JPH02158682A - Abrasive composition - Google Patents
Abrasive compositionInfo
- Publication number
- JPH02158682A JPH02158682A JP63311664A JP31166488A JPH02158682A JP H02158682 A JPH02158682 A JP H02158682A JP 63311664 A JP63311664 A JP 63311664A JP 31166488 A JP31166488 A JP 31166488A JP H02158682 A JPH02158682 A JP H02158682A
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- polishing
- water
- nitrite
- abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 28
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 17
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 claims abstract description 13
- 238000005498 polishing Methods 0.000 abstract description 45
- 239000002245 particle Substances 0.000 abstract description 26
- 230000007547 defect Effects 0.000 abstract description 6
- 239000000843 powder Substances 0.000 abstract description 5
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 abstract description 4
- AZFNGPAYDKGCRB-XCPIVNJJSA-M [(1s,2s)-2-amino-1,2-diphenylethyl]-(4-methylphenyl)sulfonylazanide;chlororuthenium(1+);1-methyl-4-propan-2-ylbenzene Chemical compound [Ru+]Cl.CC(C)C1=CC=C(C)C=C1.C1=CC(C)=CC=C1S(=O)(=O)[N-][C@@H](C=1C=CC=CC=1)[C@@H](N)C1=CC=CC=C1 AZFNGPAYDKGCRB-XCPIVNJJSA-M 0.000 abstract description 2
- RAFRTSDUWORDLA-UHFFFAOYSA-N phenyl 3-chloropropanoate Chemical compound ClCCC(=O)OC1=CC=CC=C1 RAFRTSDUWORDLA-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004304 potassium nitrite Substances 0.000 abstract description 2
- 235000010289 potassium nitrite Nutrition 0.000 abstract description 2
- 235000010288 sodium nitrite Nutrition 0.000 abstract description 2
- 230000002265 prevention Effects 0.000 abstract 1
- 229910001593 boehmite Inorganic materials 0.000 description 16
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 16
- 230000000694 effects Effects 0.000 description 10
- 239000006185 dispersion Substances 0.000 description 9
- 150000003839 salts Chemical class 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- 238000005054 agglomeration Methods 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229920002678 cellulose Polymers 0.000 description 3
- 235000010980 cellulose Nutrition 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- 241000640882 Condea Species 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- -1 bayeragelite Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 239000011362 coarse particle Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 150000002826 nitrites Chemical class 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- ZZBAGJPKGRJIJH-UHFFFAOYSA-N 7h-purine-2-carbaldehyde Chemical compound O=CC1=NC=C2NC=NC2=N1 ZZBAGJPKGRJIJH-UHFFFAOYSA-N 0.000 description 1
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 1
- 239000005695 Ammonium acetate Substances 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 description 1
- 101100130497 Drosophila melanogaster Mical gene Proteins 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 241000287828 Gallus gallus Species 0.000 description 1
- 101000666896 Homo sapiens V-type immunoglobulin domain-containing suppressor of T-cell activation Proteins 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 241000283986 Lepus Species 0.000 description 1
- 229920001732 Lignosulfonate Polymers 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 101100345589 Mus musculus Mical1 gene Proteins 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 102100038282 V-type immunoglobulin domain-containing suppressor of T-cell activation Human genes 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- OIDDSYQNEFMRQZ-UHFFFAOYSA-N [Na].[K].[K].[K].[K].[K] Chemical compound [Na].[K].[K].[K].[K].[K] OIDDSYQNEFMRQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 235000019257 ammonium acetate Nutrition 0.000 description 1
- 229940043376 ammonium acetate Drugs 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910001680 bayerite Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- IJJVMEJXYNJXOJ-UHFFFAOYSA-N fluquinconazole Chemical compound C=1C=C(Cl)C=C(Cl)C=1N1C(=O)C2=CC(F)=CC=C2N=C1N1C=NC=N1 IJJVMEJXYNJXOJ-UHFFFAOYSA-N 0.000 description 1
- 229910001679 gibbsite Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical class C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000002674 ointment Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 230000010415 tropism Effects 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 238000007779 wet slurry method Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は研磨剤組成物に関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to an abrasive composition.
詳しくは、研磨能率がよく、すぐれた研磨表面を形成す
ることができる研磨剤組成物に関するものである。Specifically, the present invention relates to an abrasive composition that has good polishing efficiency and can form an excellent polished surface.
