JPH02165613A - Method of sealing electronic component - Google Patents
Method of sealing electronic componentInfo
- Publication number
- JPH02165613A JPH02165613A JP63321628A JP32162888A JPH02165613A JP H02165613 A JPH02165613 A JP H02165613A JP 63321628 A JP63321628 A JP 63321628A JP 32162888 A JP32162888 A JP 32162888A JP H02165613 A JPH02165613 A JP H02165613A
- Authority
- JP
- Japan
- Prior art keywords
- resin film
- sealing
- film
- irradiated
- aperture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 44
- 229920005989 resin Polymers 0.000 claims abstract description 44
- 239000002904 solvent Substances 0.000 claims abstract description 5
- 239000003990 capacitor Substances 0.000 abstract description 14
- 230000000873 masking effect Effects 0.000 abstract description 7
- 230000002950 deficient Effects 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 229920002799 BoPET Polymers 0.000 abstract 1
- 239000004925 Acrylic resin Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- SOGFHWHHBILCSX-UHFFFAOYSA-J prop-2-enoate silicon(4+) Chemical compound [Si+4].[O-]C(=O)C=C.[O-]C(=O)C=C.[O-]C(=O)C=C.[O-]C(=O)C=C SOGFHWHHBILCSX-UHFFFAOYSA-J 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Adjustable Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
主束上公肌且立界
本発明は、ケースタイプのトリマコンデンサや可変抵抗
器のように特性値を可変となした構成の電子部品におい
て、これを表面実装化が可能なようにケースを密閉状態
とする電子部品の封止方法に関する。[Detailed description of the invention] Principal flux, public surface, and vertical field The present invention provides surface-mounting of electronic components having variable characteristic values, such as case-type trimmer capacitors and variable resistors. The present invention relates to a method of sealing an electronic component to make the case as airtight as possible.
盗」四ｌ克逝
上記のトリマコンデンサとしては、従来、第４図に示す
ようにケースＡの外側に設けたネジＢを回転させると、
ケース内に設けた回転子Ｃがケース内の固定子りに対し
て回転して容量が変化し、特性値を変えられるように構
成され、ケースには一般に開口部Ｅが設けられている。In the conventional trimmer capacitor mentioned above, as shown in Fig. 4, when screw B provided on the outside of case A is rotated,
A rotor C provided in the case rotates with respect to a stator in the case to change the capacitance and change the characteristic value, and the case is generally provided with an opening E.
ところで、近年では表面実装の普及にともない、基板の
上に電子部品を接着剤等で仮止めし、その後フロー半田
で半田付けすることが採用されつつある。このため、従
来密閉されていなかった電子部品も、フロー半田の時に
半田やフラックスが内部に侵入しないように、密閉型に
する必要が出てきた。Incidentally, in recent years, with the spread of surface mounting, it has become common to temporarily fix electronic components onto a board using an adhesive or the like, and then solder them using flow soldering. For this reason, it has become necessary to make electronic components that were previously not hermetically sealed so that solder and flux do not get inside during flow soldering.
そこで、電子部品を密閉すべく、
■フィルムをカットして開口部に貼り付ける方法■開口
部と同じ大きさにシール用樹脂膜をシート上に印刷して
その上に開口部を乗せ、樹脂膜を加熱等により硬化させ
る方法
等が従来用いられている。Therefore, in order to seal the electronic components, there are two methods: ■ Cutting the film and pasting it on the opening ■ Printing a sealing resin film on a sheet to the same size as the opening, placing the opening on top of the resin film, Conventionally, a method of curing the material by heating or the like has been used.
しよ°と る
しかしながら、■の方法による場合、フィルムを貼る部
分の肉厚が約０．１〜０．２ｍｍと薄いときには、カッ
トフィルムがズして開口部を完全に封止できないことが
あり、一方、■の方法による場合、ワークの重みでシー
ル用樹脂膜がチップの外にはみ出るために、封止工程に
おける不良品の発生率が高かった。また、後者の方法に
よる場合には、余分なはみ出し分を取り除く必要があり
、このはみ出し分が硬化しているので除去が容易に行え
ず、また硬化に長時間を要し生産性が低下するといった
問題がある。However, when using method (■), if the thickness of the part to be pasted is as thin as approximately 0.1 to 0.2 mm, the cut film may slip and the opening may not be completely sealed. On the other hand, in the case of method (2), the sealing resin film protruded outside the chip due to the weight of the workpiece, resulting in a high incidence of defective products during the sealing process. In addition, when using the latter method, it is necessary to remove excess protrusion, which cannot be easily removed because it has hardened, and it takes a long time to harden, reducing productivity. There's a problem.
本発明は斯かる問題点を解決すべくなされたものであり
、不良品の発生を防止して封止でき、また封止した後に
おいてはみ出し分の除去を容易にでき、更に生産性の向
上を図り得ることとした電子部品の封止方法を提供する
ことを目的とする。The present invention has been made to solve these problems, and it is possible to seal the product while preventing the occurrence of defective products, and it is also possible to easily remove the protruding parts after sealing, which further improves productivity. The purpose of the present invention is to provide a method for sealing electronic components that is possible.
