JPH02153995A - Silicone grease composition - Google Patents
Silicone grease compositionInfo
- Publication number
- JPH02153995A JPH02153995A JP30751388A JP30751388A JPH02153995A JP H02153995 A JPH02153995 A JP H02153995A JP 30751388 A JP30751388 A JP 30751388A JP 30751388 A JP30751388 A JP 30751388A JP H02153995 A JPH02153995 A JP H02153995A
- Authority
- JP
- Japan
- Prior art keywords
- aluminum nitride
- thermal conductivity
- silicone grease
- grease composition
- examples
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 24
- 239000000203 mixture Substances 0.000 title claims abstract description 15
- 239000004519 grease Substances 0.000 title claims description 26
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 18
- 239000002245 particle Substances 0.000 claims abstract description 7
- 239000000843 powder Substances 0.000 claims description 16
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 229920006395 saturated elastomer Polymers 0.000 claims description 2
- 238000002156 mixing Methods 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 239000004215 Carbon black (E152) Substances 0.000 abstract 1
- 229930195733 hydrocarbon Natural products 0.000 abstract 1
- 150000002430 hydrocarbons Chemical class 0.000 abstract 1
- 239000003921 oil Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 11
- 238000000926 separation method Methods 0.000 description 9
- 239000002199 base oil Substances 0.000 description 6
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 229920002545 silicone oil Polymers 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 239000002562 thickening agent Substances 0.000 description 3
- 235000014692 zinc oxide Nutrition 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- -1 polysiloxane Polymers 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Chemical group CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 125000000068 chlorophenyl group Chemical group 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はシリコーングリース組成物に関し、特に熱伝導
性に優れた放熱用シリコーングリース組成物に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a silicone grease composition, and particularly to a heat dissipating silicone grease composition with excellent thermal conductivity.
（従来の技術）
従来から、シリコーンオイルをベースとした放熱用グリ
ースとして亜鉛華やアルミナ粉末を増稠剤として使用し
たものが知られている（特公昭５２−３３２７２、特公
昭５９−５２１９５）、又、近年、更に熱伝導率の向上
を達成し得る増稠剤として窒化アルミニウムが開発され
ている（例えば特公昭６０−１４７９２及び特公昭５７
−３６３０２）。(Prior Art) Conventionally, silicone oil-based heat dissipation greases using zinc white or alumina powder as thickeners have been known (Japanese Patent Publications No. 52-33272, No. 59-52195). In addition, in recent years, aluminum nitride has been developed as a thickener that can further improve thermal conductivity (for example, Japanese Patent Publication No. 60-14792 and Japanese Patent Publication No. 14792).
-36302).
（発明が解決しようとする課題）
しかしながら、窒化アルミニウムのオイル保持力が十分
でないために、従来においてはシリコーンオイル中に含
有せしめることのできる窒化アルミニウムの量は極めて
限られており、従って、窒化アルミニウム自身の熱伝導
性は良いものの、シリコーングリース組成物としての熱
伝導性についてはあまり改善がなされていない。例えば
特公昭６０−１４７９２号公報に記載された発明におい
ては、シリコーンオイル１００重量部に対して、窒化ア
ルミニウム粉末を５０〜９５重量部添加するが、これで
は添加量が少な（十分な熱伝導率の向上を期待すること
ができない。(Problem to be Solved by the Invention) However, because the oil retention power of aluminum nitride is not sufficient, the amount of aluminum nitride that can be contained in silicone oil is extremely limited in the past. Although silicone grease itself has good thermal conductivity, little improvement has been made in the thermal conductivity of silicone grease compositions. For example, in the invention described in Japanese Patent Publication No. 60-14792, 50 to 95 parts by weight of aluminum nitride powder is added to 100 parts by weight of silicone oil, but this amount is too small (sufficient thermal conductivity cannot be expected to improve.