従来、水とアルミナからなる研磨剤4組成物は知られて
いる(例えば、特開昭!4t−g9Jg9号参照)が、
研磨速度が十分でなく、研磨速度を上げる目的でアルミ
ナの粒径を大きくすると5イυF磨表面に荒れが生ずる
ようになり、研磨速度と表面状態の両方を満足するもの
とは言えなかつた。Hitherto, a polishing agent 4 composition consisting of water and alumina has been known (for example, see Japanese Patent Application Laid-Open No. Sho! 4t-g9Jg9).
The polishing rate was not sufficient, and when the alumina particle size was increased in order to increase the polishing rate, the 5iυF polished surface became rough, and it could not be said that both the polishing rate and the surface condition were satisfied.
過去IO年間に於いて、工業的規模の生産が飛躍的に増
加したシリコン及び化合物半導体基板、各棟の磁気メモ
リーノ・−ドディスク、レーザ一部品等の材料の精密研
磨加工においては、特に加工面の平滑度、無欠陥性(ス
クラッチ、オレンジビール、ビット、ノジュール、クラ
ンク等の欠陥がない事〕に対する要求水準が、過去の何
時加工技術水準に比して遥かに高度化すると共に、他方
、生産、検査設備等に多額の投0が必要な為、生産スピ
ードの向上、不良欠陥ロスの低減に依るコストカットも
重要な課題となっている。In the past IO years, industrial-scale production has increased dramatically, especially in precision polishing of materials such as silicon and compound semiconductor substrates, magnetic memory node disks in each building, and laser parts. Requirements for surface smoothness and defect-free properties (no defects such as scratches, bits, nodules, cranks, etc.) have become much more sophisticated than in the past, and on the other hand, Since a large amount of investment is required for production, inspection equipment, etc., cost cutting by improving production speed and reducing losses due to defects is also an important issue.
従って、これらの分野で開用される研磨剤に就いても加
工精度と共に研磨速度の向上に対する要望が極めて強い
ものとなっている。Therefore, there is an extremely strong demand for improvements in processing accuracy and polishing speed for abrasives used in these fields.
本発明者らは、かかる要望を満足するよりすぐれた研磨
剤組成物をイ4Iるべく、鋭意研究を重ねた結東、水と
α−アルミナからなる研磨剤組放物に金属の亜硝酸塩を
存在させるときは、加工物加工面の平滑度5或は表面欠
陥(スクラッチ、オレンジピール等)発生防止等の研磨
仕上がり効果を低下させることなく、しかも研磨速度を
大幅に向上させることが出来ることを知得して本発明を
完成した。The inventors of the present invention have conducted extensive research in order to create a better abrasive composition that satisfies such demands, and have added a metal nitrite to an abrasive composition consisting of water and α-alumina. When present, it is possible to significantly improve the polishing speed without reducing the smoothness of the processed surface of the workpiece or the polishing effect such as preventing surface defects (scratch, orange peel, etc.) from occurring. After learning this, the present invention was completed.
本発明の要旨は、水、α−アルミナ及び金属の亜硝酸塩
を含有してなる研磨剤組成物に存する。The gist of the invention resides in an abrasive composition comprising water, alpha-alumina and a metal nitrite.
以丁、本発明を更に詳細に説明する。The present invention will now be described in more detail.
本発明で使用するα−アルミナとしては、特に限定され
ないがバイヤライト、ジブサイト、バイトラージライト
、ベーマイト、r−アルミナ、θ−アルミナのよりなα
−アルミナ以外のアルミナを、常法に従い/ 100℃
以上の温度で焼成して得たアルミナが挙げられる。此の
焼成温度は高い程研磨速度が大きくなる傾向があるので
/200oc以上、/200〜/r000Cで焼成して
得られたα−アルミナが好ましい。The α-alumina used in the present invention is not particularly limited, but examples include bayerite, gibbsite, bayeragelite, boehmite, r-alumina, and α-alumina.
- Alumina other than alumina according to the usual method / 100℃
Examples include alumina obtained by firing at a temperature above. Since the polishing rate tends to increase as the firing temperature increases, α-alumina obtained by firing at /200oc or higher and /200 to /r000C is preferred.
