JPH02155583A - Trimming device - Google Patents

Abstract

PURPOSE:To easily and surely execute necessary trimming working by operating successively a trimming speed at the next time point from a trimming state and a speed of an object to be worked which is brought to trimming working, and converting the trimming speed to a low speed. CONSTITUTION:A laser light generated by a laser generating device 1 is brought to light guiding by a laser light light-guiding path 3. By the laser light which is brought to light guiding, an object 2b to be worked is brought to trimming by using a trimming device body 2. From a trimming state of the work 2b to be worked which is brought to trimming by the trimming device body 2 and its trimming speed, a trimming speed at the next time point is operated successively by using a trimming control means 2e and the trimming speed is converted to a low speed. In such a way, necessary trimming working can be executed easily and surely.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a trimming device, and particularly to a trimming device that uses a laser beam for trimming.

(Prior Art) For example, in the manufacture of thick film circuit boards, trimming is often performed on printed resistors formed by a printing method. That is, it is well known that when commercializing or using the thick film circuit configured as described above, the printed resistor is cut as appropriate to change the resistance value and adjust the characteristics of the entire circuit.

By the way, as a device for trimming the above-mentioned printed resistor etc., for example, a laser trimming system or a laser trimming device as shown in FIG. 5 has been put into practical use.

FIG. 5 is a block diagram of the laser trimming device, which includes a laser beam generator] and a trimming device main body 2 as main components. That is, the oscillation power supply 1. A laser beam generated by a laser beam generating device 1 composed of a laser beam oscillator 1b and a laser beam oscillator 1b is guided to a trimming device main body 2. On the other hand, the trimming control means 2 controls the electronic component 2 to be trimmed.
a For example, X on which a thin film circuit having a thin film resistor 2b is placed
- A Y table 2c, a measuring device 2d for checking the characteristics of the thin film resistor 2b to be trimmed, and this a
A driver mechanism for the swinging mirror 3a that changes the angle, etc. of the laser beam irradiated onto the electronic component 2a, and the shutter unit that passes or blocks the laser beam guided from the laser generator 1 based on the measurement results by the laser beam generator 2d. 3
and a drive control means 2r for controlling the drive of each of the motors b. In the above trimming device, the electronic component 2a to be trimmed is moved in the X-Y direction, and the laser beam irradiation position (in the X-Y direction) by the swinging mirror 3a is moved relative to each other.

(Problems to be Solved by the Invention) As described above, conventional laser trimming systems and laser trimming devices pass the laser beam output from the laser oscillator 1b to an optical system using a laser reflecting mirror or a laser beam guide consisting of an optical fiber. The light is guided to the trimming device main body 2 via an optical path 3, and required trimming is performed.

By the way, although the trimming device main body 2 can arbitrarily set the trimming speed depending on the type of the trimming object (workpiece) 2b, trimming for a certain workpiece 2b is performed at a constant speed. In other words, the required trimming process is performed from start to finish at a preset trimming speed, and it is normal that the trimming speed cannot be changed during the process. For example, when trimming the thin film resistor 2b formed on the insulating substrate tM2a surface to adjust it to a desired resistance value, the thin film resistor 2b is trimmed in a predetermined area by laser light, as schematically shown in FIG. 2b' is sequentially cut into narrow widths at a constant speed. By the way, since the cutting at the constant speed is performed sequentially, the resistance change is gradual at the beginning of trimming, as shown in Figure 7, but as the trimming progresses and the remaining width decreases, the resistance changes rapidly. It often happens that the target value (desired set value) is exceeded. To avoid these problems, you have to set the trimming speed to a low speed and perform the trimming process slowly. However, setting the trimming speed to a low speed requires a relatively long time for the required trimming process, which is not suitable for mass production.

[Structure of the Invention] (Means for Solving the Problems) The present invention has been made in view of the above circumstances, and includes a laser generator, a laser light guide path for guiding laser light generated by the laser generator, and a laser light guide path for guiding laser light generated by the laser generator. , a trimming device body that trims the laser beam guided through the laser light guide path, and a trimming state and trimming speed of the workpiece to be trimmed by the trimming device body at the next point in time; This trimming device is characterized by comprising a trimming control means that sequentially calculates the trimming speed and reduces the trimming speed.

