JP2003115570A5

JP2003115570A5 -

Info

Publication number: JP2003115570A5
Application number: JP2001308912A
Authority: JP
Filing date: 2001-10-04
Publication date: 2005-06-09

Description

本発明は、このような事情にもとづいてなされたもので、筐体の薄形化を妨げることなく発熱体を効率良く冷却できる電子機器の提供を目的とする。 The present invention has been made based on such circumstances, and an object of the present invention is to provide an electronic device capable of efficiently cooling a heating element without hindering the thinning of the housing .

【００１０】
【課題を解決するための手段】
上記目的を達成するため、本発明の一つの形態に係る電子機器は、
筐体と、
上記筐体に収容され、発熱体を有する回路基板と、
上記筐体に収容され、上記発熱体を冷却するファンと、を具備している。
上記ファンは、上記回路基板と重なり合うファンケーシングと、上記ファンケーシングに形成され、少なくとも上記回路基板と向かい合う吸気口と、上記ファンケーシングに収容され、上記吸気口から空気を吸い込む羽根車とを含み、上記回路基板に上記ファンケーシングと向かい合う少なくとも一つの通孔を形成したことを特徴としている。 0010
[Means for solving problems]
In order to achieve the above object, the electronic device according to one embodiment of the present invention is
With the housing
A circuit board housed in the above housing and having a heating element ,
It is housed in the housing and includes a fan for cooling the heating element.
The fan includes a fan casing that overlaps with the circuit board, an intake port formed in the fan casing and facing at least the circuit board, and an impeller housed in the fan casing and sucking air from the intake port . It is characterized in that at least one through hole facing the fan casing is formed in the circuit board.

このような構成において、ファンの羽根車が回転すると、回路基板とファンケーシングとの間の空気が吸気口に吸い込まれ、この回路基板とファンケーシングとの間に吸気口に向かう空気流が形成される。また、回路基板の通孔を通じて回路基板と筐体との間の空気がファンケーシングの吸気口に吸い込まれる。このため、筐体内の空気がファンケーシングの吸気口に流れ込み易くなる。よって、ファン動作時の吸気抵抗を小さく抑えて、ファンケーシングに吸い込まれる吸入空気量を充分に確保することができる。 In such a configuration, when the impeller of the fan rotates, the air between the circuit board and the fan casing is sucked into the intake port, and an air flow toward the intake port is formed between the circuit board and the fan casing. The casing. Further, the air between the circuit board and the housing is sucked into the intake port of the fan casing through the through hole of the circuit board. Therefore, the air inside the housing easily flows into the intake port of the fan casing. Therefore, it is possible to suppress the intake resistance during fan operation to a small value and sufficiently secure the amount of intake air sucked into the fan casing.

さらに、上記構成によれば、ファンは回路基板と筐体との間の空気を吸引できるので、ファンケーシングと回路基板との間の間隔を狭めても、吸入空気量が不足することはない。この結果、ファンケーシングと回路基板とを可能な限り近づけて、筐体内部のスペースを減じることができ、筐体のコンパクト化を図る上で好都合となる。 Further, according to the above configuration, since the fan can suck the air between the circuit board and the housing , the intake air amount is not insufficient even if the distance between the fan casing and the circuit board is narrowed. As a result, the fan casing and the circuit board can be brought as close as possible to each other, and the space inside the housing can be reduced, which is convenient for making the housing compact.

【００５２】
【発明の効果】
以上詳述した本発明によれば、ファンケーシングに吸い込まれる吸入空気量を充分に確保することができ、発熱体を効率良く冷却することができる。さらに、ファンケーシングと回路基板との間隔を可能な限り狭めて、筐体を薄くコンパクトに形成できるといった利点がある。 [0052]
【The invention's effect】
According to the present invention described in detail above , a sufficient amount of intake air sucked into the fan casing can be sufficiently secured, and the heating element can be efficiently cooled. Further, there is an advantage that the space between the fan casing and the circuit board can be narrowed as much as possible to form the housing thin and compact.

【符号の説明】
４…筐体、４ａ…底壁、１５…回路基板、１６…隙間（第１の隙間）、１７…発熱体（半導体パッケージ）、２２…冷却ユニット、２４…放熱部、２５…ファン、２６…受熱部（受熱ブロック）、２７…ヒートパイプ、３１…ファンケーシング、３２…羽根車、４５，４６…吸気口（第１および第２の吸気口）、４８ａ，４８ｂ…通孔。 [Explanation of code]
4 ... casing, 4a ... bottom wall, 15 ... circuit board, 16 ... gap (first gap), 17 ... heating element (semiconductor package), 22 ... cooling unit, 24 ... radiator, 25 ... fan, 26 ... Heat receiving part (heat receiving block), 27 ... heat pipe, 31 ... fan casing, 32 ... impeller, 45, 46 ... intake ports (first and second intake ports), 48a, 48b ... through holes.

Claims

And
Housed in the housing, a circuit board having a heat generating element,
And a fan which is housed in the housing and cools the heating element,
The fan includes a fan casing overlapping with the circuit board, an intake port formed on the fan casing, facing at least the circuit board, and an impeller accommodated in the fan casing and sucking in air from the intake port .
An electronic apparatus characterized in that at least one through hole facing the fan casing is formed in the circuit board.

And
A circuit board housed in the housing and having a heating element;
A cooling unit housed in the housing and for cooling the heat generating body;
The cooling unit includes a heat receiving unit receiving the heat of the heat generating body, a heat releasing unit releasing the heat of the heat generating body, a heat pipe transferring the heat of the heat receiving unit to the heat releasing unit, and a cooling air to the heat releasing unit. And a fan to blow the
The fan is formed in the fan casing overlapping with the circuit board, formed in the fan casing, at least an intake port facing the circuit board, and accommodated in the fan casing, and sucks in air from the intake port while the air is And an impeller for blowing air to the heat radiating portion;
An electronic apparatus characterized in that at least one through hole facing the fan casing is formed in the circuit board .

The electronic device according to claim 1, wherein the through hole is located in the vicinity of an inlet of the fan casing .

3. The apparatus according to claim 1, wherein the housing has an outer wall facing the circuit board from the side opposite to the side where the fan casing is located with respect to the circuit board, and the outer wall and the circuit board A clearance is formed between the fan case and the fan case and the circuit board, and the through hole is opened to the clearance .

According to a second aspect of the present invention, the fan casing has a cooling air passage through which the air discharged from the impeller flows, and an outlet located at the downstream end of the cooling air passage, and the heat radiating portion An electronic device characterized in that it is located at an outlet .

6. The electronic device according to claim 5, wherein the housing has an exhaust port, and the heat radiating portion of the cooling unit is located between the discharge port of the fan casing and the exhaust port .

A housing having a bottom wall;
A circuit board housed in the housing and facing the bottom wall;
A heating element mounted on the circuit board;
And a fan which is housed in the housing and cools the heating element,
The fan includes a fan casing having an intake port at a position overlapping with the circuit board and facing at least the circuit board, and an impeller housed in the fan casing and sucking in air from the intake port.
An electronic apparatus comprising: at least one through hole facing the fan casing on the circuit board, the through hole opening in a gap between the circuit board and the bottom wall.

The electronic device according to claim 7, wherein the through hole is opened in a gap formed between the fan casing and the circuit board.

9. The electronic device according to claim 7, wherein the impeller is housed in the fan casing in a horizontal position in which the rotation axis is along the thickness direction of the housing. .