JPH02164021A - Fixing jig for square semiconductor substrate - Google Patents

Abstract

PURPOSE:To prevent photoresist from going round to the rear side of a square substrate by disposing an orientation flat in the peripheral edge and providing a semiconductor substrate placing means and a suck hole. CONSTITUTION:A fixing jig 4 is made of quartz, substantially in the center of which is formed a substrate housing groove 5 which is equal in depth to the film thickness of a square substrate 1 and which is approximately 1mm larger lengthwise and breadthwise than the size of the square substrate 1. In the approximate center of this substrate housing groove 5, a plurality of sucking holes are formed which are through the fixing jig 4 and enable suction by a vacuum rotary chuck 2. In the fixing jig 4, an orientation flat is formed in such a manner as to be in parallel to one side of the substrate housing groove 5. Photoresist is made to drop and applied while it is sucked in vacuum from the rear side and it is rotated by a vacuum rotary chuck 2. This makes it possible to prevent photoresist from going round to the rear side of a square substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor substrate fixing jig used when applying photoresist to a square semiconductor substrate.

[Conventional technology]

Conventionally, when forming a photoresist coating film on a square semiconductor substrate (hereinafter abbreviated as square substrate), for example, as shown in FIG. The vacuum rotary chuck 2 of the machine (not shown) is used to adsorb and fix the 2
It is rotated at a high speed of 000 rpm to 6000 rpm in the direction of arrow n in the figure, and photoresist is dropped from above to form a photoresist coating film 3.

[Problem to be solved by the invention]

In the above case where a photoresist coating film is formed on a square substrate, the square substrate is directly suctioned and fixed on a vacuum rotating chuck.
Since a photoresist coating film was formed, the photoresist dripped around the periphery of the substrate. As a result, the film thickness of the photoresist a cloth film varies greatly, and at the same time, the photoresist also wraps around the back side of the square substrate, creating unevenness on the back side of the square substrate and making it uneven, causing extreme problems in the next Yuri exposure process. In this case, vacuum suction is not possible, and even if it is not, it is impossible to form a fine pattern.

In addition, there was a drawback that the tool directly came into contact with the periphery of the square substrate, which caused scratches to easily occur.In view of the above problems, the purpose of the present invention is to prevent the photoresist from going around the back side of the square substrate. The purpose of the present invention is to provide such a fixing jig.

[Means to solve the problem]

The present invention is a semiconductor substrate fixing jig in which a rectangular semiconductor substrate is placed and fixed in the center and an orientation flat is provided on the periphery. This fixing jig includes semiconductor substrate placement means using a rectangular groove that accommodates the semiconductor substrate or a plurality of positioning pins that contact the periphery of the semiconductor substrate, and vacuum suction of the semiconductor substrate placed by the means from the back side. It is equipped with a suction hole that enables this.

[Effect]

The placement position of the square substrate is determined by a square groove or a protruding pin, and the placement is fixed by vacuum suction from the back side. The jig has a larger area than the square substrate, and when it is suctioned and fixed with a vacuum rotating chuck, the back side of the square substrate comes into close contact with the fixing jig.

Therefore, when the photoresist is spin-coated in this state, the photoresist does not go around to the back surface of the square substrate.

〔Example〕

The first embodiment of the present invention will be described below with reference to FIGS. 1(a) to 1(C).
).

FIG. 1(a) is a vertical cross-sectional view of a square substrate fixing jig according to the first embodiment of the present invention, FIG. 1(b) is a plan view thereof, and FIG.
) is a vertical cross-sectional view of the photoresist coating film forming process.

In the figure, reference numeral 4 denotes a fixing jig made of quartz.For example, the thickness is thicker than that of the square substrate l, and it is formed into a circular shape with a diameter of 50 mm. The depth is the same as the film thickness of
A substrate storage groove 5 is formed which is about mm larger.