加工精度及び研磨速度を考慮すると本発明で使用される
α−アルミナは平均粒径で0. /〜10μ、好ましく
は0./〜3μであシ、又最大粒径で30μ以下、好ま
しくは20μ以下の微粉体である。従って、焼成して得
られたα−アルミナは通常の微粉砕装置即ち湿式スラリ
方式ではボールミル、振動ミル等で粉砕し粗大粒子は重
力沈降、遠心沈降等の装置で分級するか、或は乾式方式
即ちジェット気流に依る粉砕分級処理により所望の粒度
に整粒する。Considering processing accuracy and polishing speed, the α-alumina used in the present invention has an average grain size of 0. /~10μ, preferably 0. It is a fine powder with a maximum particle size of 30 μm or less, preferably 20 μm or less. Therefore, the α-alumina obtained by sintering is pulverized using a normal pulverizing device, such as a ball mill or a vibration mill in a wet slurry method, and coarse particles are classified using a device such as gravity sedimentation or centrifugal sedimentation, or a dry method is used to classify the coarse particles. That is, the particles are sized to a desired particle size by pulverization and classification using a jet stream.
α−アルミナの含有量は、組成物全量に対して7〜30
重量%、好ましくは2〜73重量%が困難となる。The content of α-alumina is 7 to 30% of the total amount of the composition.
% by weight, preferably from 2 to 73% by weight.
金属の亜硝酸塩としては、種々の金属の塩が挙げられる
が、周期律表第■〜IIJ族の金属の塩が好ましい。具
体的には、ナトリウム5カリウム、カルシウム、マグネ
シウム、バリウム、亜鉛、アルミニウムなどの亜硝酸塩
が挙げられる。Examples of the metal nitrite include salts of various metals, but salts of metals from Groups 1 to IIJ of the periodic table are preferred. Specific examples include nitrites such as sodium pentapotassium, calcium, magnesium, barium, zinc, and aluminum.
これらの中では、アルミナ−水スラリー系に対する分散
又は凝集作用が高い点で亜硝酸カルシウム、亜硝酸カリ
ウム、亜硝酸ナトリウムなどが好ましい。Among these, calcium nitrite, potassium nitrite, sodium nitrite, and the like are preferred because they have a high dispersion or coagulation effect on alumina-water slurry systems.
金属の亜硝酸塩の含有量は、組成物全量に対して0.1
〜20重量%、好ましくは0. / −/ 0重量%で
ある。この量があまりに少ないと本発明の効果が期待出
来なくなる。逆にあまりに多くても、添加効果が向上す
る事もなく、冬季低臨時に塩の結晶が析出するとか、排
水浄化処理の負担を増す等の不都合を生じるようになる
。The content of metal nitrite is 0.1 based on the total amount of the composition.
~20% by weight, preferably 0. /-/0% by weight. If this amount is too small, the effects of the present invention cannot be expected. On the other hand, if the amount is too large, the effect of addition will not be improved and problems will occur, such as occasional precipitation of salt crystals during winter and an increase in the burden of wastewater purification treatment.
本発明の研磨剤組成物が優れた研磨効果を有することの
詳細は不明であるが、金属の亜硝酸塩の存在が研磨剤組
成物中のα−アルミナの分散状態に何等からの影響を及
ぼし、かかる分散状態がIf暦加工に有利に作用すると
思われる。The details of why the abrasive composition of the present invention has an excellent polishing effect are unknown, but the presence of metal nitrite has some influence on the dispersion state of α-alumina in the abrasive composition. It is thought that such a dispersed state works advantageously for If calendar processing.
また5本発明の研磨剤組成物にベーマイトを存在させる
と、更にすぐれた効果を得ることができる。Further, when boehmite is present in the abrasive composition of the present invention, even better effects can be obtained.
ベーマイトは、アルミナ水和物の一種であり、ジブサイ
ト等を25O℃程度で加圧水熱処理するか、或はチーグ
ラー法で合成されるアルミニウム有機化合物[Al (
OR,)3 ) (但し、f(はアルキル基である)
の加水分解に依って製造する方法で一般的に生産されて
おり、アルミナゾル、セラミックバインダー、繊維製品
カーベントの帯電防止処理、水の浄化処理、化粧品、軟
こうの増粘剤、アルミナ系触媒又は触媒担体等の原料と
して広く利用されている工業材料である。Boehmite is a type of alumina hydrate, and is an aluminum organic compound [Al (
OR,)3) (However, f(is an alkyl group)
It is generally produced by the hydrolysis method of alumina sol, ceramic binder, antistatic treatment of textile carpet, water purification treatment, cosmetics, ointment thickener, alumina catalyst or catalyst carrier. It is an industrial material that is widely used as a raw material.