ｉ ゛ るための
本発明に係る電子部品の封止方法は、電子部品の開口部
を紫外線硬化性の樹脂膜を用いて覆い、封止の不要な樹
脂膜部分を遮光したのち封止の必要な樹脂膜部分だけに
紫外線を照射して硬化させ、その後、未硬化の封止不要
部分を溶剤で除去することを特徴とする。The method for sealing an electronic component according to the present invention is to cover the opening of the electronic component with an ultraviolet curable resin film, shield the part of the resin film that does not require sealing from light, and then remove the part that does not require sealing. It is characterized by irradiating only the resin film portions with ultraviolet rays to cure them, and then removing the uncured portions that do not require sealing with a solvent.
在−Ｕ
本発明にあっては、電子部品の開口部を紫外線硬化性の
樹脂膜を用いて覆い、封止の不要な樹脂膜部分はマスキ
ングしたのち封止の必要な樹脂膜部分だけに紫外線を照
射して硬化させ、その後、前記不要な樹脂膜部分は溶剤
で除去するので、結果的に樹脂膜により封止したい部分
だけ樹脂膜が残り、また除去する樹脂膜部分は未だ硬化
していないため容易に除去が可能であり、更に、樹脂膜
を開口部よりも大きくするだけで完全にシールを行うこ
とができる。In the present invention, the openings of electronic components are covered with an ultraviolet curable resin film, and after masking the resin film parts that do not require sealing, ultraviolet rays are applied only to the resin film parts that need to be sealed. is irradiated and cured, and then the unnecessary resin film portions are removed with a solvent. As a result, the resin film remains only in the areas that are desired to be sealed with the resin film, and the resin film portions to be removed have not yet hardened. Therefore, it can be easily removed, and further, complete sealing can be achieved simply by making the resin film larger than the opening.
裏−施一±
以下に本発明をトリマコンデンサに適用した場合につい
て説明する。先ず、第１図に示すようにポリプロピレン
、ＰＥＴ等のフィルム１の上にトリマコンデンサの開口
部より少し大きめ（５％以上）の面積に紫外線硬化性の
樹脂膜、例えば粘度が２０００００〜３０００００ｃｐ
のシリコンアクリレート樹脂膜２を印刷する。Back side application The case where the present invention is applied to a trimmer capacitor will be described below. First, as shown in FIG. 1, an ultraviolet curable resin film, for example, with a viscosity of 200,000 to 300,000 cp, is placed on a film 1 made of polypropylene, PET, etc. in an area slightly larger (5% or more) than the opening of the trimmer capacitor.
A silicon acrylate resin film 2 is printed.
その後、第２図に示すように印刷したシリコンアクリレ
ート樹脂膜２の上に、トリマコンデンサ３をその開口部
３ａ（第３図参照）が密着するように載置する。Thereafter, as shown in FIG. 2, the trimmer capacitor 3 is placed on the printed silicone acrylate resin film 2 so that its opening 3a (see FIG. 3) is in close contact with it.
そして、第３図に示すように、フィルム１の下側に、ト
リマコンデンサ３の開口部３ａの外縁と同じ大きさ・形
状の貫通孔４ａが形成されたマスキング具４を、この貫
通孔４ａと開口部３ａの外縁とを位置合わせした状態で
配設する。このとき、マスキング具４とフィルムｌとは
非粘着状態にできるため、位置合わせば容易である。こ
のようにして封止不要な樹脂膜２部分をマスキングした
後、下側から紫外線を照射する。この結果、照射された
樹脂膜２部分は硬化し、非照射の樹脂［２部分は未硬化
の状態のままとなる。Then, as shown in FIG. 3, a masking tool 4 in which a through hole 4a having the same size and shape as the outer edge of the opening 3a of the trimmer capacitor 3 is formed on the underside of the film 1 is attached to the through hole 4a. It is arranged in a state where the outer edge of the opening 3a is aligned. At this time, since the masking tool 4 and the film 1 can be in a non-adhesive state, it is easy to align them. After masking the portions of the resin film 2 that do not require sealing in this manner, ultraviolet rays are irradiated from below. As a result, the irradiated resin film 2 portions are cured, and the non-irradiated resin film 2 portions remain uncured.
その後、フィルム１からトリマコンデンサ３を取り外す
。この取り外しは、上記樹脂膜２とフィルムＩとは密着
性が悪いため、容易に行える。そして、取り外したトリ
マコンデンサ３をトリクロロエタン若しくはフロン等に
より洗浄し、封止に不要な樹脂膜２部分を取り除く。Thereafter, the trimmer capacitor 3 is removed from the film 1. This removal can be easily performed since the resin film 2 and the film I have poor adhesion. Then, the removed trimmer capacitor 3 is cleaned with trichloroethane, chlorofluorocarbon, or the like to remove portions of the resin film 2 that are unnecessary for sealing.
なお、トリマコンデンサ３の開口部３ａを封止する樹脂
ｌｌ１２は、表面実装した後に破って特性値を変えれる
ように薄く形成するのが好ましい。Note that the resin 112 that seals the opening 3a of the trimmer capacitor 3 is preferably formed so thin that it can be broken after surface mounting to change the characteristic values.
