JPH02155587A - Side trimmer device - Google Patents
Side trimmer deviceInfo
- Publication number
- JPH02155587A JPH02155587A JP88308488A JP30848888A JPH02155587A JP H02155587 A JPH02155587 A JP H02155587A JP 88308488 A JP88308488 A JP 88308488A JP 30848888 A JP30848888 A JP 30848888A JP H02155587 A JPH02155587 A JP H02155587A
- Authority
- JP
- Japan
- Prior art keywords
- line
- trimming
- laser cutting
- cutting devices
- supporting body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009966 trimming Methods 0.000 abstract 5
- 238000003698 laser cutting Methods 0.000 abstract 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- 229910000831 Steel Inorganic materials 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000010959 steel Substances 0.000 abstract 1
Abstract
PURPOSE:To execute the side trimming with a high yield by providing a running device which runs in parallel to a line, and also, at the same speed on a supporting body, and providing a width direction moving device for adjusting the trimming width on right and left laser cutting devices. CONSTITUTION:A planer-type supporting body 22 is installed so as to cross an iron steel line 9. On the left and the right of this beam part 23, laser cutting devices 24, 25 are provided. By these laser cutting devices 24, 25, both sides of a plate material on the line 9 is brought to trimming. In this state, a line direction running device 27 which runs in parallel to the line and at the speed as the line speed is provided on the supporting body 22. Also, a width direction moving device 28 is provided and the laser cutting devices 24, 25 are moved in the width direction of the line 9, and the trimming width is adjusted. In such a way, the side trimming can be executed with high yield.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP88308488A JPH02155587A (en) | 1988-12-06 | 1988-12-06 | Side trimmer device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP88308488A JPH02155587A (en) | 1988-12-06 | 1988-12-06 | Side trimmer device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02155587A true JPH02155587A (en) | 1990-06-14 |
Family
ID=17981619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP88308488A Pending JPH02155587A (en) | 1988-12-06 | 1988-12-06 | Side trimmer device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02155587A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7026571B2 (en) * | 2002-12-31 | 2006-04-11 | Cardinal Ig Company | Glass masking method using lasers |
CN105945433A (en) * | 2016-07-08 | 2016-09-21 | 上海元阳金属制品有限公司 | Plate laser cutting equipment and method |
-
1988
- 1988-12-06 JP JP88308488A patent/JPH02155587A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7026571B2 (en) * | 2002-12-31 | 2006-04-11 | Cardinal Ig Company | Glass masking method using lasers |
CN105945433A (en) * | 2016-07-08 | 2016-09-21 | 上海元阳金属制品有限公司 | Plate laser cutting equipment and method |
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