ベーマイトは、A100■を又はA 12C)s−82
0の化学式で表示される物質で、粉体製品としては、例
えば、KAISER(米国) 、 VISTA Che
mical(米国) 、 Condea Chemie
(ドイツ9等から市販されている。例えば−00μ以
下95%、りSμ以下30%の粒子からなる粉体を水中
又は酸性の水中で攪拌、分散させると、一部繊維状、大
部分は粒状で、且つそのサイズが0.0 /μ以下の超
微細粒子の形で分散し、コロイド状のゾルを形成する性
質を有する。ベーマイトのゾルは等電点?、りであり、
粒子自身が陽性に帯電している事が電気泳動法により観
測される。Boehmite is A100■ or A12C) s-82
It is a substance expressed by the chemical formula 0, and examples of powder products include KAISER (USA) and VISTA Che.
mical (USA), Condea Chemie
(Commercially available from Germany 9, etc.) For example, when a powder consisting of particles of 95% below -00μ and 30% below Sμ is stirred and dispersed in water or acidic water, some of the particles become fibrous and most of the particles become granular. It has the property of dispersing in the form of ultrafine particles with a size of 0.0 μm or less and forming a colloidal sol.The sol of boehmite has an isoelectric point of
It is observed by electrophoresis that the particles themselves are positively charged.
本発明で水に分散されるベーマイトは粉体でもベーマイ
トゾルでも使用可能であるが、いずれの場合も、水に分
散させた場合の粒子径がo、oiμ以下のゾルを形成す
るものを使用する。The boehmite to be dispersed in water in the present invention can be used as a powder or as a boehmite sol, but in either case, one that forms a sol with a particle size of o, oiμ or less when dispersed in water is used. .
ベーマイトの含有量は組成物全量に対し0.1〜20重
量%、好ましくはo、5−io重重量である。ベーマイ
ト含有量が余りに少ないと研磨速度向上の効果が期待出
来ず、逆に余りに多いと見掛粘度、チキントロピー性が
増大し、α−アルミナの均一分散性を損なう事となると
同時に研磨剤組成物の容器からの取出しが困難となる等
ハンドリング上不適な物性となる。The content of boehmite is 0.1 to 20% by weight, preferably o,5-io, based on the total weight of the composition. If the boehmite content is too low, no effect of improving the polishing speed can be expected; on the other hand, if the boehmite content is too high, the apparent viscosity and chicken tropism will increase, impairing the uniform dispersion of α-alumina, and at the same time reducing the polishing composition. It has physical properties that are unsuitable for handling, such as difficulty in removing it from the container.
水、α−アルミナ及び金属の亜硝酸塩を含有してなる本
発明研磨剤組成物に更にベーマイトをま有することによ
る作用の詳細は不明であるが、以下の如く推定される。Although the details of the effect of adding boehmite to the abrasive composition of the present invention, which contains water, α-alumina, and metal nitrite, are unknown, it is presumed as follows.
即ち、前述のα−アルミナ粒子は、これ全水中又は酸性
の水中で攪拌し分散させると、個々の粒子は陽性の電荷
を保有し、水又は電解質の陰イオンを吸着し電気的二重
層を形成する。かかる微粒子の分散系にあってはファン
デルワールス引力に依る凝集と電気的斥力に依る反発作
用力とで成る種の平衡状態を形成するのであるが、こ\
にベーマイトを共存させると、ベーマイトは該水中で陽
性に帯電するため、全体の分散系としては電気的斥力に
依る粒子相互間の分散効果が強まる事となる。That is, when the α-alumina particles mentioned above are stirred and dispersed in whole water or acidic water, each particle has a positive charge and adsorbs anions of water or electrolyte to form an electrical double layer. do. In such a dispersion system of fine particles, a kind of equilibrium state is formed between agglomeration due to van der Waals attraction and repulsive force due to electrical repulsion.
When boehmite coexists with the water, the boehmite becomes positively charged in the water, so that the dispersion effect between particles due to electrical repulsion becomes stronger in the entire dispersion system.
