JPH0215732U - - Google Patents
Info
- Publication number
- JPH0215732U JPH0215732U JP9397188U JP9397188U JPH0215732U JP H0215732 U JPH0215732 U JP H0215732U JP 9397188 U JP9397188 U JP 9397188U JP 9397188 U JP9397188 U JP 9397188U JP H0215732 U JPH0215732 U JP H0215732U
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- bonding tool
- model registration
- utility
- semiconductor devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9397188U JPH0521882Y2 (cs) | 1988-07-18 | 1988-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9397188U JPH0521882Y2 (cs) | 1988-07-18 | 1988-07-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0215732U true JPH0215732U (cs) | 1990-01-31 |
| JPH0521882Y2 JPH0521882Y2 (cs) | 1993-06-04 |
Family
ID=31318457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9397188U Expired - Lifetime JPH0521882Y2 (cs) | 1988-07-18 | 1988-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521882Y2 (cs) |
-
1988
- 1988-07-18 JP JP9397188U patent/JPH0521882Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0521882Y2 (cs) | 1993-06-04 |