JPH02172108A - Tape-like wire with electromagnetic-wave shield - Google Patents

Abstract

PURPOSE:To obviate a separate treatment for a terminal treatment and improve flexibility by exposing a wiring pattern at both ends of a tape-like wire with a shield, and electrically connecting a shield layer and an earth circuit of a printed wiring pattern. CONSTITUTION:A wiring pattern 4 is continuously formed of a solderable electrically conductive paint on the surface of a polyimide film 2, with a predetermined thickness, of a aluminum laminated tape 3 in accordance with a screen printing method. Two, on both ends, out of this pattern 4 is made to be a grand pattern, and a solder resist film 5 is formed on a printed surface along the length direction of a terminal part 9, with a length required for soldering, and the grand pattern 4, except both end printed surfaces of given length. Further, a coated shield layer 7, consisting of an electrically conductive paint containing metal powder, and a protective covering layer 10 are successively formed, and the grand pattern 4 and the shield layer 7 are connected to each other through perforations 6 provided in a resist film 5 with a suitable spacing, and a part of a solder covering layer 8 at both end boundary parts of the resist film 5 is covered with the covering layer 10.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electromagnetic shielded tape-shaped electric wire (hereinafter simply referred to as a shielded tape-shaped electric wire) that does not require terminal treatment.

(Prior art) In recent years, electromagnetic interference in electrical and electronic equipment has become a major problem. When tape-shaped electric wires used in OA equipment and FA equipment receive electromagnetic interference, equipment functions are disrupted, resulting in the operation of the equipment. Become. For this reason, various shielded tape-shaped electric wires have been proposed in which the tape-shaped electric wires are also laminated with shielding tape.

Generally, shielded tape-shaped electric wires are made by sandwiching multiple conductors arranged in parallel between two upper and lower insulating films, or
Or, by applying insulation extrusion coating to a tape-shaped electric wire, attaching a shielded ground wire to one side of the tape-shaped electric wire, and bonding the metal foil side of a laminated tape with aluminum foil or copper foil as a shield layer over the shielded ground wire. The structure is as follows. When using it, the conductor and shielded ground wire are exposed by cutting it to the required length and peeling off the shield layer and insulator at both ends. When laminating the shield tape, it is difficult to position the shield earth wire, and the process is complicated because the end treatment of the shield earth wire and the end treatment for peeling off the shield layer and the insulator must be performed in separate steps.

Therefore, ■A shielded tape-shaped wire is made by laminating foil shielding tape on both surfaces of the insulator of the tape-shaped wire, and the end portion is peeled off and removed, leaving the foil-shaped shielding tape portion facing the ground conductor. There is a proposal in JP-A-62-58516 that terminals are then attached by driving external terminals into each conductor and the grounding conductor.

In addition, ■ shield layers are provided in parallel on the upper and lower parts of multiple rectangular conductors arranged in parallel, and a grounding wire is interposed between the shield layer and any of the rectangular conductors to connect the shield layer and the rectangular conductors. 1986-14 of a shielded tape-shaped electric wire with an insulating layer applied to the space and outer periphery of the electrically connected structure
No. 5415 is proposed.

However, for (2), it is necessary to carry out terminal treatment in a separate process, and for (2), there are extremely difficult manufacturing problems, and the terminal treatment to expose the rectangular conductor is extremely complicated.

(Problems to be solved by the invention) The present invention has been made in view of the above, and has good flexibility.
The purpose of this invention is to provide a shielded tape-shaped electric wire in which the conductor circuit necessary for connection is exposed at both ends in advance, and any conductor is electrically connected to the shield layer, eliminating the need for terminal treatment. be.

(Means for Solving the Problems) The present invention forms a printed surface with a wiring pattern using a solderable conductive paint on the surface of a heat-resistant insulating film of an aluminum laminate tape, and prints the wiring pattern excluding the printed surfaces at both ends of a certain length. A solder resist film, a coated shield layer and a protective coating layer made of conductive paint containing metal powder are sequentially provided on the surface, a solder coating layer is formed on the printed surface of the wiring pattern exposed at both ends, and the ground pattern of the printed wiring pattern is The coated shield layer made of a conductive paint containing metal powder penetrates through holes provided in the solder resist film at appropriate intervals and is electrically connected,
Further, the solder resist film is coated with a protective coating layer so as to embed a part of the solder coating layer at both end boundaries.

Next, the configuration of the present invention will be further explained.

