JPS5932870U - heat transfer device - Google Patents

heat transfer device

Info

Publication number
JPS5932870U
JPS5932870U JP12847482U JP12847482U JPS5932870U JP S5932870 U JPS5932870 U JP S5932870U JP 12847482 U JP12847482 U JP 12847482U JP 12847482 U JP12847482 U JP 12847482U JP S5932870 U JPS5932870 U JP S5932870U
Authority
JP
Japan
Prior art keywords
transfer device
heat
heat transfer
piping
accumulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12847482U
Other languages
Japanese (ja)
Other versions
JPS6143110Y2 (en
Inventor
哲朗 大串
政明 村上
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP12847482U priority Critical patent/JPS5932870U/en
Publication of JPS5932870U publication Critical patent/JPS5932870U/en
Application granted granted Critical
Publication of JPS6143110Y2 publication Critical patent/JPS6143110Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Pipeline Systems (AREA)
  • Central Heating Systems (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の熱伝達装置を示す概略図、第２図は本考
案の熱伝達装置の一実施例を示す概略図である。 １・・・受熱部、２・・・放熱部、３・・・逆止弁、４
・・・アキュムレータ、１０・・・連通管、１１・・・
開部弁。 第１図 第２図FIG. 1 is a schematic diagram showing a conventional heat transfer device, and FIG. 2 is a schematic diagram showing an embodiment of the heat transfer device of the present invention. 1... Heat receiving part, 2... Heat radiation part, 3... Check valve, 4
...Accumulator, 10...Communication pipe, 11...
Opening valve. Figure 1 Figure 2

Claims (5)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）上方に設置の受熱部と下方に設置の放熱部との間
をループ状に接続すると共に、内部に熱輸送媒体として
の凝縮性液体の作動体を封入した管路を有し、該管路中
に前記放熱部より受熱部に向かってのみ作動流体を流し
得るようにした第１及び第２逆止弁を介装させ、かつ両
逆止弁間にアキュムレータを配設した熱伝達装置におい
て、前記アキュムレータを受熱部よりも上方に位置させ
る一方、前記受熱部とアキュムレータ間に両者を連通さ
せて圧力を均圧させるための配管を設けると共に該配管
を開閉する開閉装置を設けたことを特徴とする熱伝達装
置。(1) The heat receiving section installed above and the heat dissipating section installed below are connected in a loop shape, and a conduit containing a working body of condensable liquid as a heat transport medium is provided inside. A heat transfer device in which first and second check valves are interposed in the conduit so that the working fluid can flow only from the heat radiating part toward the heat receiving part, and an accumulator is disposed between both the check valves. In the above, the accumulator is located above the heat receiving part, and a pipe is provided between the heat receiving part and the accumulator for communicating the pressure therebetween to equalize the pressure, and an opening/closing device is provided to open and close the pipe. Features heat transfer device. （２）開閉装置は、受熱部内の液がなくなると配管を開
き、該受熱部内に液が還流した場合に配管を閉にするよ
うに構成されてなる実用新案登録請求の範囲第１項記載
の熱伝達装置。(2) The opening/closing device is configured to open the piping when the liquid in the heat receiving part runs out, and close the piping when the liquid flows back into the heat receiving part. Heat transfer device. （３）開閉装置は、受熱部の温度が所定温度以上になる
と配管を開にするように構成されてなる実用新案登録請
求の範囲第１項記載の熱伝達装置。(3) The heat transfer device according to claim 1, wherein the opening/closing device is configured to open the piping when the temperature of the heat receiving portion exceeds a predetermined temperature. （４）開閉装置は、アキュムレータ内の液量が所定の量
よりも多（なった時に配管を開にし、前記所定の量より
も小さい別の所定の量よりも少なくとなった時に配管を
閉にするように構成されてなる実用新案登録請求の範囲
第１項記載の熱伝達装置。(4) The opening/closing device opens the piping when the amount of liquid in the accumulator exceeds a predetermined amount, and closes the piping when the amount of liquid in the accumulator becomes less than another predetermined amount that is smaller than the predetermined amount. A heat transfer device according to claim 1, wherein the heat transfer device is configured to: （５）開閉装置は、配管を所定の時間間隔で適宜開閉す
るように構成されてなる実用新案登録請求の範囲第１項
記載の熱伝達装置。(5) The heat transfer device according to claim 1, wherein the opening/closing device is configured to appropriately open and close the piping at predetermined time intervals.
JP12847482U 1982-08-25 1982-08-25 heat transfer device Granted JPS5932870U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12847482U JPS5932870U (en) 1982-08-25 1982-08-25 heat transfer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12847482U JPS5932870U (en) 1982-08-25 1982-08-25 heat transfer device

Publications (2)

Publication Number Publication Date
JPS5932870U true JPS5932870U (en) 1984-02-29
JPS6143110Y2 JPS6143110Y2 (en) 1986-12-05

Family

ID=30291439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12847482U Granted JPS5932870U (en) 1982-08-25 1982-08-25 heat transfer device

Country Status (1)

Country Link
JP (1) JPS5932870U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6166087A (en) * 1984-09-07 1986-04-04 Matsushita Electric Ind Co Ltd Heat transfer device
JPS62171761U (en) * 1986-03-10 1987-10-31
JPH02171508A (en) * 1988-12-23 1990-07-03 Matsushita Electric Ind Co Ltd Heat conveying device
JPWO2012144123A1 (en) * 2011-04-22 2014-07-28 パナソニック株式会社 Cooling device and electric vehicle equipped with the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5723795A (en) * 1980-04-18 1982-02-08 Berunaaru Jiyannpooru Method of and apparatus for circulating heat carrier fluid to closed circuit containing high temperature and low temperature sources

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5723795A (en) * 1980-04-18 1982-02-08 Berunaaru Jiyannpooru Method of and apparatus for circulating heat carrier fluid to closed circuit containing high temperature and low temperature sources

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6166087A (en) * 1984-09-07 1986-04-04 Matsushita Electric Ind Co Ltd Heat transfer device
JPS62171761U (en) * 1986-03-10 1987-10-31
JPH02171508A (en) * 1988-12-23 1990-07-03 Matsushita Electric Ind Co Ltd Heat conveying device
JPWO2012144123A1 (en) * 2011-04-22 2014-07-28 パナソニック株式会社 Cooling device and electric vehicle equipped with the same

Also Published As

Publication number Publication date
JPS6143110Y2 (en) 1986-12-05

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