
はその完成部品の縦断面図、第５図は第４図の５−５に
おける横断面図、第６図は一般的な電子部品を示す一部
切欠上面図、第７図および第８図は各々第６図の７−７
．８−８における各縦断面図、第９図は従来の樹脂モー
ルド工程を示す要部縦断面図、第１０図はそれにより得
られる電子部品の要部縦断面図である。 １１・・・樹脂製ケース、１２〜１６・・・電極リード
、１２ａ−１ｅａ・・・被ボンディング位置、１７・・
・機能素子、１８・・・ボンディングワイヤ、１９．２
０・・・金型、２Ｂ・・・突出部。 出願人代理人　弁理士　鈴江武彦 第３図 第４図 第２図 第　５図 第９ 図Fig. 1 is a vertical cross-sectional view of main parts in the resin molding process showing an embodiment of the present invention, Fig. 2 is a cross-sectional view taken at 2-2 in Fig. 1, and Fig. 3 is a longitudinal cross-sectional view showing a molded case. Figure 4 is a vertical cross-sectional view of the completed part, Figure 5 is a cross-sectional view taken at 5-5 in Figure 4, Figure 6 is a partially cutaway top view showing a general electronic component, and Figure 7 is a vertical cross-sectional view of the completed part. and Figure 8 are 7-7 in Figure 6, respectively.
．． 8-8, FIG. 9 is a vertical cross-sectional view of a main part showing a conventional resin molding process, and FIG. 10 is a vertical cross-sectional view of a main part of an electronic component obtained thereby. 11... Resin case, 12-16... Electrode lead, 12a-1ea... Bonding position, 17...
・Functional element, 18... Bonding wire, 19.2
0...Mold, 2B...Protrusion part. Applicant's Representative Patent Attorney Takehiko Suzue Figure 3 Figure 4 Figure 2 Figure 5 Figure 9

Claims (1)

【特許請求の範囲】 板状の導電体電極リードを一部、に貫通させてケースを
樹脂モールドし、該ケースの内部に配置した機能素子と
前記電極リードの被ボンディング位置とをワイヤボンデ
ィングする電子部品の製造方法において、 上記ケースの樹脂モールドの際に、上記電極リードの被
ボンディング位置を表裏両面から樹脂充填金型で加圧挟
持しながら、樹脂を金型キャビティ内に充填しモールド
することを特徴とする電子部品の製造方法。[Claims] An electronic device in which a case is resin-molded with a plate-shaped conductor electrode lead partially penetrated, and a functional element arranged inside the case is wire-bonded to a bonding position of the electrode lead. In the method for manufacturing parts, when resin molding the case, the bonding position of the electrode lead is held under pressure by a resin-filled mold from both the front and back sides, and resin is filled into the mold cavity and molded. Characteristic manufacturing method for electronic components.
JP32644188A 1988-12-24 1988-12-24 Manufacture of electronic part Pending JPH02172240A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32644188A JPH02172240A (en) 1988-12-24 1988-12-24 Manufacture of electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32644188A JPH02172240A (en) 1988-12-24 1988-12-24 Manufacture of electronic part

Publications (1)

Publication Number Publication Date
JPH02172240A true JPH02172240A (en) 1990-07-03

Family

ID=18187839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32644188A Pending JPH02172240A (en) 1988-12-24 1988-12-24 Manufacture of electronic part

Country Status (1)

Country Link
JP (1) JPH02172240A (en)

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