The heat-resistant insulating film of the aluminum laminate tape used in the present invention is made of polypropylene, cross-linked polyethylene, polyethylene, polyester, polyimide, polybenzimidazole, polyimide amide, polysif-enyl ether, fluorine-based resin tetrafluoroethylene, polyfluoride. Films such as ethylene propylene chloride and silicone resins with adhesive properties can be used, especially those that can withstand the heating temperature and heating time for curing conductive paints and soldering methods (including low-temperature soldering). Any heat-resistant insulating film other than those mentioned above may be used, and is not particularly limited.

As a conductive paint that can be soldered, there is a conductive paint that can be soldered (patent application No. 7530/1989), which the present inventors previously filed.
No. 2, Patent Application No. 1983-75303, Patent Application No. 1982-958
No. 09, Japanese Patent Application No. 1983-113197, Japanese Patent Application No. 1987-1
13198 and Japanese Patent Application No. 61-228704).

[Part 1: Japanese Patent Application No. 1983-75302] (i) Metallic copper powder, (ii) Resin mixture (resin mixture consisting of p-tert-butylphenol resin, metal surface activated resin, and thermosetting resin) , (iii) a metal salt of a saturated or unsaturated fatty acid, and (iv) a metal chelate forming agent.

[Part 2: Japanese Patent Application No. 61-75303] (i) Metallic copper powder, (ii) thermosetting resin, (iii) metal salt of saturated fatty acid or unsaturated fatty acid, (iv) metal chelate forming agent, (
v) a solderable conductive paint consisting of a soldering promoter;

[Part 3: Japanese Patent Application No. 61-95809] (i) metallic copper powder, (ii) resin mixture (resin mixture consisting of metal surface activated resin and thermosetting resin), (iii) saturated fatty acid or A solderable conductive paint comprising an unsaturated fatty acid or a metal salt thereof, (iv) a metal chelate forming agent, and (v) a soldering promoter.

[Part 4: Japanese Patent Application No. 113197/1982] (i) Metallic copper powder, (ii) resin mixture (resin mixture consisting of metal surface activated resin and thermosetting resin), (iii) saturated fatty acid or Unsaturated fatty acids or their metal salts, and (
iv) A solderable conductive paint consisting of a metal chelating agent.

[Part 5: Japanese Patent Application No. 113198/1982] (i) Metallic copper powder, (ii) Resin mixture (resin mixture consisting of metal surface activated resin, granular phenolic resin, and thermosetting resin), ( iii) A solderable conductive paint comprising a saturated fatty acid or an unsaturated fatty acid or a metal salt thereof, (1v) a metal chelate forming agent, and (v) a soldering accelerator.

[Part 6: Japanese Patent Application No. 61-228704] (i) Metallic copper powder, (ii) resin mixture (resin mixture consisting of acrylic resin and amine resin), (iii) saturated fatty acid or unsaturated fatty acid or the like. and (iv) a metal chelate forming agent.

[Part 7] Conductive paint that can be soldered with metal powder other than those listed above.

etc. can be used appropriately.

The solder resist film formed in the present invention has mechanical strength, weather resistance, chemical resistance, and electrical insulation properties that can withstand heat during soldering and protect printed wiring patterns, and has paint-like properties. For example, epoxy resin, epoxy
Mainly made of melamine resin, but also synthetic resins such as polyurethane, butyl rubber, and silicone elastomer, which can be screen printed, and films of the same type as the above-mentioned base film are used, and are pasted together using a roll laminator. Any material that can be formed by

The conductive paint containing metal powder used in the present invention may be any conductive paint containing metal powder that can form an electromagnetic shielding layer.
Although not particularly limited, a sufficiently small DC resistance is required, and a sheet resistance of 0.1 Ω/hole or less is preferable, and even if the resistance value is higher than that, it is difficult to obtain the desired shielding effect with two pastes. Can not. For example, the conductive paint that can be soldered as described above and the conductive paint that the present inventors previously applied for (Japanese Patent Application No. 61-99014, Japanese Patent Application No. 61
228703, Japanese Patent Application No. 234221, and Japanese Patent Application No. 328095/1983).

[Part 8: Patent Application No. 1983-99014] Metallic copper powder 100
Resin mixture (melamine resin 20-60% by weight)
and 15 to 50 parts by weight of a resin mixture consisting of a polyol and a polyester resin or/and 80 to 40 weight % of an alkyd resin, and 1 to 8 parts by weight of a saturated fatty acid or an unsaturated fatty acid or a metal salt thereof. paint.