(Function) According to the trimming device of the present invention having the above-mentioned configuration or means, when the trimming device body performs the required trimming, for example, on a thick film circuit, the trimming process is performed at a relatively high speed at the beginning, and at the end point. Then, the trimming speed is switched to a relatively low speed.

In other words, a specially attached trimming control means measures, for example, the resistance value every unit time during the trimming process, calculates the difference from the target value, and calculates and sets a new trimming speed each time. Based on this, the trimming speed is adjusted and reduced by controlling the moving speed of the mirror, the irradiation laser, or the laser oscillation frequency.

In this way, the laser trimming process can be performed within the specified objective range (
easily and reliably achieved (without exceeding the target value). Moreover, since the trimming speed is sequentially switched from high speed to low speed, the required trimming process can be performed within a relatively short time.

(Example) The present invention will be described in detail below with reference to FIG. FIG. 1 is a block diagram showing an example of the configuration of a trimming device according to the present invention. Reference numeral 1 denotes a laser generator comprising an oscillation power source and a laser oscillator, such as a YAG laser oscillator.

Reference numeral 2 denotes the main body of the trimming device, on which a workpiece, for example, a thick film circuit having a model resistor 2b provided on the surface of the substrate 2a is mounted.
- The trimming state of the model resistor 2b provided in the Y table 2c and the pre-thickened film circuit 2a, for example, the measurement section 2d that detects a change in resistance value, and the measurement result of the measurement section 2d, q1 in the trimming process. Trimming control means 2 that measures, for example, the resistance value every time, calculates the difference from the target value, and calculates and sets a new trimming speed each time.
Based on the calculation setting of the trimming speed by the trimming control means 2e, the drive system 3b of the swinging mirror 3a to the irradiation mirror 3a or the laser oscillation frequency is controlled to change the trimming speed. In addition, in the figure, 2r is a drive control section that drives and controls the entire trimming device, such as the laser oscillation device 1, the measurement section 2d, the trimming control section 2e1, and the laser light guide path 3.

For example, a computer may be used for the trimming control means or arithmetic circuit 2e and the drive control section or drive control circuit 2f.

In the above embodiment (FIG. 1), a configuration was shown in which the trimming control means 2C is controlled by the drive control section 2r, but as shown in FIG. A configuration may be adopted in which the drive control section 2r is operated to drive and control the entire trimming device. Further, the light guide path 3 for the laser beam may be constructed from an optical fiber instead of using the mirror 3a etc. as in the above construction example. That is, as shown in FIG. 3, the laser beam emitted from the laser oscillation device 1 is made incident on the optical fiber 3 through a shutter lc that can be switched between blocking and passing.
The light may be irradiated from an emitter 3c disposed at the other end of the optical fiber 3 to perform necessary trimming. In this embodiment, the movement of the ejector 30 can be appropriately controlled by the drive control section 2f via the movement control section 4 based on the calculation setting of the trimming speed by the trimming control means 2e. In FIGS. 2 and 3, components (14) that are the same as those in the apparatus shown in FIG. 1 are given the same reference numerals as in FIG. 1.

Next, the function and operation of the trimming device having the above configuration will be explained. First, a required object to be processed, for example, a thin film resistor 2b.
The circuit board 2a having the following structure is placed and arranged on the X-Y table 2c. - The blade drive control unit 2r is driven to emit laser light from the laser oscillation device 1, and the laser light is transmitted to the thin film resistor 2b which is the workpiece through the laser light guide path 3.
The required trimming is performed by irradiating a predetermined area of the image. In this trimming process, in consideration of positional accuracy, as is generally done, the laser beam is applied from a position slightly away from the edge of the predetermined area of the thin film resistor 2b to be trimmed (after some wasted time). When the trimming process of the thin film resistor 2b is started, the thin film resistor 2 is irradiated with the thin film resistor 2b at regular intervals.
The resistance value of b is determined by A111 in the measuring section 2d. This 1l
The Ill constant value is converted into a voltage, current, frequency, or pulse width, and is sequentially calculated by the trimming control means 2o. The required trimming process proceeds as described above, but during this trimming process, the trimming control means 2e calculates the resistance value within a certain time from the previously determined resistance value Rn-1 and the resistance value Rn measured at the present time. The amount of change ΔRn-1 is calculated using the following formula.

