JP2686549B2 - Manufacturing method of shielded tape-shaped electric wire - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for producing a tape-shaped electric wire having an electromagnetic shield layer used for wiring equipment.

(Prior Art) Conventionally, a method for manufacturing a shielded tape-shaped electric wire is performed by sandwiching a plurality of flat rectangular conductors or foil-shaped conductors arranged in parallel with upper and lower two insulating films, or by insulating and extruding and covering them. An electric wire is continuously manufactured, and a shielded tape is formed by laminating a metal foil surface of a laminate tape having an aluminum foil or a copper foil as a shield layer on a shield earth wire while adhering the shield earth wire to one surface of the tape-like electric wire. Manufactured a wire-shaped electric wire.

In use, the wire is cut to the required length, the shield layers and the insulator at both ends are peeled off, and the flat conductor or the foil conductor and the shield ground wire are used. In this type of shielded tape-like electric wire, when laminating a shield tape on a tape-like electric wire manufactured in advance, it is difficult to position the shield earth wire, and the treatment of the shield earth wire and peeling of the shield layer and the insulator are performed. The terminal processing had to be performed in a separate process, and the process was complicated.

Therefore, the outer periphery of a plurality of foil-shaped conductors arranged in parallel is covered with an insulator, and a shielded tape-like electric wire in which a foil-like shield tape is laminated on the surface of the insulator is manufactured. After peeling off and removing the shield tape leaving the portion facing the conductor, by driving the external terminal, the external terminal driven into the grounding conductor portion breaks the insulator, and the grounding conductor and the upper and lower Japanese Patent Application Laid-Open No. 62-58516 has been proposed in which a shield tape is simultaneously connected to form a ground.

Also, the outer circumference of a plurality of rectangular conductors arranged in parallel is covered with an insulator, and the upper and lower portions of the rectangular conductor in the insulator are
A shield layer is provided parallel to the rectangular conductor, and a ground wire is interposed between the shield layer and any of the rectangular conductors to electrically connect the shield layer and the rectangular conductor. No. 145415 has been proposed.

However, and with shielded tape-like wires,
In addition to the problem that various conductors must be manufactured, a separate process is required to separate and remove the shield tape, leaving the part facing the grounding conductor in terminal processing, and to attach external terminals. In regard to the above, it is not possible to cover the outer periphery of the shield layer and the rectangular conductor with an insulator while electrically connecting the shield layer and the rectangular conductor by interposing a ground wire between the shield layer and any of the rectangular conductors. There is a very difficult problem in manufacturing, and the terminal treatment for exposing the rectangular conductor is extremely complicated.

(Problems to be Solved by the Invention) The present invention has been made in view of the above, and continuously forms wiring patterns of various shapes by using a solderable conductive paint without using a foil-shaped conductor and a rectangular conductor. Pre-exposed conductor circuits with a solder coating on the wiring pattern are exposed at both ends of the shielded tape-shaped wire in advance, eliminating the need for terminal treatment, allowing immediate circuit connection, and excellent electromagnetic shielding function. An object of the present invention is to provide an easy-to-manufacture method of a tape-shaped electric wire with a shield, which can be grounded by soldering an electromagnetic shield layer to an arbitrary conductor circuit.

(Means for Solving Problems) According to the manufacturing method of the present invention, a wiring pattern is printed by a solderable conductive paint in the lateral direction of the surface of the heat resistant insulating film of the aluminum laminate tape, and the printed surface is cured. A step of forming a solder resist film on the wiring pattern while leaving the wiring pattern, and forming a solder resist film by passing a wiring pattern surface exposed at both ends of the heat resistant insulating film through a molten solder bath. The process of forming a solder coating layer on the surface of a wiring pattern that does not include the solder coating layer and exposes both ends of the solder coating layer so that both ends of the aluminum foil can be soldered vertically on the solder resist film. A step of forming a continuous printing surface of an appropriate width with a paint, and applying the insulating film surface of a narrow aluminum laminate tape that has been cured. It is a sign.

Next, the configuration of the manufacturing method of the present invention will be further described.

Heat-resistant insulating film used for aluminum laminated tape is polypropylene, cross-linked polyethylene, polyester, polyimide, polybenzimidazole, polyimide amide, polydiphenyl ether, fluorine resin polytetrafluoride ethylene, polyfluorinated ethylene propylene, adhesive It is possible to use a film such as a silicone resin having a heat resistance, especially if it can withstand the heating temperature and heating time and the soldering means (including low temperature solder) in the conductive coating curing process. It may be a conductive insulating film and is not particularly limited. Examples of the solderable conductive paint include solderable conductive paints previously filed by the present inventors (Japanese Patent Application Nos. 61-75302 and 61-7).
5303, Japanese Patent Application No. 61-95809, Japanese Patent Application No. 61-113197, Japanese Patent Application No. 61-113198, Japanese Patent Application No. 61-228704).