[Part 9: Patent Application No. 1983-228703] Metallic copper powder 10
Resin mixture (melamine resin 30-7 parts by weight)
A conductive paint comprising 10 to 40 parts by weight of a resin mixture consisting of 0% by weight and 70 to 30% by weight of an acrylic resin, and 1 to 8 parts by weight of a saturated fatty acid or an unsaturated fatty acid or a metal salt thereof.

[Part 10: Patent Application No. 1983-234221] Metallic copper powder 1
00 parts by weight, resin mixture (melamine resin 30~
10 to 40 parts by weight of a resin mixture consisting of 70% by weight of acrylic resin and 70 to 30% by weight of acrylic resin, 1 to 8 parts by weight of saturated fatty acids or unsaturated fatty acids or metal salts thereof, and a metal surface treatment agent. 1 to 7 parts by weight of a conductive paint.

(Part 11: Japanese Patent Application No. 62-328095) Metallic copper powder 1
00 parts by weight, resin mixture (melamine resin 35~
10 to 25 parts by weight of a resin mixture consisting of 50% by weight, 20 to 30% by weight of a polyester resin, and 15 to 30% by weight of a resol type phenolic resin, 0.1 to 2 parts by weight of a fatty acid or a metal salt of a fatty acid, and a chelate. A conductive paint comprising 0.5 to 4 parts by weight of a forming agent.

[Part 12] Conductive paints containing metal powders other than those mentioned above can be used as appropriate. .

The material for forming the protective coating layer is -component heat-curable silicone rubber (TSE3, 212.3221.325
．． 325-B, 3251, 3251-C, 3252, manufactured by Raiyu Silicone Co., Ltd.], two-component heat-curing silicone adhesive [two-component addition type self-adhesive silicone, TSE33
60, Raiyu Silicone Co., Ltd., 5E1701, CY
Silicone elastomers such as 52-237W/C, CY52-227A/B, manufactured by Toray Silicone Co., Ltd.] are preferably used, but they do not provide good protection for printed wiring patterns with solder coating layers or conductive paint for electromagnetic shielding layers. For example, the material for forming the solder resist film may also be used, and is not particularly limited.

(Function) The shielded tape-like electric wire of the present invention constructed as described above has a conductive coating of a shield layer applied to the entire surface of a thin solder resist film, and through-holes provided at appropriate intervals in the acid film. Since the shield layer and the ground pattern of the printed wiring pattern are electrically connected, there is no need to process their terminals in a separate process, preventing electromagnetic interference.
Electrical reinforcement can be obtained by preventing crosstalk in the signal circuit and by substantially reducing the resistance of the ground pattern.

Further, since the printed wiring pattern, solder resist film, conductive coating film of the shield layer, protective coating layer, etc. are formed as extremely thin layers, flexibility is dramatically improved.

Further, since a part of the wiring pattern having the solder coating layer at both end boundaries of the solder resist film is fixed so as to be embedded in the protective coating layer, the wiring pattern at the boundary is reinforced,
Flexibility is preferred.

(Example) Next, embodiments of the present invention will be described based on the drawings.

Example 1 First, p-tert-butyl phenol resin, maleated rosin, and resol type phenol resin were mixed in a ratio of 10:10.
A resin mixture is prepared by blending at a ratio of 80% by weight and kneading with a triaxial roll.

Next, 95 parts by weight of dendritic metal copper powder with an average particle size of 5 to IO μm, 5 parts by weight of a resin mixture, 4 parts by weight of potassium oleate, and 20 parts by weight of triethanolamine were blended, and some butyl cellosolve acetate was added as a solvent. In addition, solderable conductive paint [Part 1] is prepared by kneading it with a triaxial roll for 20 minutes to give it an appropriate viscosity. This was printed onto the 50 μm thick heat-resistant polyimide film (2) side of the aluminum laminate tape (3) using a screen printing method, with a width of 1o++++.
Thickness 30±3pm, spacing 1III+, length 400+
++s+, 10 units of wiring pattern (4) are formed continuously, with 15 wires as one unit, and the wiring pattern coating film (4) is cured by passing through a heating zone under curing conditions of 150° C. for 30 minutes. Next, two of the 15 wiring patterns (4) of one unit are used as ground patterns, and terminal parts (9) of the necessary length to be soldered onto the wiring patterns (4) at both ends and the ground pattern (4゛) A solder resist film (5) with a thickness of 30 μm was created by applying solder resist ink mainly composed of epoxy/melamine resin by screen printing using a plate-making screen with masks provided at regular intervals along the length direction of the top. was formed and cured at 130°C for 20 minutes. At this time, a through hole (6) is formed in the solder resist film (5) in the longitudinal direction on the ground pattern (4') by the mask of the screen, and the wiring pattern at both ends (
Since the solder resist film (5) is not applied to 4) due to the mask of the screen, the wiring pattern (4) of the terminal portion (9) of the required length to be soldered is exposed at both ends.

