JPH021605U - - Google Patents
Info
- Publication number
- JPH021605U JPH021605U JP7892688U JP7892688U JPH021605U JP H021605 U JPH021605 U JP H021605U JP 7892688 U JP7892688 U JP 7892688U JP 7892688 U JP7892688 U JP 7892688U JP H021605 U JPH021605 U JP H021605U
- Authority
- JP
- Japan
- Prior art keywords
- head
- type electronic
- tape
- thermal bonding
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Packages (AREA)
Description
第１図は、本考案の実施例である３ライン型熱
接着ヘツドの斜視図、第２図はそれを用いてチツ
プ型電子部品にテーピングを施す状態を示す斜視
図、第３図は従来の２ライン型熱接着ヘツドを用
いてチツプ型電子部品にテーピングを施した結果
を示す一部切欠斜視図、第４図はその場合に生ず
る欠陥を示す状態図である。第１図乃至第４図中
の各符号は、それぞれ下記のものを示す。
１：熱接着ヘツド、２〜３：ヘツドライン、４
：キヤリアテープ、５：キヤリアテープ上の凹部
、６：チツプ型電子部品、７：カバーテープ、８
〜９：熱接着ライン。
Fig. 1 is a perspective view of a 3-line thermal bonding head which is an embodiment of the present invention, Fig. 2 is a perspective view showing how it is used to tape a chip-type electronic component, and Fig. 3 is a perspective view of a conventional three-line thermal bonding head. FIG. 4 is a partially cutaway perspective view showing the result of taping a chip-type electronic component using a two-line thermal bonding head, and FIG. 4 is a state diagram showing defects that occur in that case. Each symbol in FIGS. 1 to 4 indicates the following. 1: Heat adhesive head, 2-3: Head line, 4
: carrier tape, 5: recess on carrier tape, 6: chip type electronic component, 7: cover tape, 8
~9: Heat bonding line.
Claims (1)
施す際にキヤリアテープとカバーテープとを熱接
着することに用いる、ヘツドラインを３ライン以
上備えることを特徴とする熱接着ヘツド。 A thermal bonding head characterized by having three or more head lines and used for thermally bonding a carrier tape and a cover tape when taping chip-type electronic components for line transportation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7892688U JPH021605U (en) | 1988-06-16 | 1988-06-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7892688U JPH021605U (en) | 1988-06-16 | 1988-06-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH021605U true JPH021605U (en) | 1990-01-08 |
Family
ID=31303815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7892688U Pending JPH021605U (en) | 1988-06-16 | 1988-06-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH021605U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005138868A (en) * | 2003-11-06 | 2005-06-02 | Murata Mfg Co Ltd | Electronic component string manufacturing method, and crimp tool |
-
1988
- 1988-06-16 JP JP7892688U patent/JPH021605U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005138868A (en) * | 2003-11-06 | 2005-06-02 | Murata Mfg Co Ltd | Electronic component string manufacturing method, and crimp tool |
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