かかるスラリー状研磨剤による精密研磨加工に於ては遊
離砥粒であるα−アルミナ粒子が単分散又は凝集状態で
研磨バンドに保持され、成る加工圧で被加工物表面を摺
動するにつれて、砥粒(α−アルミナ粒子)がころがり
つ\或は滑りつ\研削作用を及はしている事になシ、砥
粒が被加工物表面を研削する作用点の数が多く且つ各作
用点での研削作用力が均一である程、加工時の単位摺動
量、単位時間当りの研磨量が大きく且つ加工表面精度が
高くなる筈である。しかしながら、研磨パッドと被加工
物表面の接触前では砥粒(α−アルミナ〕と被加工物が
研削されて発生した微細粒子(削如かすンが水に懸濁し
たスラリ状態声存在するため、個々の粒子の分散又は凝
集状態が研磨量、研磨仕上多件に強く影響を及ぼすであ
ろう事が推定されるが、本発明の如く水、α−アルミナ
及び金属の亜硝酸塩、場合によっては更にベーマイトを
含有してなる研磨剤に於ては金属の亜硝酸塩及びベーマ
イトが各粒子の分散又は凝集状態に影響し、研磨性能の
向上をもたらすと思われる。In precision polishing using such a slurry abrasive, α-alumina particles, which are free abrasive particles, are held in a polishing band in a monodispersed or aggregated state, and as they slide on the surface of the workpiece under the processing pressure, the abrasive The fact that the particles (α-alumina particles) are rolling or sliding is exerting a grinding action is because there are many points of action where the abrasive grains grind the surface of the workpiece, and at each point of action, the abrasive grains grind the surface of the workpiece. The more uniform the grinding force is, the greater the amount of sliding per unit of processing and the amount of polishing per unit time, and the higher the precision of the processed surface. However, before the polishing pad comes into contact with the surface of the workpiece, there is a slurry state in which abrasive grains (α-alumina) and fine particles (abrasive particles) generated by grinding the workpiece are suspended in water. It is presumed that the dispersion or agglomeration state of individual particles will have a strong influence on the polishing amount and polishing finish, but as in the present invention, water, α-alumina, metal nitrite, and in some cases, In a polishing agent containing boehmite, metal nitrite and boehmite are thought to affect the dispersion or agglomeration state of each particle, resulting in improvement in polishing performance.
本発明の研磨剤組成物の調製は、前記各成分を混合攪拌
すればよく、混合順序等も特に制限されるものではない
。The abrasive composition of the present invention can be prepared by mixing and stirring the above-mentioned components, and the order of mixing is not particularly limited.
又、この研磨剤組成物の調製に際しては、被加工物の種
類、加工条件等の何時加工上の必要条件に応じて、下記
の如き各種の公知の添加剤を加えてもよい・
添加剤としては、例えば5エタノール、グロバノール、
エチレングリコールの様な水溶性アルコール類、アルキ
ルベンゼンスルホン酸ソーダ、ナフタリンスルホン酸の
ホルマリン縮合物の様な界面活性剤、硫酸、塩酸、硝酸
、酢酸の様な酸類、リグニンスルホン酸塩、カルボキシ
メチルセルロース塩、ポリアクリル酸塩の様な有機ポリ
アニオン系物質、セルロース、カルホキジメチルセルロ
ース、ヒドロキシエチルセルロースの様なセルロース類
、硫酸アンモニウム、塩化アンモニウム、酢酸アンモニ
ウムの様な無機塩類等があげられる。In addition, when preparing this abrasive composition, depending on the processing requirements such as the type of workpiece and processing conditions, various known additives such as those listed below may be added. For example, 5 ethanol, globanol,
Water-soluble alcohols such as ethylene glycol, sodium alkylbenzenesulfonates, surfactants such as formalin condensates of naphthalenesulfonic acids, acids such as sulfuric acid, hydrochloric acid, nitric acid, and acetic acid, lignin sulfonates, carboxymethylcellulose salts, Examples include organic polyanionic substances such as polyacrylates, celluloses such as cellulose, carboxydimethyl cellulose, and hydroxyethyl cellulose, and inorganic salts such as ammonium sulfate, ammonium chloride, and ammonium acetate.