To form the shield layer (7), a resin mixture (50% by weight of melamine resin and 20% by weight of polyester resin) is added to 100 parts by weight of dendritic metal copper powder with a particle size of 5 to 10 μm.
16 parts by weight of a resin mixture consisting of 30% by weight of resol-type phenolic resin, 1 part by weight of potassium oleate, and 2.5 parts by weight of triethanolamine, and some butyl cellosolve acetate was added as a solvent. 3 minutes
Conductive paint kneaded with an axial roll to an appropriate viscosity [Part 1]
1) and apply it to the entire surface of the solder resist film (5) except for a part of both ends by screen printing method,
Heat treatment is performed at 150° C. for 30 minutes to harden the coating film and form a shield N (7) with a thickness of 30 μm.

At this time, the conductive paint enters the ground pattern (4') through the through hole (6) formed in the solder resist film (5), and the shield layer (7) and the ground pattern (4') are electrically connected. be done.

Next, liquid non-corrosive flux is applied to the surface of the polyimide film (2) having the wiring pattern (4) exposed at both ends, and a solder coating layer is applied to the surface of the wiring pattern (4) at both ends using a soldering device that sprays a waveform jet. (8) and remove the flux remaining on the surface of the polyimide film (2). Then, -component thermosetting silicone is applied so as to embed part of the wiring pattern (4) having the solder coating layer (8) on the shield layer (7) and at both end boundaries of the solder resist film (5). Rubber coating material (TSE3251,
(manufactured by Raiyu Silicone Co., Ltd.) was coated using a screen printing method, and heated at 150°C for 1 hour to harden it to a thickness of 20 μm.
The shielded tape-shaped electric wire of the present invention (10) was provided with a protective coating layer (10) of 1.0 m, and cut into 1 unit of 15 wiring patterns.
1) is obtained.

Example 2 A wiring pattern (4) was formed on one side of an 80 μm thick polyimide film (2) using a conductive paint that can be soldered, without using an aluminum laminate tape.
A shielded tape-shaped electric wire of the present invention is obtained in the same manner as in .

(Effects of the Invention) As explained above, in the shielded tape-shaped electric wire of the present invention, the wiring pattern is exposed at both ends, and the shield layer and the ground circuit of the printed wiring pattern are electrically connected, so the terminal treatment is not required separately. There is no need to apply it during the process. Also, printed wiring patterns,
Since the solder resist film, shield layer, protective coating layer, etc. are formed as extremely thin layers, flexibility is dramatically improved.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of an example of a shielded tape-shaped electric wire according to the present invention, in which (A) is a perspective view, (B) is a perspective view with a part of the layer peeled off in the longitudinal direction, and FIG. Figure 3 is a perspective view of forming a wiring pattern of conductive paint that can be soldered on the heat-resistant insulating film surface of aluminum laminate tape. FIG. 4 is a perspective view in which a conductive coating film is formed by leaving a part of both ends of the solder resist film shown in FIG. 3, and the reference numerals in the figure are as follows. (1)...Aluminum foil, (2)...Heat-resistant insulating film, (3)...Aluminum laminate tape, (4)...Soldering is a possible printed wiring pattern using conductive paint, (4°)...ground circuit, (5)...solder resist film, (6)...
...Through hole, (7) ...Shield layer, (8)
...Solder coating layer, (9)...Terminal part of required length to be soldered, (10)...Protective coating layer, (11)...・Tape-shaped electric wire with shield.

Claims (2)

[Claims] (1) The printed surface of the wiring pattern is formed using solderable conductive paint on the heat-resistant insulating film surface of the aluminum laminate tape, and the printed surface except for the printed surfaces at both ends of a certain length is coated with a solder resist film and conductive paint containing metal powder. A coated shield layer and a protective coating layer are sequentially provided, a solder coating layer is formed on the printed surface of the wiring pattern exposed at both ends, and a ground pattern of the printed wiring pattern and a coated shield layer made of the conductive paint containing the metal powder are formed. pass through holes provided in the solder resist film at appropriate intervals for electrical connection, and are coated with a protective coating layer so as to embed part of the solder coating layer at both end boundaries of the solder resist film. A tape-shaped electric wire with an electromagnetic wave shield characterized by comprising: (2) The tape-shaped electric wire with electromagnetic shielding according to claim 1, wherein the aluminum laminate tape is a heat-resistant insulating film.