JPH0215785U - - Google Patents
Info
- Publication number
- JPH0215785U JPH0215785U JP9326988U JP9326988U JPH0215785U JP H0215785 U JPH0215785 U JP H0215785U JP 9326988 U JP9326988 U JP 9326988U JP 9326988 U JP9326988 U JP 9326988U JP H0215785 U JPH0215785 U JP H0215785U
- Authority
- JP
- Japan
- Prior art keywords
- solenoid valve
- cold plate
- outlet
- inlet
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 5
- 239000003507 refrigerant Substances 0.000 claims description 3
- 239000002826 coolant Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Description
第１図はこの考案の一実施例を示す図、第２図
は従来例を示す図、第３図は電子機器用冷却装置
の作動状態を示す詳細図である。
図において１は平板状コールドプレート、２は
電磁弁、３はエレクトロニクスモジユール、４は
冷媒流路、５はポンプ、６はタンク、７は開放用
電磁弁、８はバイパス管路、９はバイパス管路用
電磁弁である。なお、各図中同一符号は同一、ま
たは相当部分を示す。
FIG. 1 is a diagram showing an embodiment of this invention, FIG. 2 is a diagram showing a conventional example, and FIG. 3 is a detailed diagram showing the operating state of the cooling device for electronic equipment. In the figure, 1 is a flat cold plate, 2 is a solenoid valve, 3 is an electronics module, 4 is a refrigerant flow path, 5 is a pump, 6 is a tank, 7 is a release solenoid valve, 8 is a bypass pipe, and 9 is a bypass This is a solenoid valve for pipelines. Note that the same reference numerals in each figure indicate the same or equivalent parts.
Claims (1)
ロニクスモジユールを複数個並べて冷却するため
、前記エレクトロニクスモジユール表面に平板面
が近接するように設置した、内部に冷媒流路を有
し、かつ前記平板面を冷媒流路の圧力上昇により
膨張可能な薄肉構造とした平板状コールドプレー
トと前記コールドプレートに水等の冷却媒体を強
制循環させるためのポンプおよび、リザーバタン
クよりなる電子機器用冷却装置において、平板状
コールドプレートの入口と出口をバイパスする管
路と前記管路を開閉する電磁弁、コールドプレー
ト入口と出口にも電磁弁を設け更に出口には開放
用の電磁弁を設け、冷却装置停止時には、まずバ
イパス管路の電磁弁を開とし、次に前記コールド
プレートの入口と出口の電磁弁を閉、および開放
用電磁弁を開とし、その後ポンプを停止するよう
にしたことを特徴とする電子機器用冷却装置。 In order to cool a plurality of electronic modules having built-in electronic components that require cooling, the flat plate is installed so that a flat plate surface is close to the surface of the electronics module, and has a refrigerant flow path inside. A cooling device for electronic equipment comprising a flat cold plate whose surface has a thin-walled structure that can be expanded by an increase in pressure in a refrigerant flow path, a pump for forcibly circulating a cooling medium such as water through the cold plate, and a reservoir tank, A conduit that bypasses the inlet and outlet of the flat cold plate, and a solenoid valve that opens and closes the said conduit, and a solenoid valve is also provided at the inlet and outlet of the cold plate, and a solenoid valve for opening is provided at the outlet, and when the cooling device is stopped, , first, the solenoid valve of the bypass pipe is opened, then the solenoid valves of the inlet and outlet of the cold plate are closed, the opening solenoid valve is opened, and then the pump is stopped. Cooling equipment for equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9326988U JPH0215785U (en) | 1988-07-14 | 1988-07-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9326988U JPH0215785U (en) | 1988-07-14 | 1988-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215785U true JPH0215785U (en) | 1990-01-31 |
Family
ID=31317716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9326988U Pending JPH0215785U (en) | 1988-07-14 | 1988-07-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215785U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009115361A (en) * | 2007-11-06 | 2009-05-28 | Tamagawa Seiki Co Ltd | Cooling device |
-
1988
- 1988-07-14 JP JP9326988U patent/JPH0215785U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009115361A (en) * | 2007-11-06 | 2009-05-28 | Tamagawa Seiki Co Ltd | Cooling device |
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