又、特公昭５７−３６３０２号公報に記載された発明に
おいては、薄片状窒化アルミニウム粉末が任意成分とな
っているが、オイル保持力を向上させる目的で球状シリ
カファイバーを必須成分としているために、窒化アルミ
ニウム粉末の含有量が低下せざるを得す、やはり十分な
熱伝導率の向上を期待することはできない。Furthermore, in the invention described in Japanese Patent Publication No. 57-36302, flaky aluminum nitride powder is an optional component, but spherical silica fiber is an essential component for the purpose of improving oil retention. The content of aluminum nitride powder has to be reduced, and a sufficient improvement in thermal conductivity cannot be expected.
本発明者等は、従来のかかる欠点を解決すべく鋭意研究
の結果、特定のオルガノポリシロキサンと一定粒径範囲
の球状六方晶系窒化アルミニウム粉末とを組み合わせる
ことにより、シリコーンオイル中に極めて多量の窒化ア
ルミニウムを含有せしめることができることを見い出し
本発明に到達した。As a result of intensive research to solve these conventional drawbacks, the present inventors have discovered that by combining a specific organopolysiloxane and spherical hexagonal aluminum nitride powder with a certain particle size range, an extremely large amount of silicone oil can be contained. The present invention was achieved by discovering that aluminum nitride can be contained.
従って本発明の目的は、離油度が小さく、熱伝導性の良
好なシリコーングリース組成物を提供することにある。Therefore, an object of the present invention is to provide a silicone grease composition that has a low degree of oil separation and good thermal conductivity.
（課題を解決するための手段）
本発明の上記の諸口的は一般式Ｒａ５ＩＯ，ｉ、−で表
されるオルガノポリシロキサン１００重量部と、平均粒
径が０．５〜５μｍであって球状六方晶系の窒化アルミ
ニウム粉末１００〜９００重量部とから成るシリコーン
グリース組成物によって達成された。(Means for Solving the Problems) The above aspects of the present invention include 100 parts by weight of an organopolysiloxane represented by the general formula Ra5IO,i, This was achieved with a silicone grease composition comprising 100 to 900 parts by weight of crystalline aluminum nitride powder.
本発明における第一成分としてのオルガノポリシロキサ
ンは、Ｒａ５ｉＯ５，において、Ｒは炭素数１〜１８よ
り成る、飽和又は不飽和の一価の炭化水素基の群から選
択される一種若しくは二種以上の基である。このような
基としては、例えばメチル基、エチル基、プロピル基、
ヘキシル基、オクチル基、デシル基、ドデシル基、テト
ラデシル基、ヘキサデシル基、オクタデシル基などの飽
和炭化水素＆ 、ビニール基、フェニル基、クロロフェ
ニル基などの不飽和炭化水素基等が挙げられるが、特に
メチル基、フェニル基及び炭素数６〜１４のアルキル基
等が好ましい。The organopolysiloxane as the first component in the present invention is Ra5iO5, where R is one or more selected from the group of saturated or unsaturated monovalent hydrocarbon groups having 1 to 18 carbon atoms. It is the basis. Examples of such groups include methyl, ethyl, propyl,
Examples include saturated hydrocarbon groups such as hexyl, octyl, decyl, dodecyl, tetradecyl, hexadecyl, and octadecyl groups, and unsaturated hydrocarbon groups such as vinyl, phenyl, and chlorophenyl groups, but especially methyl A phenyl group, an alkyl group having 6 to 14 carbon atoms, and the like are preferred.
又、ａは１．８〜２．３である。Further, a is 1.8 to 2.3.
本発明で使用するオルガノポリシロキサンの粘度は、゛
−シリコーングリース組成物として要求される稠度及び
熱伝導性の観点から２５°Ｃで、５０〜５００．０００
ｃｓであることが必要であり、特に１００〜１００．０
００ｃｓであることが好ましい。The viscosity of the organopolysiloxane used in the present invention is 50 to 500,000 at 25°C from the viewpoint of consistency and thermal conductivity required for a silicone grease composition.
cs, especially 100 to 100.0
It is preferable that it is 00cs.
