JPH0216394B2 - - Google Patents
Info
- Publication number
- JPH0216394B2 JPH0216394B2 JP4534386A JP4534386A JPH0216394B2 JP H0216394 B2 JPH0216394 B2 JP H0216394B2 JP 4534386 A JP4534386 A JP 4534386A JP 4534386 A JP4534386 A JP 4534386A JP H0216394 B2 JPH0216394 B2 JP H0216394B2
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- power supply
- electroplating
- pattern
- sliding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 27
- 238000009713 electroplating Methods 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 238000005096 rolling process Methods 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000003491 array Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910020810 Sn-Co Inorganic materials 0.000 description 1
- 229910020938 Sn-Ni Inorganic materials 0.000 description 1
- 229910018757 Sn—Co Inorganic materials 0.000 description 1
- 229910008937 Sn—Ni Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4534386A JPS62205298A (ja) | 1986-03-04 | 1986-03-04 | パタ−ン電気めつき法及びその装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4534386A JPS62205298A (ja) | 1986-03-04 | 1986-03-04 | パタ−ン電気めつき法及びその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62205298A JPS62205298A (ja) | 1987-09-09 |
| JPH0216394B2 true JPH0216394B2 (cs) | 1990-04-17 |
Family
ID=12716640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4534386A Granted JPS62205298A (ja) | 1986-03-04 | 1986-03-04 | パタ−ン電気めつき法及びその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62205298A (cs) |
-
1986
- 1986-03-04 JP JP4534386A patent/JPS62205298A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62205298A (ja) | 1987-09-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0258452B1 (en) | Process for producing copper-clad laminate | |
| CA1190888A (en) | Electroplating apparatus with driven contact wheels providing electrodes | |
| EP0258451B1 (en) | Method of producing conductor circuit boards | |
| EP2133448B1 (en) | Production method and device for surface roughening of a copper plate | |
| US6309517B1 (en) | Apparatus for inline plating | |
| US6071400A (en) | Method and device for the electrochemical treatment with treatment liquid of an item to be treated | |
| EP0252139A1 (en) | A process and apparatus for electroplating copper foil. | |
| KR840005498A (ko) | 비금속면 전기 도금 방법 | |
| US6939455B1 (en) | Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method | |
| WO1995020064A1 (en) | Uniform electroplating of printed circuit boards | |
| US4770754A (en) | Method and apparatus for electroplating a metallic deposit on interconnected metallic components and/or metallized products | |
| US6972082B2 (en) | Method for the selectively electroplating a strip-shaped, metal support material | |
| JPH0216394B2 (cs) | ||
| JPH0328389A (ja) | 銅張積層板用銅箔層、その製造方法およびそれに用いるめっき浴 | |
| EP0181430A1 (en) | Systems for producing electroplated and/or treated metal foil | |
| US4548685A (en) | Process for electrolytically removing metal deposit from a non-plated surface of a single surface-plated metal strip | |
| JP2611431B2 (ja) | 均一部分電気メッキ法 | |
| KR200358909Y1 (ko) | 양면 균일 도금층을 갖게 하는 전기도금장치 | |
| JPH1060684A (ja) | 吹着け電気メッキ法 | |
| JP3355813B2 (ja) | 鉄合金製リードフレームの電解研磨方法 | |
| JPH0635665B2 (ja) | 無電解銅被覆の間に形成される銅粒子の溶解方法 | |
| KR19980014624A (ko) | 분사 전기도금 방법 | |
| JPS6277494A (ja) | プリント基板のメツキ装置 | |
| KR200358908Y1 (ko) | 굴곡 입체형상 모재의 일측면 균일 도금장치 | |
| KR0152976B1 (ko) | 알루미늄 판재의 전기화학적 간접에칭방법과 그 장치 |