JPH0215702U - - Google Patents
Info
- Publication number
- JPH0215702U JPH0215702U JP9416388U JP9416388U JPH0215702U JP H0215702 U JPH0215702 U JP H0215702U JP 9416388 U JP9416388 U JP 9416388U JP 9416388 U JP9416388 U JP 9416388U JP H0215702 U JPH0215702 U JP H0215702U
- Authority
- JP
- Japan
- Prior art keywords
- chip resistor
- electrode
- solder
- adhere
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9416388U JPH0215702U (bs) | 1988-07-15 | 1988-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9416388U JPH0215702U (bs) | 1988-07-15 | 1988-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215702U true JPH0215702U (bs) | 1990-01-31 |
Family
ID=31318664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9416388U Pending JPH0215702U (bs) | 1988-07-15 | 1988-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215702U (bs) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005251904A (ja) * | 2004-03-03 | 2005-09-15 | Denso Corp | 基板表面実装部品、基板回路、基板、ハンダ接続方法、及び基板回路の製造方法 |
| WO2022190879A1 (ja) * | 2021-03-12 | 2022-09-15 | Koa株式会社 | チップ部品の実装構造 |
-
1988
- 1988-07-15 JP JP9416388U patent/JPH0215702U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005251904A (ja) * | 2004-03-03 | 2005-09-15 | Denso Corp | 基板表面実装部品、基板回路、基板、ハンダ接続方法、及び基板回路の製造方法 |
| WO2022190879A1 (ja) * | 2021-03-12 | 2022-09-15 | Koa株式会社 | チップ部品の実装構造 |