本発明においては、シリコーングリース組成物に熱伝導
性を付与する窒化アルミニウム粉末として、特にオイル
保持力に優れた球状六方晶系窒化アルミニウム粉末を第
二成分として使用する。この場合上記窒化アルミニウム
粉末の平均粒径を０゜５μｍ以下とすると、増稠効果が
大きすぎて稠度の低い（硬い）グリースとなり、使用上
好ましいグリースが得られない、従って、平均粒径が０
゜５μｍ以下の球状六方晶系粉末を用いて使用上好まし
いグリースとするためには、窒化アルミニウム粉末の含
有量を少なくせねばならず、少なくすれば、当然のこと
ながら本来の目的である熱伝導性が乏しいものとなるの
で好ましくない。又、平均粒径が５μｍよりも大きい場
合には、でき上がったグリースの均一性が乏しく、グリ
ースとしての安定性が悪い上離油度が大きくベースオイ
ルの分離も激しいものとなるので好ましくない、従って
本発明においては、使用する球状六方晶系の平均粒径を
０．５〜５μｍとすることが必要である。In the present invention, as the aluminum nitride powder that imparts thermal conductivity to the silicone grease composition, a spherical hexagonal aluminum nitride powder particularly excellent in oil retention is used as the second component. In this case, if the average particle size of the aluminum nitride powder is 0.5 μm or less, the thickening effect will be too large and the consistency will be low (hard), making it difficult to obtain a grease that is suitable for use.
In order to make a grease that is suitable for use using spherical hexagonal powder with a diameter of 5 μm or less, the content of aluminum nitride powder must be reduced. This is not desirable because it results in poor quality. In addition, if the average particle size is larger than 5 μm, the finished grease will have poor uniformity and stability as a grease, and the degree of oil separation will be large and the separation of the base oil will be severe, which is undesirable. In the invention, it is necessary that the average particle diameter of the spherical hexagonal system used be 0.5 to 5 μm.
本発明のグリースを製造するには、前記第−成分及び第
二成分を計量し、プラネタリ−ミキサー等の混合機にて
混合する。又、必要に応じて酸化防止剤等の公知の第三
成分を添加しても良い。混合は、例えば加圧下又は減圧
下で加熱混合を行ったのち、三本ロールなどの混練り機
で十分に混練りすることによって行うことができる。To produce the grease of the present invention, the first component and second component are weighed and mixed using a mixer such as a planetary mixer. Further, a known third component such as an antioxidant may be added as necessary. Mixing can be carried out, for example, by heating and mixing under pressure or reduced pressure, and then sufficiently kneading with a kneader such as a three-roll kneader.
上記の如くして製造した本発明のグリースの離油度（Ｊ
Ｉ Ｓ−に−２２２０による）は、１２０’Ｃ／２４
時間の条件で０〜０．８％と非常に少く、また、真空理
工■製ＴＣＷ−１，０００型熱線法熱伝導率計によれば
、従来のグリースの熱伝導率が１．０〜２． ＯＸ １
０−”ｃ ａ ｌ／ｃｒｓ−ｓ ｅ ｃ″Ｃであるのに
対して、本発明のグリースの場合には２、 ５〜５．
５ Ｘ １０−’ｃ ａ １７ｃｍ−ｓ ｅ ｃ’ｃと
、大巾にその熱伝導性を改良することができる。Oil separation degree (J
IS-2220) is 120'C/24
According to the TCW-1,000 type hot wire method thermal conductivity meter manufactured by Shinku Riko ■, the thermal conductivity of conventional grease is 1.0 to 2. ．． OX1
0-"cal/crs-sec"C, whereas in the case of the grease of the present invention, it is 2.5-5.
5 x 10-'ca 17 cm-sec'c, the thermal conductivity can be greatly improved.
（発明の効果）
以上の如くして得られた本発明のシリコーングリース組
成物は、離油度が小さくオイル分Ｍｍが少ない上、熱伝
導性も良好であり、従来の熱伝導性グリースよりもはる
かに優れた性能を有する。(Effects of the Invention) The silicone grease composition of the present invention obtained as described above has a low oil separation degree and a low oil content Mm, and also has good thermal conductivity, which is better than conventional thermally conductive greases. Has much better performance.
