JPH0215353Y2 - - Google Patents

Description

[Detailed Description of the Invention] (1) Technical Field of the Invention The present invention relates to an electronic component cooling device for forced air cooling of electronic components such as multiple semiconductor elements or integrated circuits mounted on a printed circuit board. The present invention relates to an electronic component cooling device that can individually cool electronic components according to their mounting positions to enhance the cooling effect.

(2) Prior art and problems As shown in Fig. 1, a conventional electronic component cooling device has a plurality of printed circuit boards 2 on which a plurality of electronic components 1, 1, etc. are arranged and mounted on one side at appropriate intervals. Mounted on the wiring board 3 in parallel with Supplying cooling air to the electronic components 1,
1... was supposed to be cooled down. However, in this case, as shown in FIG. 2, the cooling air flows from one side of the printed circuit board 2 along the printed circuit board 2 in the direction of arrows A and B, and the electronic component 1a closest to the blower 5 receives fresh air. However, as the electronic components 1b, . .
Therefore, as shown in FIG. 3, the component temperature of the electronic component 1n located at the downstream mounting position Pn is lower than the component temperature Ta of the electronic component 1a located at the mounting position Pa on the upstream side with respect to the cooling air. Tn was higher, and there was a large difference in component temperature depending on the mounting position of the electronic component. For this reason, it is necessary to limit the heat generation density throughout the printed circuit board, especially on the downstream side of the circuit board, and the electronic components 1 to the printed circuit board 2 must be restricted.
It was not possible to increase the packaging density.

(3) Purpose of the invention This invention was created in response to the above circumstances.
It is an object of the present invention to provide an electronic component cooling device that can individually cool individual electronic components in accordance with their mounting positions to enhance the cooling effect.

(4) Structure of the invention According to the invention, the above purpose is to provide a printed circuit board, an electronic component mounted on the printed circuit board, and an air supply for individually supplying refrigerant to the electronic component. In an electronic component cooling device comprising a chamber and an exhaust chamber that individually sucks in and discharges refrigerant that has collided with the electronic component, the refrigerant is directed toward the surface of the electronic component in accordance with the mounting position of the electronic component. an air outlet inclined at an appropriate angle to the air supply chamber;
This is achieved by providing an electronic component cooling device characterized in that an inlet opening inclined at an appropriate angle corresponding to the outlet opening is formed in the exhaust chamber.

(5) Embodiments of the invention Hereinafter, embodiments of the invention will be described in detail with reference to the attached drawings.

FIG. 4 is an explanatory cross-sectional view showing the electronic component cooling device according to the present invention. On one side of the printed circuit board 11, a plurality of electronic components 12, 12, . . . are arranged and mounted at appropriate intervals. The above printed circuit board 11
An air supply chamber 13 and an exhaust chamber 14 are provided at a predetermined distance from the surface of the electronic components 12, 12, .

The air supply chamber 13 is for supplying cooling air to the electronic components 12, and is for supplying cooling air to the printed circuit board 11.
It is formed into a flat container shape extending approximately parallel to the plate surface (see Fig. 5), and the rear end is closed with a lid 15, etc., and the opening at the tip is provided with a blower 16, etc., as indicated by the arrow F. It is designed to supply cooling air in the direction. The individual electronic components 1 mounted on the printed circuit board 11 of the air supply chamber 13 are
From the side wall located on the upstream side of the cooling air with respect to the electronic component 12, a cylindrical outlet 17 is projected toward the surface thereof at an appropriate angle in accordance with the mounting position of the electronic component 12.

The exhaust chamber 14 sucks and discharges the air whose temperature has increased after cooling the electronic component 12, and is formed in the shape of a flat groove-shaped steel extending substantially parallel to the board surface of the printed circuit board 11. (See FIG. 5), an end plate 18 is erected at the tip thereof, and a suction fan 19 or the like is provided at the rear end opening to discharge hot air in the direction of arrow G. From the bottom plate located on the downstream side of the cooling air with respect to each electronic component 12 mounted on the printed circuit board 11 of the exhaust chamber 14, air is directed toward the surface of the electronic component 12 in accordance with the mounting position of the electronic component 12. Suction ports 20, which are inclined at appropriate angles in the opposite direction to the blow-off ports 17, each protrude in a cylindrical shape.

That is, as shown in FIG. 4, the air outlet 17 and the air inlet 20 are arranged symmetrically and inclined toward the upstream and downstream sides of the cooling air, respectively, with the electronic component 12 at the center. Part 1
The cooling air blown toward 2 as shown by arrow H cools down the electronic component 12 and increases its temperature, and then is sucked into the suction port 20 as shown by arrow I and is discharged to the outside. .

