JPH01154694U - - Google Patents
Info
- Publication number
- JPH01154694U JPH01154694U JP5059088U JP5059088U JPH01154694U JP H01154694 U JPH01154694 U JP H01154694U JP 5059088 U JP5059088 U JP 5059088U JP 5059088 U JP5059088 U JP 5059088U JP H01154694 U JPH01154694 U JP H01154694U
- Authority
- JP
- Japan
- Prior art keywords
- pump
- flow path
- refrigerant flow
- cold plate
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003507 refrigerant Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 4
- 239000002826 coolant Substances 0.000 claims 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第1図は、この考案の一実施例を示す図、第2
図は従来例を示す図、第3図は電子機器用冷却装
置の作動状態を示す詳細図である。
図において1は平板状コールドプレート、2は
電磁弁、3はエレクトロニクスモジユール、4は
冷媒流路、5はポンプ、6はタンク、7は開放用
電磁弁である。なお、各図中同一符号は同一、ま
たは相当部分を示す。
Figure 1 is a diagram showing one embodiment of this invention, Figure 2
The figure shows a conventional example, and FIG. 3 is a detailed view showing the operating state of the cooling device for electronic equipment. In the figure, 1 is a flat cold plate, 2 is a solenoid valve, 3 is an electronics module, 4 is a refrigerant flow path, 5 is a pump, 6 is a tank, and 7 is an opening solenoid valve. Note that the same reference numerals in each figure indicate the same or equivalent parts.
Claims (1)
ロニクスモジユールを複数個並べて冷却するため
前記エレクトロニクスモジユール表面に平板面が
近接するように設置し、かつ内部に冷媒流路を有
し、前記平板面を冷媒流路の圧力上昇により膨張
可能な薄肉構造とした平板状コールドプレートと
、前記コールドプレートに水等の冷却媒体を強制
循環させるためのポンプおよびリザーバタンクと
を備えた電子機器用冷却装置において、平板状コ
ールドプレートの冷却媒体を流す入口と出口の配
管に設けられ、上記ポンプ停止時には上記冷媒流
路を上記ポンプ、タンクと切離するために閉じる
電磁弁と、上記平板状コールドプレートの冷却媒
体を流す出口側に設けられ、上記ポンプ停止時に
は冷媒流路内圧力を雰囲気圧力と等しくなるよう
に開放する電磁弁とを設けたことを特徴とする電
子機器用冷却装置。 In order to cool a plurality of electronics modules containing electronic components that require cooling, the electronics module is installed so that a flat plate surface is close to the surface of the electronics module, and has a refrigerant flow path inside, and the flat plate surface is A cooling device for electronic equipment comprising a flat cold plate having a thin wall structure that can expand due to an increase in pressure in a refrigerant flow path, and a pump and a reservoir tank for forcibly circulating a cooling medium such as water through the cold plate, a solenoid valve that is provided on the inlet and outlet piping through which the cooling medium of the flat cold plate flows, and that closes to separate the refrigerant flow path from the pump and tank when the pump is stopped; and the cooling medium of the flat cold plate. 1. A cooling device for electronic equipment, characterized in that a solenoid valve is provided on an outlet side through which the refrigerant flows, and opens the internal pressure of the refrigerant flow path to be equal to the atmospheric pressure when the pump is stopped.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5059088U JPH01154694U (en) | 1988-04-15 | 1988-04-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5059088U JPH01154694U (en) | 1988-04-15 | 1988-04-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01154694U true JPH01154694U (en) | 1989-10-24 |
Family
ID=31276628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5059088U Pending JPH01154694U (en) | 1988-04-15 | 1988-04-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01154694U (en) |
-
1988
- 1988-04-15 JP JP5059088U patent/JPH01154694U/ja active Pending
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