（実施例）
以下、本発明を実施例によって更に詳述するが、本発明
はこれによって限定されるものではない。(Examples) Hereinafter, the present invention will be explained in more detail with reference to Examples, but the present invention is not limited thereto.
実施例１〜９゜
表１に示す粘度を有する、後記各種のオルガノポリシロ
キサン１００重量部をベースオイルとし、このベースオ
イルに、同表に示す平均粒径を有する球状六方晶系窒化
アルミニウム粉末を同表に示す量、計量して添加し、プ
ラネタリ−ミキサーで３０分間両者を十分に混合した後
、三本ロールによる混練りを３回実施して本発明のシリ
コーング表−１
尚、表１で使用したベースオイルは夫々下記のものであ
る。Examples 1 to 9 100 parts by weight of various organopolysiloxanes listed below having the viscosity shown in Table 1 were used as a base oil, and spherical hexagonal aluminum nitride powder having the average particle size shown in the same table was added to the base oil. The amount shown in Table 1 was measured and added, and the two were sufficiently mixed for 30 minutes using a planetary mixer, and then kneaded three times using three rolls to obtain the silicone compound of the present invention. The base oils used are as follows.
実施例１〜４：両末端トリメチルシリル基封鎖ジメチル
ポリシロキサン
実施例５〜７８両末端トリメチルシリル基封鎖ジメチル
デシルメチルポリシロキ
サン（デシル基２５モル％）
実施例８〜９：両末端トリメチルシリル基封鎖ジメチル
ジフェニルポリシロキ
サン（フェニル基２５モル％）
得られた何れの試料も、外観は淡灰色で滑らかな表面を
しており均一なグリース状であった。又、１２０℃、２
４時間後の離油度は低く、極めて良好であった。Examples 1 to 4: Dimethylpolysiloxane blocked with trimethylsilyl groups at both ends Examples 5 to 78 Dimethyldecylmethylpolysiloxane blocked with trimethylsilyl groups at both ends (25 mol % of decyl groups) Examples 8 to 9: Dimethyldiphenyl polysiloxane blocked at both ends with trimethylsilyl groups Siloxane (25 mol % of phenyl groups) All the samples obtained had a light gray appearance, a smooth surface, and a uniform grease-like appearance. Also, 120℃, 2
The degree of oil separation after 4 hours was low and extremely good.
各試料について真空理工■製ＴＣＷ−１，０００型熱伝
導率測定装Ｗ（熱線法）を用いて夫々の熱伝導率を測定
した結果は表−２に示した通りである。The thermal conductivity of each sample was measured using a TCW-1,000 model thermal conductivity measuring instrument W (hot wire method) manufactured by Shinku Riko ■, and the results are shown in Table 2.
表−２の結果は、本発明のシリコーングリース組成物の
熱伝導率が、後記比較例で代表される従来からのグリー
スに比べ、格段に優れていることを実証している。The results in Table 2 demonstrate that the thermal conductivity of the silicone grease composition of the present invention is significantly superior to that of conventional greases typified by Comparative Examples below.
表−２
尚、表中の稠度及び離油度の測定はＪＩＳ−に−２２２
０によって行った。Table 2 The consistency and oil separation in the table are measured according to JIS-222.
It was done by 0.
比較例１〜６゜
表−３に示す如く、ベースオイルと増稠剤を用いて実施
例の場合と同様にして試料を作製した。Comparative Examples 1 to 6 As shown in Table 3, samples were prepared in the same manner as in the examples using base oil and a thickener.
表−３
得られた各試料について夫々、稠度、離油度及び熱伝導
率を実施例の場合と同様に測定した。Table 3 For each sample obtained, the consistency, oil separation degree, and thermal conductivity were measured in the same manner as in Examples.
比較例ＮＯ，１のグリースは、滑らかさは良好であるが
、窒化アルミニウム粉末の添加量が少ないため十分な熱
伝導率が得られなかった。Although the grease of Comparative Example No. 1 had good smoothness, sufficient thermal conductivity could not be obtained because the amount of aluminum nitride powder added was small.
比較例Ｎｏ、２のグリースは硬くなりすぎ、伸展性に乏
しく使用に耐えられないものとなった。The greases of Comparative Examples No. 2 and 2 were too hard and had poor extensibility, making them unusable.