Here, an example of the structure of the air supply chamber 13 and exhaust chamber 14 will be explained with reference to FIG. 5. The air supply chamber 13 is formed in the shape of a flat container, and a substantially rectangular opening 22 is formed in the side wall 21 on the side closer to the surface on which the electronic component 12 is mounted. shaped air outlet 17
protrudes toward the surface of the electronic component 12. On the other hand, the exhaust chamber 14 is connected to the air supply chamber 13.
A substantially rectangular opening 24 is formed in the bottom plate 23, and a cylindrical suction port 20 is connected to the upper end of the opening 24 to connect the electronic component 12. protrudes toward the surface of Furthermore, an insertion hole 25 through which the outlet 17 of the air supply chamber 13 can pass is formed upstream of the opening 24 of the bottom plate 23 in the flow of cooling air. Then, the outlet 17 is inserted into the insertion hole 25 as shown by the dashed line in FIG.
The pairs are also brought together in contact with the tips of both side edges 26 of. At this time, as shown in FIG. 4, the tip of the end plate 18 of the exhaust chamber 14 comes into contact with the outer surface of the side wall 21 of the air supply chamber 13, and the tip of the exhaust path of the exhaust chamber 14 is closed.

To explain the use of the electronic component cooling device configured in this way, as shown in FIG. 4, a plurality of electronic components 12, 12...
When operating the printed board unit mounted with ..., the arrow F
In addition to supplying cooling air as shown in
9 or the like, the air in the air supply chamber 14 may be sucked and discharged as shown by arrow G. At this time, the cooling air is sequentially blown from the upstream side to the individual electronic components as shown by the arrow H through the outlet 17 of the air supply chamber 13 corresponding to the mounting position of the electronic component 12, and due to the heat exchange effect. The electronic component 12 is cooled down. The air whose temperature has increased due to this heat exchange effect is sucked into each electronic component 12 from the suction port 20 of the exhaust chamber 14 provided corresponding to the mounting position of the electronic component 12 by the negative pressure of the suction fan 19. The gas flows into the exhaust chamber 14 and is discharged to the outside as indicated by arrow G by the suction fan 19. Therefore, the air whose temperature has increased after cooling the electronic components 12a on the upstream side of the cooling air does not hit the electronic components 12b on the downstream side, and each electronic component 12 receives fresh cooling from the supply air chamber 13. The wind will blow. Therefore, by cooling the electronic components 12 individually to increase their cooling effect, the temperature of the electronic components 12 can be maintained regardless of whether the electronic components 12 are mounted upstream or downstream of the cooling air, as shown in FIG. It can be kept almost constant.

(6) Effects of the invention Since the invention is configured as described above, fresh cooling air can be supplied from the air supply chamber 13 in accordance with the mounting position of each electronic component 12 mounted on the printed circuit board 11. The electronic component 12 can be cooled down. Further, the air whose temperature has increased after cooling the electronic component 12 can be individually sucked and discharged through the suction port 20 of the exhaust chamber 14 without flowing to the other electronic components 12 side. Therefore, the electronic components 12 can be individually cooled according to their mounting positions, and the cooling effect can be enhanced. Since the electronic components 12 can be cooled individually in this way, a substantially constant cooling effect can be obtained regardless of the mounting position on the printed circuit board 11.
The temperature of the electronic component 12 can be kept almost constant over the entire surface of the electronic component 12. Therefore, the performance as a printed board unit can be improved. In addition, since the electronic components 12 can be individually cooled, restrictions on heat generation density are relaxed, and the desired cooling effect can be obtained even if the mounting interval is shortened.
The mounting density of the electronic components 12 on the printed circuit board 11 can be increased, and the air supply chamber 13 can be
The refrigerant that is injected obliquely through the outlet 17 and collides with the surface of the electronic component 12 is directly reflected and flows into the inlet 20 formed in the exhaust chamber 14 in an oblique direction opposite to the outlet 17. By being sucked in, the flow of the refrigerant becomes smooth, the air resistance of the refrigerant is reduced, and there is no reduction in cooling efficiency, so there is an economical effect that blowers such as cooling fans can be made smaller.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram showing a conventional electronic component cooling device, Fig. 2 is a cross-sectional explanatory diagram showing the flow of cooling air, and Fig. 3 is a line showing changes in component temperature with respect to the mounting position of electronic components in the conventional example. 4 is a cross-sectional explanatory diagram showing an electronic component cooling device according to the present invention,
FIG. 5 is an exploded explanatory view showing an example of the structure of the air supply chamber and exhaust chamber, and FIG. 6 is a diagram showing changes in component temperature with respect to mounting positions of electronic components in the present invention. 11...Printed circuit board, 12...Electronic component, 1
3...Air supply chamber, 14...Exhaust chamber, 1
6... Air blower, 17... Air outlet, 19... Suction fan, 20... Inlet.

Claims (1)

[Claims for Utility Model Registration] A printed circuit board 11, an electronic component 12 mounted on the printed circuit board 11, an air supply chamber 13 that individually supplies refrigerant to the electronic component 12, and An exhaust chamber 14 that individually sucks in and discharges the refrigerant that has collided with the electronic component 12, in an electronic component cooling device comprising: An electronic component cooling device characterized in that an air outlet 17 inclined at an appropriate angle is formed in the air supply chamber 13, and an intake port 20 inclined at an appropriate angle corresponding to the air outlet 17 is formed in the exhaust chamber 14.