また、封止用に用いる樹脂としては、上記したシリコン
アクリレートの他に、ウレタンアクリレート、エポキシ
アクリレートのような紫外線で硬化するものなら何でも
良い。また、必要に応じて上記樹脂に、ターシャルブチ
ルパーオキシベンゾエート、ターシャルブチルヒドロパ
ーオキサイト等の熱の開始剤を添加するようにしても良
い。Further, as the resin used for sealing, in addition to the above-mentioned silicone acrylate, any resin that can be cured by ultraviolet light such as urethane acrylate and epoxy acrylate may be used. Further, if necessary, a thermal initiator such as tert-butyl peroxybenzoate or t-butyl hydroperoxide may be added to the resin.
更に、本発明は上述のトリマコンデンサに限らず、可変
抵抗器や開口部を有する他の電子部品にも適用可能であ
る。Furthermore, the present invention is applicable not only to the above-mentioned trimmer capacitor but also to variable resistors and other electronic components having openings.
光皿■四来
以上詳述した如く本発明による場合には、電子部品の開
口部を紫外線硬化性の樹脂膜を用いて覆い、封止の不要
な樹脂膜部分はマスキングしたのち封止の必要な樹脂膜
部分だけに紫外線を照射して硬化させ、その後、前記不
要な樹脂膜部分は溶４゜
剤で除去するので、以下のような効果がある。Optical Plate ■As detailed above, in the case of the present invention, the opening of the electronic component is covered with an ultraviolet curable resin film, and the parts of the resin film that do not require sealing are masked before sealing is necessary. Only the unnecessary resin film portions are irradiated with ultraviolet rays to be cured, and then the unnecessary resin film portions are removed with a solvent, resulting in the following effects.
■紫外線硬化性の樹脂を用いるので、硬化時間が短縮さ
れ、生産性の向上を図れる。■Using ultraviolet curable resin reduces curing time and improves productivity.
■部品の回りに樹脂がはみ出てもはみ出し部分は未硬化
のため、洗浄により容易に取り除くことができる。■Even if resin protrudes around the parts, the protruding portion is uncured and can be easily removed by cleaning.
■完成品の封止用樹脂膜のはみ出し不良を無くすことが
でき、また、これにより生産性を向上できる。■It is possible to eliminate defects in the sealing resin film of the finished product from sticking out, and this also improves productivity.
第１．２図は本発明を説明するための平面図、第３図は
同じく本発明を説明するための側面図、第４図は従来技
術を説明するための斜視図である。
２・・・樹脂膜、３・・・トリマコンデンサ、３ａ・・
・開口部、４・・・マスキング具、４ａ・・・貫通孔。1.2 is a plan view for explaining the present invention, FIG. 3 is a side view for explaining the present invention, and FIG. 4 is a perspective view for explaining the prior art. 2... Resin film, 3... Trimmer capacitor, 3a...
- Opening, 4... Masking tool, 4a... Through hole.
Claims (1)
て覆い、封止の不要な樹脂膜部分を遮光したのち封止の
必要な樹脂膜部分だけに紫外線を照射して硬化させ、そ
の後、未硬化の封止不要部分を溶剤で除去することを特
徴とする電子部品の封止方法。(1) Cover the opening of the electronic component with an ultraviolet curable resin film, block the parts of the resin film that do not need sealing from light, and then irradiate and cure only the parts of the resin film that need sealing, A method for sealing an electronic component, the method comprising: thereafter removing uncured portions that do not require sealing with a solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63321628A JPH02165613A (en) | 1988-12-19 | 1988-12-19 | Method of sealing electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63321628A JPH02165613A (en) | 1988-12-19 | 1988-12-19 | Method of sealing electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02165613A true JPH02165613A (en) | 1990-06-26 |
Family
ID=18134630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63321628A Pending JPH02165613A (en) | 1988-12-19 | 1988-12-19 | Method of sealing electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02165613A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5579573A (en) * | 1994-10-11 | 1996-12-03 | Ford Motor Company | Method for fabricating an undercoated chip electrically interconnected to a substrate |
| US5895976A (en) * | 1996-06-03 | 1999-04-20 | Motorola Corporation | Microelectronic assembly including polymeric reinforcement on an integrated circuit die, and method for forming same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6155911A (en) * | 1984-08-27 | 1986-03-20 | 株式会社村田製作所 | Method of forming cover sheet on hole of electronic mechanism part |
-
1988
- 1988-12-19 JP JP63321628A patent/JPH02165613A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6155911A (en) * | 1984-08-27 | 1986-03-20 | 株式会社村田製作所 | Method of forming cover sheet on hole of electronic mechanism part |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5579573A (en) * | 1994-10-11 | 1996-12-03 | Ford Motor Company | Method for fabricating an undercoated chip electrically interconnected to a substrate |
| US5895976A (en) * | 1996-06-03 | 1999-04-20 | Motorola Corporation | Microelectronic assembly including polymeric reinforcement on an integrated circuit die, and method for forming same |
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