JPH02155180A - 接続素子の組み立て方法および，リード構体 - Google Patents
接続素子の組み立て方法および，リード構体Info
- Publication number
- JPH02155180A JPH02155180A JP25400089A JP25400089A JPH02155180A JP H02155180 A JPH02155180 A JP H02155180A JP 25400089 A JP25400089 A JP 25400089A JP 25400089 A JP25400089 A JP 25400089A JP H02155180 A JPH02155180 A JP H02155180A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- circuit component
- component support
- connection element
- support according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011810 insulating material Substances 0.000 claims abstract description 18
- 239000012212 insulator Substances 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims 8
- 238000003780 insertion Methods 0.000 claims 8
- 239000002131 composite material Substances 0.000 claims 2
- 238000000465 moulding Methods 0.000 claims 1
- 238000004080 punching Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 235000014676 Phragmites communis Nutrition 0.000 abstract 9
- 238000010586 diagram Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25400089A JPH02155180A (ja) | 1989-09-29 | 1989-09-29 | 接続素子の組み立て方法および，リード構体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25400089A JPH02155180A (ja) | 1989-09-29 | 1989-09-29 | 接続素子の組み立て方法および，リード構体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02155180A true JPH02155180A (ja) | 1990-06-14 |
| JPH04358B2 JPH04358B2 (enrdf_load_stackoverflow) | 1992-01-07 |
Family
ID=17258872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25400089A Granted JPH02155180A (ja) | 1989-09-29 | 1989-09-29 | 接続素子の組み立て方法および，リード構体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02155180A (enrdf_load_stackoverflow) |
-
1989
- 1989-09-29 JP JP25400089A patent/JPH02155180A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04358B2 (enrdf_load_stackoverflow) | 1992-01-07 |
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