尚、本発明の研磨剤組成物のp)(とじては、3〜g、
好ましくはダ〜7である。pHは、塩の種類、添加量等
に依って変動するものであるが、一般に、水−アルミナ
系研磨剤でpi−1’iアルカリサイドに偏倚させると
、高粘度となり、多孔質網状組織からなる研磨パッドの
目詰まり劣化、被加工物表面へのスクラッチ発生トラブ
ル等を起こし易くなるので、研磨剤組成物のpHを酸性
サイドに調整するのが通例であって、かかる目的で酸類
を少量添加する場合がある。In addition, p) of the abrasive composition of the present invention (in total, 3 to g,
Preferably it is 7 to 7. The pH varies depending on the type of salt, the amount added, etc., but in general, when a water-alumina abrasive is applied to the pi-1'i alkali side, the viscosity becomes high and the porous network structure is This tends to cause problems such as clogging of the polishing pad, deterioration, and scratches on the surface of the workpiece, so it is customary to adjust the pH of the polishing composition to the acidic side, and for this purpose, small amounts of acids are added. There are cases where
本発明の研磨剤組成物は、金属、ガラス、プラスチック
等のイσf磨に使用されるが、欠陥のないイσ4M表面
が得られることから、メモリーハ−ドディスク等の研磨
に特に好適である。The abrasive composition of the present invention is used for σf polishing of metals, glass, plastics, etc., and is particularly suitable for polishing memory hard disks, etc., since it provides a defect-free σ4M surface. .
以下、実施例によって本発明を具体的に説明するが2本
発明はその要旨を超えない限9以下の実施例に限定され
るものではない。Hereinafter, the present invention will be specifically explained with reference to Examples, but the present invention is not limited to the following Examples as long as the gist of the present invention is not exceeded.
実施例7〜g、及び比較例/
〔研磨剤組成物の調整〕
水酸化アルミニウムを1300℃、S時間の条件で焼成
し、乾式方法で粉砕整粒したα−アルミナ(平均粒子径
0.57μ、最大粒子径gμ)を、高速ミキサーを用い
て水に分散させてα−アルミナ濃度g重量係のスラリー
を調製した。Examples 7 to g and Comparative Examples/ [Preparation of abrasive composition] α-alumina (average particle size 0.57μ , maximum particle diameter gμ) in water using a high-speed mixer to prepare a slurry having an α-alumina concentration in g weight.
これに金属の亜硝酸塩を第1表に記載の割合で添加分散
させて研磨剤、組成物を調製した。A metal nitrite was added and dispersed in the proportions shown in Table 1 to prepare a polishing agent and a composition.
波加工物としてアルミニウム基板にニッケルリンの無電
解メツキにノケル90〜9λ係、リン/ 0−1%の合
金メツキ層)を施した3、Sインチメモリハードディス
ク(外径約95へ)の基板を便用した。As a corrugated product, an aluminum substrate was electrolessly plated with nickel phosphorus and Nokel 90-9λ, phosphorus/0-1% alloy plating layer). I used it as a toilet.
此のディスクと両面研磨機に装填して研磨する。研磨機
の上下定盤に、夫々、スェードタイプのポリウレタン基
質研磨バッドが装着しである両面研磨機に該ディスクを
装填し、ディスクと歯研磨バンドを相対的に摺動させて
S分間研磨を行なった。Load this disc into a double-sided polisher and polish. The disc was loaded into a double-sided polishing machine with suede type polyurethane substrate polishing pads attached to the upper and lower surface plates of the polisher, and polishing was performed for S minutes by sliding the disc and tooth polishing band relative to each other. Ta.
研磨はディスクと両何時バッドの間に上記研磨剤試料を
毎分当す3θθ仏の割合で供給し、加工圧/ o o
y 7CIlで行なった。For polishing, the above abrasive sample was supplied between the disk and both pads at a rate of 3θθ per minute, and the processing pressure was
y 7CIl.
研磨の後、ディスクを両面研磨機より取出し、超音波洗
浄をくシ返し、ディスク加工面を清浄にして、目視検査
に依り、表面欠陥の有無程度を評価した。After polishing, the disk was taken out from the double-sided polisher, the ultrasonic cleaning was repeated several times to clean the processed surface of the disk, and the presence or absence of surface defects was evaluated by visual inspection.
次にディスクの厚さの計測を行ない厚さの減少量から毎
分当りの平均研磨速度を算出した。Next, the thickness of the disk was measured, and the average polishing rate per minute was calculated from the amount of decrease in thickness.
此の試験結果は第1表に示す通りである。The test results are shown in Table 1.