比較例Ｎ００３のグリースは、熱伝導率は良好な値を示
したがグリースとしての均一性に欠け、放置後のオイル
分離が激しいものとなった。The grease of Comparative Example No. 003 showed a good thermal conductivity value, but lacked uniformity as a grease, and oil separation after standing was severe.
比較例Ｎｏ、４及び５のグリースは従来からの亜鉛華粉
末を使用したものであるが、何れの場合も、グリースの
均一性は優れているものの熱伝導率は低いものであった
。The greases of Comparative Examples Nos. 4 and 5 used conventional zinc white powder, and in all cases, although the uniformity of the grease was excellent, the thermal conductivity was low.
比較例Ｎ００６のグリースは、アルミナ粉末を使用した
ものであるが、熱伝導率は亜鉛華の場合と同程度の低い
ものであり、比較的オイル分離量の多いものであった。Although the grease of Comparative Example No. 006 used alumina powder, its thermal conductivity was as low as that of zinc white, and the amount of oil separated was relatively large.
これらの結果をまとめると表−４に示す如くであり、何
れの試料の性能も実施例によって得られた本願発明のシ
リコーングリース組成物の性能より格段に劣ることが確
認された。These results are summarized as shown in Table 4, and it was confirmed that the performance of each sample was significantly inferior to the performance of the silicone grease composition of the present invention obtained in the Examples.
尚、使用したベースオイルは、比較例１及び２の場合に
は共に両末端トリメチルシリル基封鎖ジメチルポリシロ
キサン、比較例３及び４の場合には、両末端トリメチル
シリル基封饋ジメチルデシルメチルポリシロキサン（デ
シル基２５モル％）、比較例５及び６の場合には、両末
端トリメチルシリル基封鎖ジメチルジフェニルポリシロ
キサン（フェニル基２５モル％）である。The base oil used was dimethylpolysiloxane with trimethylsilyl groups capped at both ends in Comparative Examples 1 and 2, and dimethyldecylmethylpolysiloxane with trimethylsilyl groups capped at both ends in Comparative Examples 3 and 4. In the case of Comparative Examples 5 and 6, it was dimethyldiphenylpolysiloxane (25 mol% of phenyl groups) blocked at both ends with trimethylsilyl groups.
以上の実施例、比較例の結果は、本発明の熱放射用シリ
コーングリース組成物の性能が、従来品に比して格段に
優れていることを実証するものである。The results of the above Examples and Comparative Examples demonstrate that the performance of the heat radiation silicone grease composition of the present invention is significantly superior to conventional products.
特許出願人 信越化学工業株式会社 代 理 人Patent applicant: Shin-Etsu Chemical Co., Ltd. teenager Reason Man
Claims (1)
ガノポリシロキサン１００重量部と、平均粒径が０．５
〜５μｍであって球状六方晶系の窒化アルミニウム粉末
１００〜９００重量部とから成るシリコーングリース組
成物；一般式中、Ｒは炭素数１〜１８の飽和又は不飽和
の一価の炭化水素基の群から選択される一種若しくは二
種以上の基であり、ａは１．８〜２．３である。100 parts by weight of organopolysiloxane represented by the general formula RaSiO_4_-_a_/_2 and an average particle size of 0.5
A silicone grease composition comprising 100 to 900 parts by weight of spherical hexagonal aluminum nitride powder with a diameter of 5 μm; in the general formula, R represents a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms; is one or more groups selected from the group, and a is 1.8 to 2.3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63307513A JPH0639591B2 (en) | 1988-12-05 | 1988-12-05 | Silicone grease composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63307513A JPH0639591B2 (en) | 1988-12-05 | 1988-12-05 | Silicone grease composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02153995A true JPH02153995A (en) | 1990-06-13 |
| JPH0639591B2 JPH0639591B2 (en) | 1994-05-25 |
Family
ID=17969982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63307513A Expired - Fee Related JPH0639591B2 (en) | 1988-12-05 | 1988-12-05 | Silicone grease composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0639591B2 (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0896031A3 (en) * | 1997-08-06 | 2000-01-26 | Shin-Etsu Chemical Co., Ltd. | Thermally conductive silicone composition |
| JP2000169873A (en) * | 1998-12-02 | 2000-06-20 | Shin Etsu Chem Co Ltd | Silicone grease composition |