△Rn-1= Rn-Rn-1 The number of resistance value measurements N until the required final target resistance value is reached with the current resistance value change amount △Rn-1 calculated in this way
is calculated using the following formula.

N-(final target resistance value-Rn)/ΔRn-1 The trimming speed is set, for example, by four calculations as follows, depending on the value of the number of times N of resistance value measurements calculated above.

If N<1, reduce the trimming speed to 30% or less.

If N, , = 2, reduce the trimming speed to 50%.

For N-4, lower the trimming speed to 75%.

For N-8, lower the trimming speed to 90%.

That is, the trimming control means 2c calculates and sets the trimming speed according to the progress state of trimming, and the drive control section 2r performs drive control based on this calculated setting value.
The trimming speed is sequentially reduced to perform the required trimming process.

Although the above example shows a case where the resistance value is measured at regular time intervals during the trimming process and the trimming speed is sequentially set and reduced, the following method may also be used. That is, before starting the trimming process, the resistance 1 (initial resistance value) Ro of the thin film resistor 21) which is the object to be processed is first measured. Next, in the same manner as above, the required trimming is started at a certain trimming speed So, and the resistance value (current value) is determined at each fixed time interval.
When Rn is measured sequentially and the final objective resistance value (target value) Rr is determined, the following formula is used: 5rrSo
) The current trimming speed Sn may be calculated and set, and the trimming speed may be sequentially reduced by drive control of the drive control unit 2r based on this calculated setting value to perform the required trimming process.

Figure 4 shows the resistance value of 1111 in the above trimming process.
The figure shows the trimming speed between the first fixed point and the six measurement points, and the state of change in the resistance value during the trimming process.

[Effects of the Invention] As described above, the trimming device according to the present invention is particularly equipped with a function that can sequentially reduce the required trimming speed in accordance with the progress of trimming.

In other words, in the process of trimming, the processing state or degree of the workpiece is grasped at regular intervals, the grasped processing state or degree is analyzed and calculated, and based on this result, the trimming speed is reduced and the required trimming processing is performed. It is configured so that it can be done. Therefore, for example, when trimming a thin film circuit, the trimming process is performed at a relatively high speed at the beginning, and the trimming speed is only slowed down at the end, so the required trimming process can be completed within a relatively short time. become. Moreover, in the above trimming process, the trimming speed is reduced at the end point and trimming is performed relatively slowly, so the possibility of exceeding the processing target value or degree is avoided, and the required trimming process can be easily and reliably performed. becomes.

[Brief explanation of the drawing]

1 to 3 are block diagrams showing various types of trimming devices according to the present invention (14 examples), FIG. 4 is an explanatory diagram for explaining usage examples of the trimming device according to the present invention, and FIG. 6 is a block diagram showing the configuration of a conventional trimming device, FIG. 6 is an explanatory diagram showing the trimming state of a thin film resistor, and FIG. 7 is a schematic diagram showing the relationship between the progress of trimming and the change in resistance value of a thin film resistor. 1... Laser generator la... Laser oscillation power supply Ib... Laser oscillator 1c... Shutter unit 2... Trimming device main body 2a... Electronic component 2b...・Workpiece 2C... ...Mirror 3b...Mirror driver mechanism 30...Light emitter Figure 2 Applicant: Toshiba Corporation

Claims (1)

[Claims] A laser generator, a laser beam guide path for guiding the laser beam generated by the laser generator, a trimming device main body for trimming each of the laser beam guide paths with the guided laser light, and the trimming device main body 1. A trimming device comprising: a trimming control means for sequentially calculating a trimming speed at the next point in time from the trimming state and trimming speed of a workpiece to be trimmed, and lowering the trimming speed.