第 / 表
実施例9〜Jg、及び比較例コ
水酸化アルミニウム6i3oo℃、S時間の条件で焼成
し、乾式方法で粉砕整粒したα−アルミナ(平均粒子径
o、s yμ、最大粒子径gμ)を、高速ミキサーを用
いて水に分散させてα−アルミナ濃度6重量係のスラリ
ーを調製した。Table 1: Examples 9 to Jg and Comparative Examples Aluminum hydroxide α-alumina (average particle size o, syμ, maximum particle size gμ ) was dispersed in water using a high-speed mixer to prepare a slurry having an α-alumina concentration of 6 parts by weight.
これに第−表に示す金属の亜硝酸塩およびべ一マイif
添加分散させて研磨剤組成物を調製した。Add to this the metal nitrites and salts shown in Table 1.
A polishing agent composition was prepared by adding and dispersing the components.
なお、ベーマイトとしてはCondea Cherni
e社製Pural (商障名) s c r=” (
平均゛粒子径約20、u)を使用した。In addition, as boehmite, Condea Cherni
Pural made by e company (commercial name) sc r=” (
An average particle size of approximately 20 u) was used.
実施例/におけると同様にして研磨試験を行なった結果
は下記第2表に示す通りである。A polishing test was conducted in the same manner as in Example 1, and the results are shown in Table 2 below.
第
表
〔発明の効果〕
本発明に従いα−アルミナ−水分散系に金属の亜硝酸塩
を添加した研磨剤組成物は、研磨加工面に表面欠陥全発
生する事なく、より高い研磨速度を発現し、研磨加工能
率を高めることができる。しかも、本発明の研磨剤組成
物は研磨速度が高いため、研磨加工時間の短縮、研磨剤
消費量の低減、高価なる研磨パッドの損耗、劣化の減少
等による加工コストの低下をもたらし、極めて有用であ
る。Table [Effects of the Invention] The abrasive composition according to the present invention in which metal nitrite is added to the α-alumina-water dispersion system exhibits a higher polishing rate without generating any surface defects on the polished surface. , polishing efficiency can be increased. Moreover, since the polishing composition of the present invention has a high polishing speed, it shortens polishing time, reduces consumption of polishing agent, and reduces processing costs by reducing wear and deterioration of expensive polishing pads, making it extremely useful. It is.
出 願 人 三菱化成株式会社 代 理 人 弁理士 長谷用 −ほか/名Sender: Mitsubishi Kasei Corporation Representative Patent Attorney Hase - Others/Names
Claims (1)
なる研磨剤組成物。(1) An abrasive composition containing water, α-alumina, and a metal nitrite.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63311664A JP2725191B2 (en) | 1988-12-09 | 1988-12-09 | Abrasive composition |
MYPI89000734A MY104445A (en) | 1988-12-09 | 1989-05-30 | Polishing composition. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63311664A JP2725191B2 (en) | 1988-12-09 | 1988-12-09 | Abrasive composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02158682A true JPH02158682A (en) | 1990-06-19 |
JP2725191B2 JP2725191B2 (en) | 1998-03-09 |
Family
ID=18019999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63311664A Expired - Lifetime JP2725191B2 (en) | 1988-12-09 | 1988-12-09 | Abrasive composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2725191B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6007592A (en) * | 1996-11-14 | 1999-12-28 | Nissan Chemical Industries, Ltd. | Polishing composition for aluminum disk and polishing process therewith |
US6440187B1 (en) | 1998-01-08 | 2002-08-27 | Nissan Chemical Industries, Ltd. | Alumina powder, process for producing the same and polishing composition |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106283059A (en) * | 2016-08-10 | 2017-01-04 | 惠州市米特仑科技有限公司 | A kind of metal surface alumina polishing solution and preparation method thereof |
CN107717636A (en) * | 2017-09-12 | 2018-02-23 | 潘汉祥 | A kind of novel metal high speed polishing method |
-
1988
- 1988-12-09 JP JP63311664A patent/JP2725191B2/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6007592A (en) * | 1996-11-14 | 1999-12-28 | Nissan Chemical Industries, Ltd. | Polishing composition for aluminum disk and polishing process therewith |
US6440187B1 (en) | 1998-01-08 | 2002-08-27 | Nissan Chemical Industries, Ltd. | Alumina powder, process for producing the same and polishing composition |
Also Published As
Publication number | Publication date |
---|---|
JP2725191B2 (en) | 1998-03-09 |
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