Almost at the center of this substrate storage groove 5, a substrate is inserted through the fixture 4 so that it can be sucked by the vacuum rotary chuck 2.
For example, the diameter of one layer is m8! A plurality of suction holes 6 are formed.

Further, the fixing jig 4 has an orientation flat 7 formed by cutting out a portion of a circular shape so as to be parallel to one side of the substrate storage groove 5 .

Next, the operation of the embodiment configured as above will be explained.

As shown in FIG. 1(C), when the fixing jig 4 is placed on the vacuum rotating chuck 2 and the vacuum system inside the vacuum rotating chuck 2 is depressurized, the fixing jig 4 is fixed by suction. Further, at this time, the square substrate 1 is also suctioned through the suction hole 6 in the substrate storage groove 5 and fixed by suction. Then, while rotating the vacuum rotary chuck 2 at a high speed of 200 rpm to 6000 rpm in the vertical direction of the arrow in the figure, photoresist is dropped from above to form a photoresist coating film 3. After the formation of the photoresist coating film 3 is completed, the depressurization of the vacuum system in the vacuum rotary chuck 2 is stopped, and the square substrate 1 is developed while being held in the fixture 4, and then the exposure process is started. It can be set in the correct position using the orientation flat 7.

Next, a second embodiment will be explained. Unlike the first embodiment, the board storage groove 5 is not formed, but three positioning pins 8 are formed so that adjacent sides of the square board 1 that are perpendicular to each other come into contact with the positioning pins 8 to determine the arrangement. I have to. In figure 0, the two positioning pins 8 are aligned so that they are parallel to the orientation and the flat 7, so that even if the square board l is cracked or deformed, it can be fixed to the square board fixing jig 4. It's Nishide.

〔Effect of the invention〕

As explained above, the rectangular board fixing jig of the present invention has a board arrangement means using a board storage groove or a positioning pin,
It has a suction hole approximately in the center of the square substrate to be placed.
The photoresist can be applied by applying vacuum suction from the back side and dropping photoresist while rotating with a vacuum rotary chuck. Since the photoresist does not wrap around the back surface of the square substrate and there is no unevenness on the back surface, suction and fixation in the next step is ensured and a fine pattern can be formed. Furthermore, the periphery of the square substrate does not come into direct contact with other tools, preventing scratches on the side surface.

Photoregis)! For blood removal, the square substrate is sufficiently fixed to the fixing jig by the photoresist coating on the surface, so there is no need to weld the back side of the square substrate with wax etc. when moving on to the next process. Furthermore, when removing the square substrate from the fixing jig, the photoresist is removed by soaking it in an organic chemical, making it easy to remove it.

[Brief explanation of the drawing]

FIG. 1(a) is a vertical cross-sectional view of a square substrate fixing jig according to the first embodiment of the present invention, FIG. 1(b) is a plan view thereof, and FIG.
) is a vertical cross-sectional view of the photoresist coating film formation process, and Figure 2 (
&) is a vertical cross-sectional view of a square fixing jig according to a second embodiment of the present invention,
FIG. 2(b) is a plan view thereof, FIG. 2(C) is a vertical cross-sectional view of the photoresist coating film forming process, and FIG. 3 is a vertical cross-sectional view of the photoresist coating film forming process of a conventional square substrate. . DESCRIPTION OF SYMBOLS 1... Square substrate, 2... Vacuum rotating chuck, 3... Photoresist coating film, 4... Fixing jig, 5... Substrate storage groove, 6... Suction hole, 7. ...Orientation flat.

Claims (1)

[Claims] A semiconductor substrate fixing jig that arranges and fixes a square semiconductor substrate in the center and has an orientation flat on the periphery, the jig comprising a square groove that accommodates the semiconductor substrate or a plurality of positioning pieces that contact the periphery of the semiconductor substrate. 1. A semiconductor substrate fixing jig, comprising a semiconductor substrate placement means using pins, and a suction hole that allows vacuum suction of the semiconductor substrate placed by the means from the back surface.