[Part 1: Japanese Patent Application No. 61-75302] (i) Copper metal powder, (ii) Resin admixture (resin admixture of p-tert-butylphenol resin, metal surface activated resin and thermosetting resin) And (iii) a metal salt of a saturated or unsaturated fatty acid and (iv) a metal chelating agent.

[Part 2: Japanese Patent Application No. 61-75303] (i) Metallic copper powder, (ii) Thermosetting resin, (iii) Metal salt of saturated fatty acid or unsaturated fatty acid, (iv) Metal chelate forming agent, (v) ) A solderable conductive paint comprising a soldering accelerator.

[Part 3: Japanese Patent Application No. 61-95809] (i) Metallic copper powder, (ii) resin admixture (resin admixture consisting of metal surface activated resin and thermosetting resin), (iii)
Saturated or unsaturated fatty acids or metal salts thereof,
A solderable conductive paint comprising (iv) a metal chelating agent and (v) a soldering accelerator.

[Part 4: Japanese Patent Application No. 61-113197] (i) Metallic copper powder, (ii) Resin admixture (resin admixture consisting of metal surface activated resin and thermosetting resin), (iii)
Saturated or unsaturated fatty acids or metal salts thereof,
And (iv) a metal-chelating agent and a solderable conductive paint.

[Part 5: Japanese Patent Application No. 61-113198] (i) Copper metal powder, (ii) Resin mixture (resin mixture comprising metal surface-activating resin, granular phenol resin and thermosetting resin), (iii ) A solderable conductive paint comprising a saturated fatty acid or an unsaturated fatty acid or a metal salt thereof, (iv) a metal chelate forming agent, and (v) a soldering accelerator.

[Part 6: Japanese Patent Application No. 61-228704] (i) Metallic copper powder, (ii) resin mixture (resin mixture composed of acrylic resin and amino resin), (iii) saturated fatty acid or unsaturated fatty acid or a mixture thereof And (iv) a metal chelating agent.

[No. 7] A solderable conductive paint containing a metal powder other than the above.

Etc. can be used appropriately.

(Operation) As described above, the manufacturing method of the present invention has the following effects.

The wiring pattern is formed on the heat-resistant insulating film surface of the aluminum laminate tape by a printing method using a conductive paint that can be soldered, so that the dimensions and intervals of the wiring pattern can be made extremely accurate.

A mask with a solder resist film is provided on the wiring pattern, leaving both ends of the wiring pattern, and a solder coating layer is applied to the wiring pattern surface exposed at both ends. The wiring pattern is made simple and most of the conductive paint is protected by a solder resist film.

At the boundary between the wiring pattern and the conductor circuit of the solder-covered solder foil layer, the narrow aluminum laminate tape heat-resistant insulating film surface includes a part of the solder cover layer of the conductor circuit, and both ends of the solder cover layer are exposed. Since it is deposited on the solder resist film, the boundary portion is firmly held and does not cause cracks in bending. Further, since conductor circuits that can be immediately connected are exposed at both ends of the obtained shielded tape-shaped electric wire, terminal treatment such as peeling or removal of the insulator is unnecessary.

In use, a conductor circuit that is cut laterally according to the desired number of conductors and exposed at both ends on both outer sides and solderable conductive paint printed on both ends on the aluminum foil of the narrow aluminum laminate tape If and are soldered and grounded, they function as a tape-shaped electric wire with a shield. Also, prepare a large number of odd conductor circuits, and if the odd conductor circuits are soldered to the solderable conductive paint printed surface on the aluminum foil as described above and grounded, the even conductors become the signal circuits. It can be used as a tape-shaped electric wire with a shield.

(Example) Next, an example of the present invention will be described with reference to the drawings.

First, 10: 10: 80% by weight of p-tert-butylphenol resin, maleated rosin, and resole type phenol resin
And kneading with a triaxial roll to prepare a resin mixture. Next, dendritic metallic copper powder having an average particle size of 5 to 10 μm
95 parts by weight, resin mixture 5 parts by weight, potassium oleate 4
Parts by weight, 20 parts by weight of triethanolamine, and a small amount of butyl cellosolve acetate as a solvent was added.
A solderable conductive paint (9) [Part 1] adjusted to an appropriate viscosity by kneading with a triaxial roll for one minute is prepared.

