JPH0216670U - - Google Patents
Info
- Publication number
- JPH0216670U JPH0216670U JP1988095328U JP9532888U JPH0216670U JP H0216670 U JPH0216670 U JP H0216670U JP 1988095328 U JP1988095328 U JP 1988095328U JP 9532888 U JP9532888 U JP 9532888U JP H0216670 U JPH0216670 U JP H0216670U
- Authority
- JP
- Japan
- Prior art keywords
- light
- section
- solid
- concentrating
- imaging device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988095328U JPH0216670U (ko) | 1988-07-19 | 1988-07-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988095328U JPH0216670U (ko) | 1988-07-19 | 1988-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0216670U true JPH0216670U (ko) | 1990-02-02 |
Family
ID=31319988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988095328U Pending JPH0216670U (ko) | 1988-07-19 | 1988-07-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0216670U (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012186235A (ja) * | 2011-03-04 | 2012-09-27 | Renesas Electronics Corp | 半導体装置の製造方法 |
| JP2016054289A (ja) * | 2014-08-18 | 2016-04-14 | オプティツ インコーポレイテッド | ワイヤボンドセンサパッケージ及び方法 |
-
1988
- 1988-07-19 JP JP1988095328U patent/JPH0216670U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012186235A (ja) * | 2011-03-04 | 2012-09-27 | Renesas Electronics Corp | 半導体装置の製造方法 |
| JP2016054289A (ja) * | 2014-08-18 | 2016-04-14 | オプティツ インコーポレイテッド | ワイヤボンドセンサパッケージ及び方法 |