| US6136758A (en) * | 1998-08-17 | 2000-10-24 | Shin-Etsu Chemical Co., Ltd. | Aluminum nitride powder and thermally conductive grease composition using the same |
| US6632780B2 (en) | 2001-01-04 | 2003-10-14 | Hitachi, Ltd. | Highly thermal conductive grease composition and cooling device using the same |
| EP1378542A1 (en) * | 2001-03-09 | 2004-01-07 | Dow Corning Toray Silicone Co., Ltd. | Greasy silicone composition |
| US7510998B2 (en) | 2004-05-21 | 2009-03-31 | Shin-Etsu Chemical Co., Ltd. | Silicon grease compositions |
| US8017684B2 (en) | 2005-12-27 | 2011-09-13 | Shin-Etsu Chemical Co., Ltd. | Heat conductive silicone grease compositions |
| JP6068733B2 (en) * | 2014-08-26 | 2017-01-25 | バンドー化学株式会社 | Thermally conductive resin molded product |
| EP3150672A1 (en) | 2015-10-02 | 2017-04-05 | Shin-Etsu Chemical Co., Ltd. | Thermal conductive silicone composition and semiconductor device |
| WO2019093052A1 (en) | 2017-11-09 | 2019-05-16 | 信越化学工業株式会社 | Thermally conductive silicone grease composition |
| KR20190077345A (en) | 2016-10-31 | 2019-07-03 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Thermally conductive silicone composition, semiconductor device and method of manufacturing semiconductor device |
| EP3575363A1 (en) | 2018-05-31 | 2019-12-04 | Shin-Etsu Chemical Co., Ltd. | Low heat resistance silicone composition |
| WO2020129555A1 (en) | 2018-12-21 | 2020-06-25 | 信越化学工業株式会社 | Heat-conductive silicone composition and semiconductor device |
| WO2020241054A1 (en) | 2019-05-27 | 2020-12-03 | 信越化学工業株式会社 | Thermally-conductive silicone composition, semiconductor device, and production method therefor |
| WO2023276846A1 (en) | 2021-07-02 | 2023-01-05 | 信越化学工業株式会社 | Heat-conductive silicone composition, semiconductor device, and method for manufacturing same |
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| JPS5959737A (en) * | 1982-09-30 | 1984-04-05 | Nippon Steel Corp | Production of inorganic matter-filled resin composition |
| JPS6014792A (en) * | 1983-07-04 | 1985-01-25 | 松下電器産業株式会社 | Induction heating cooking device |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5736302A (en) * | 1980-08-14 | 1982-02-27 | Yokogawa Hokushin Electric Corp | Controller |
| JPS5959737A (en) * | 1982-09-30 | 1984-04-05 | Nippon Steel Corp | Production of inorganic matter-filled resin composition |
| JPS6014792A (en) * | 1983-07-04 | 1985-01-25 | 松下電器産業株式会社 | Induction heating cooking device |
Cited By (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0896031A3 (en) * | 1997-08-06 | 2000-01-26 | Shin-Etsu Chemical Co., Ltd. | Thermally conductive silicone composition |
| US6136758A (en) * | 1998-08-17 | 2000-10-24 | Shin-Etsu Chemical Co., Ltd. | Aluminum nitride powder and thermally conductive grease composition using the same |
| JP2000169873A (en) * | 1998-12-02 | 2000-06-20 | Shin Etsu Chem Co Ltd | Silicone grease composition |
| US6632780B2 (en) | 2001-01-04 | 2003-10-14 | Hitachi, Ltd. | Highly thermal conductive grease composition and cooling device using the same |
| EP1378542A1 (en) * | 2001-03-09 | 2004-01-07 | Dow Corning Toray Silicone Co., Ltd. | Greasy silicone composition |
| EP1378542A4 (en) * | 2001-03-09 | 2004-05-12 | Dow Corning Toray Silicone | Greasy silicone composition |
| US7396872B2 (en) | 2001-03-09 | 2008-07-08 | Dow Corning Toray Silicone Co. | Greasy silicone composition |
| US7510998B2 (en) | 2004-05-21 | 2009-03-31 | Shin-Etsu Chemical Co., Ltd. | Silicon grease compositions |