The conductive paint (9) thus adjusted is supplied to the kneading roll (10), and the homogenized solderable conductive paint (9) has a final paint thickness of 30 by the intermediate roll group (11).
Conductive paint (9) is transferred to a printing roll (12) that is evenly spread to a size of μm, then a wiring pattern plate is formed on the outer peripheral surface, and the surface of the plate is mesh etched to 25 to 50 μm. Let The transferred solderable conductive paint (9) is in synchronization with the peripheral speed of the printing roll (12) and has a polyimide film (2) having an aluminum foil shield layer (2) which runs while being pressed by the backup roll (13). A wiring pattern (4) made of a solderable conductive paint (9) is transferred onto the surface of 3). The aluminum laminate tape (5) on which the wiring pattern (4) is transferred is then passed through a heating zone under curing conditions of 150 ° C. for 30 minutes to form a wiring pattern coating film (4) formed on the tape (5). Cure.

Next, a solder resist film (16) is continuously formed on the wiring pattern by a printing roll method, leaving a terminal portion (15) of a required length for soldering on the wiring pattern coating film (4) at both ends. Let it harden. Then, a liquid non-corrosive flux is applied in a spray form to the polyimide film (3) surface having the wiring pattern (4) exposed at both ends, and then the both wiring pattern (4) surfaces are passed through a soldering device that jets in a waveform. The solder coating layer (6) is applied, the residual flux adhering to the surface of the polyimide film (3) is removed, and it is wound as an aluminum laminate tape (7) having a conductor circuit.

Next, the Amumi laminate tape (8), which is narrower than the aluminum laminate tape (7) and of the same quality, can be soldered vertically on both ends of the aluminum foil (2 ') by a printing device as shown in FIG. A continuous printing coating surface (18) having an appropriate width (A) is formed using the conductive paint (9), and the printing coating surface (18) is cured under the heating condition of 150 ° C. for 30 minutes to obtain an aluminum laminated tape ( Wind up 8).

Then, a part of the solder coating layer (6) at the boundary between the end portions (15) of both ends of the solder resist film (16) formed on the polyimide film (3) surface of the aluminum laminate tape (7) is buried. The polyimide film (3) side of the aluminum laminate tape (7) and the polyimide film (3 ′) of the narrow aluminum laminate tape (8) so as to be wrapped.
The tape-shaped electric wire (1) with a shield is passed through the bonding device (14) so that the conductor wires (17) for connection are exposed at both ends and are firmly bonded to each other so that they have the same length. .

Such a tape-shaped electric wire with a shield manufactured (1)
Are cut in the horizontal direction according to the desired number of conductors, that is, the number of wiring patterns, and are individually shielded tape-like electric wires (1).
Then, by soldering the conductor circuit exposed on both outer ends and the printed coating surface (18) on the aluminum foil (2 ') as a ground pattern, electromagnetic wave interference is prevented, signal circuit crosstalk is prevented, and the ground pattern is prevented. The resistance can be substantially reduced to provide electrical reinforcement.

As a ground forming method other than the above soldering, a resist ink is applied to the entire boundary between the printed coating surface (18) of the shielded tape-shaped electric wire (1) and the wiring pattern (4) to which the solder coating layer (6) is attached. A resist cured film (curing condition 150 ° C., 30 minutes) is formed by using the screen printing method, and the inventors of the present invention applied first between the resist coating and the printed coating surface (16) and the ground wiring pattern (4). Conductive paint for jumper circuits (Japanese Patent Application No. 61-99014, Japanese Patent Application No. 61-228703)
No. 61-234221, Japanese Patent Application No. 62-328095), for example, resin mixture (melamine resin 30 to 70% by weight and acrylic resin 70 to 30% by weight) per 100 parts by weight of metallic copper powder. 10-40
A bypass jumper circuit is formed by a screen printing method using a conductive coating material containing 1 to 8 parts by weight of a saturated fatty acid or unsaturated fatty acid or a metal salt thereof and cured (curing condition 150 ° C. 30 minutes). You can use it.

In the embodiment, the wiring patterns are linear and parallel to each other, but it can be easily understood that wiring patterns having various curved portions can be printed separately. In this embodiment, the method of manufacturing the shielded tape-shaped electric wire by the printing roll method is illustrated, but a semi-automatic printing machine or a full-automatic printing machine by the screen printing method can also be used to form a wiring pattern made of a conductive paint that can be soldered with aluminum. The shielded tape-shaped electric wire according to the present invention can be manufactured by continuously forming the laminated tape on the heat-resistant insulating film and performing the same as in the example.

(Effect of the invention) As described above, in the manufacturing method of the present invention, two wide and narrow aluminum laminate tapes are used, and one of the wide aluminum laminate tapes has a conductive property that can be soldered to the heat-resistant insulating film surface. A wiring pattern is formed laterally by a printing method using a paint, and a solder resist film is applied to the wiring pattern leaving both ends of the horizontal wiring pattern, and a solder coating layer is applied to the wiring pattern exposed at both ends to form a conductor circuit. The heat-resistant insulating film surface is attached with the coated surface on which the conductive paint that can be soldered vertically on both ends of the aluminum foil of other narrow aluminum laminated tape is printed continuously As a result, a tape-shaped electric wire with a shield can be obtained which has an extremely simple manufacturing method and good dimensional accuracy. Moreover, the conductor circuits are exposed on the insulating film surface of the aluminum laminate tape at both ends of the shielded tape-shaped electric wire, and a large number of shielded tape-shaped electric wires can be obtained by cutting the shielded tape-shaped electric wire in the lateral direction according to a desired wiring pattern. It can be formed by soldering a conductor circuit exposed on both ends as a ground pattern and a narrow aluminum laminate tape-shaped conductive coating surface, and these terminal treatment steps can be largely omitted, which is economical. There is an effect that can be manufactured.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of the manufacturing method of the present invention, FIG. 2 is a cross-sectional explanatory view of a shielded tape-shaped electric wire obtained by the manufacturing method of the present invention, and FIG. 3 is an aluminum laminated tape according to the present invention. Fig. 4 is a schematic diagram of an example of a printing device for forming a wiring pattern of a conductive paint that can be soldered on the heat-resistant insulating film of Fig. 4, and Fig. 4 shows the solder resist film on the wiring pattern of the heat-resistant insulating film and the terminals at both ends. FIG. 5 is a perspective view of an aluminum laminate tape having a solder coating layer formed thereon, and FIG. 5 is a perspective view of a narrow aluminum laminate tape having a conductive coating surface which is solderable vertically on both ends of the aluminum foil. The reference numerals in the figure are as follows. (1) …… Tape-shaped electric wire with shield, (2) …… Aluminum foil for shield, (3) …… Heat-resistant insulating film, (4)
...... Wiring pattern coating film made of solderable conductive paint, (5) ...... Wide aluminum laminate tape with wiring pattern, (6) ...... Solder coating layer, (7) ...... on wiring pattern Wide aluminum laminated tape with solder resist film and solder coating layers on both ends. (8)
...... Narrow aluminum laminate tape with a conductive coating surface that can be soldered vertically on both ends of aluminum foil, (9) …… Solderable conductive paint, (10) …… Kneading roll, (11) ……
Intermediate roll group, (12) …… Printing roll, (13) …… Backup roll, (14) …… Adhesive device, (15) …… Terminal part of required length for soldering, (16) …… Solder resist Membrane, (17) ... Conductive circuit with exposed solder coating layer, (18) ... Solderable conductive coating surface formed on aluminum foil.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tsunehiko Terada 2-3-1, Iwata-cho, Higashi-Osaka City, Osaka Prefecture Tatsuta Electric Wire Co., Ltd. (72) Shohei Morimoto 2-3-3, Iwata-cho, Higashi-Osaka City, Osaka No. 1 in Tatsuta Electric Wire Co., Ltd. (72) Inventor Kihachi Ohnishi 2-3-1, Iwata-cho, Higashi-Osaka City, Osaka (56) Reference JP-A-1-304612 (JP, A) Flat 2-148617 (JP, A)

Claims (1)

(57) [Claims] 1. A step of printing a wiring pattern on a surface of a heat-resistant insulating film of an aluminum laminate tape with a conductive paint that can be soldered, and hardening the printed surface. The wiring pattern is formed on the wiring pattern. Forming a solder resist film leaving both ends, passing the wiring pattern surface exposed at both ends on the heat resistant insulating film through a molten solder bath to form a solder coating layer on the surface of the wiring pattern where the solder resist film is not formed Step of including a part of the solder coating layer, exposing the both ends of the solder coating layer on the solder resist film, the printed surface of a continuous appropriate width by a conductive paint that can be soldered vertically on both ends of the aluminum foil Of the tape-shaped electric wire with a shield, which comprises: Production method.