| US8017684B2 (en) | 2005-12-27 | 2011-09-13 | Shin-Etsu Chemical Co., Ltd. | Heat conductive silicone grease compositions |
| JP6068733B2 (en) * | 2014-08-26 | 2017-01-25 | バンドー化学株式会社 | Thermally conductive resin molded product |
| JPWO2016031212A1 (en) * | 2014-08-26 | 2017-04-27 | バンドー化学株式会社 | Thermally conductive resin molded product |
| US10941325B2 (en) | 2014-08-26 | 2021-03-09 | Bando Chemical Industries, Ltd. | Thermally conductive resin molded article |
| US10457845B2 (en) | 2014-08-26 | 2019-10-29 | Bando Chemical Industries, Ltd. | Thermally conductive resin molded article |
| EP3150672A1 (en) | 2015-10-02 | 2017-04-05 | Shin-Etsu Chemical Co., Ltd. | Thermal conductive silicone composition and semiconductor device |
| KR20170040107A (en) | 2015-10-02 | 2017-04-12 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Thermal conductive silicone composition and semiconductor device |
| US9783723B2 (en) | 2015-10-02 | 2017-10-10 | Shin-Etsu Chemical Co., Ltd. | Thermal conductive silicone composition and semiconductor device |
| KR20190077345A (en) | 2016-10-31 | 2019-07-03 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Thermally conductive silicone composition, semiconductor device and method of manufacturing semiconductor device |
| US11236203B2 (en) | 2016-10-31 | 2022-02-01 | Shin-Etsu Chemical Co., Ltd. | Thermal conductive silicone composition, semiconductor device, and method for manufacturing semiconductor device |
| WO2019093052A1 (en) | 2017-11-09 | 2019-05-16 | 信越化学工業株式会社 | Thermally conductive silicone grease composition |
| KR20200086307A (en) | 2017-11-09 | 2020-07-16 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Thermal conductive silicone grease composition |
| US11186798B2 (en) | 2017-11-09 | 2021-11-30 | Shin-Etsu Chemical Co., Ltd. | Thermally conductive silicone grease composition |
| US10870786B2 (en) | 2018-05-31 | 2020-12-22 | Shin-Etsu Chemical Co., Ltd. | Low heat resistance silicone composition |
| KR20190136996A (en) | 2018-05-31 | 2019-12-10 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Low Heat Resistance Silicone Composition |
| EP3575363A1 (en) | 2018-05-31 | 2019-12-04 | Shin-Etsu Chemical Co., Ltd. | Low heat resistance silicone composition |
| WO2020129555A1 (en) | 2018-12-21 | 2020-06-25 | 信越化学工業株式会社 | Heat-conductive silicone composition and semiconductor device |
| KR20210105942A (en) | 2018-12-21 | 2021-08-27 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Thermally conductive silicone composition and semiconductor device |
| WO2020241054A1 (en) | 2019-05-27 | 2020-12-03 | 信越化学工業株式会社 | Thermally-conductive silicone composition, semiconductor device, and production method therefor |
| KR20220012850A (en) | 2019-05-27 | 2022-02-04 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Thermally conductive silicone composition, semiconductor device, and manufacturing method thereof |
| WO2023276846A1 (en) | 2021-07-02 | 2023-01-05 | 信越化学工業株式会社 | Heat-conductive silicone composition, semiconductor device, and method for manufacturing same |
| KR20240028463A (en) | 2021-07-02 | 2024-03-05 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Thermally conductive silicone composition, semiconductor device, and method of manufacturing the same |
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| Publication number | Publication date |
|---|---|
| JPH0639591B2 (en) | 1994-05-25 |
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