JPH02151405A - Cutting method and device - Google Patents

Abstract

PURPOSE:To reduce each moving stroke and time by half, to improve workability while reducing an accumulated error by half and to enhance the accuracy of cutting by simultaneously moving a holding means and a cutting means in the approaching or separating direction regarding the cutting dividing direction and cutting direction of a workpiece. CONSTITUTION:When a blade 5 is moved among cutting lines CLx in a cutting process, an arm member 4 is lifted up to specified height by driving a driving source 18 while a driving source 10 and a driving source 37 are synchronized and driven, a movable carriage 3 and a moving table 31 are shifted simultaneously at every half width mutually at regular intervals Px in the cutting lines CLx, and the blade 5 is located accurately onto the next cutting line CLx. The driving source 18 is driven and the arm member 4 is lowered up to a specified location while a driving source 14 and a driving source 34 are synchronized and driven on cutting, and the movable carriage 3 and a base member 30 are moved in the direction approaching to the cutting direction simultaneously, thus bringing the blade 5 into contact with a workpiece 50 only by the length of the cutting line CLx, then cutting predetermined length.

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to a cutting method and apparatus for cutting a workpiece, such as a semiconductor wafer, into a predetermined size using a rotating cutting blade made of diamond abrasive grains.

BACKGROUND ART 1 As a cutting device generally used in this type of cutting method, one having a configuration disclosed in, for example, Japanese Unexamined Patent Publication No. 62-54101 filed by the same applicant is well known as a conventional example. This conventional cutting device includes a holding means, ie, a chuck table, for holding a workpiece, and a support member, ie, a spindle, equipped with a blade for cutting the workpiece. The spindle is configured to reciprocate in a cutting direction, and the spindle reciprocates in an indexing direction for cutting a workpiece to a predetermined size. Problem 1 to be Solved by the Invention In the conventional example, since the holding means for the workpiece is configured to reciprocate only in the cutting direction of the workpiece, the stroke of the reciprocating movement of the holding means is large. In addition, since the stroke is large, the cutting operation takes time, resulting in poor workability. In addition, the supporting member of the blade is configured to reciprocate only in the indexing direction for cutting the workpiece to a predetermined size, and the supporting member of the blade is configured to reciprocate only in the indexing direction for cutting the workpiece to a predetermined size. Because the scale and spindle are housed in a booth where heat tends to accumulate, even if the scale itself is not easily affected by heat, other drive transmission mechanisms, spindles, etc. may be affected by heat and transfer. A cumulative error occurs in 8M, and in particular, by relying only on the support member for the movement of the cutting index, the cumulative shift flIffi "J3<m" is directly transmitted to the blade, resulting in the problem that the cumulative error cannot be absorbed. There are also problems with workability due to the movement stroke.In other words, in this type of industry, cutting wafers, etc.
High precision and high production efficiency are required at the same time, but in the conventional example, it is difficult to desire higher precision and production efficiency from the mechanical configuration. [Object of the Invention] The present invention provides the workpiece holding means in the conventional example;
The present invention aims to provide a cutting method and device that improves the mechanical structure of the support means that supports the blade and allows for higher precision and production efficiency. [Means for Solving the Problems] The cutting method of the present invention, which has been made to solve the problems of the conventional example and achieve the above object, includes a holding means for holding a workpiece, and a method for holding a workpiece in the holding means. The holding means and the cutting means are moved toward or away from each other at the same time with respect to the cutting index direction of the workpiece. In addition, the holding means and the cutting means are moved toward or away from each other at the same time with respect to the cutting direction of the workpiece, and this cutting method is implemented in a practical manner.
A specific device for performing M is equipped with a holding means for holding a workpiece, and a cutting means for cutting the workpiece held by the holding means, and the holding means and the cutting means are connected to the workpiece. Regarding the cutting index direction of the workpiece, if each workpiece can be moved by more than 1/2 of the maximum index length, 11:
By configuring the holding means and the +iQ cutting means to be movable in the cutting direction of the workpiece, each of them can cut at least 1/2 of the maximum cutting length of the workpiece. Since the workpiece and the cutting member that cuts it move relative to each other during both cutting and cutting, each movement stroke and time are halved, improving work efficiency, and the cumulative error in indexing is reduced due to the mutual movement. This reduces the amount of noise by half and improves accuracy. [Example] Next, the present invention will be explained in more detail with reference to the illustrated example. Reference numeral 1 denotes a base, and a cutting means A for the workpiece and a holding means B for holding the workpiece are mounted on the base. will be placed. The cutting means for the workpiece includes a first i'iT @ stand 3 placed on a plurality of rails 2 disposed on the base 1'', and a first i'iT @ stand 3 attached laterally to the re-movement stand 3. The blade 5 includes an arm member 4 that is attached to the arm member 4, and a blade 5 that is rotatably attached to the tip of the arm member. Said first Ii'J moving base 3
is an abbreviated stand consisting of a horizontal part 6 and a vertical part 7, and is placed on the dFrFr-ru 2 via a guide member 8 incorporated inside the horizontal part 6, and the guide member 8, a horizontal portion 6 is slidably engaged with and incorporated via a plurality of guide rails 9. Therefore, movable base 3
is disposed so as to be movable relative to the base 1 by the rails 2 in the left-right direction in the figure and by the guide rails 9 in the front-rear direction. The horizontal movement contributes to determining the dimensions for cutting the workpiece into a predetermined size, and is driven by an appropriate drive source 10 such as a pulse motor. That is, a drive source 10 is disposed on a base 1, and a deceleration mechanism 11 of the drive source is installed.
By screwing together the guide member 8 with a male threaded rod 12 connected to the rail 2 and disposed substantially parallel to the rail 2, and driving the drive source 10, the guide member 8 moves on the rail 2 in the left-right direction. As a result, the cutting means A including the movable table 3 moves in the direction of indexing the cutting dimension. In addition, since precision of movement is required,
A suitable bearing member 13 is provided on the free end side of the male threaded rod 12.
is supported by. The movement in the back and forth direction is for cutting the workpiece, and similarly to the drive source, a drive source 14 such as a pulse motor is mounted on the base 1, and a reduction mechanism 15 of the drive source is connected to a male threaded rod. 16 are connected to each other, and the male threaded rod 16 is disposed substantially parallel to the guide rail 9 and is screwed together at an appropriate position on the movable base 3. By driving the drive source 14, the cutting means A including the movable table 3 moves in the cutting direction along the guide rail 9. The arm member 4 is arranged to be movable up and down with respect to the vertical portion 7 of the first movable base 3. That is, a sub-rail 1γ is disposed substantially perpendicularly in the vertical direction on one side of the vertical portion 7, and a drive source 18 similar to the above-described drive source is attached near one side end of the sub-rail 17. reduction mechanism 1
A male threaded rod 20 is connected to the male threaded rod 9.
are disposed substantially parallel to the mJ rail 17 and are screwed into a sub-base 21 attached to the base of the arm member 4. By driving the drive 1ia, the arm member 4 can be moved approximately vertically in the up and down direction as appropriate. The free end of the male threaded rod 20 is supported by a suitable bearing member 22. The blade 5 is rotatably attached to the tip of the arm member 4, and its specific configuration is such that the blade 5 is attached to the tip of a rotating shaft 24 of a suitable electric motor 23 disposed within the arm member 4. , the rotary shaft 24 is integrally formed with a flange portion 25 near its tip, and is supported on the tip side of the arm member 4 by a bearing member 26 that can be divided into two and is configured to sandwich the seven flange portions 25 from both sides; The rotary shaft 24 is mounted on a bearing so that it does not move at all in the axial direction, and the blade 5 is rotated for cutting via the rotary shaft 24 by the drive of the electric motor 23. The holding means B that holds the workpiece includes a movable base member 30, a moving table 31, and a chuck table 32.
The base member 30 is reciprocally disposed on the base 1 and on a plurality of rails 33 disposed in a direction perpendicular to the arm member 4 in correspondence with the tip position of the arm member 4. It is configured to be placed thereon and its movement is performed by a drive source 34 and a male threaded rod 35 in the same manner as the movement of each mechanism or means described above. Of course, in this case as well, the male threaded rod 35 is arranged substantially parallel to the rail 33. The movement of the base member 30 is for cutting the workpiece, and its drive source 34 is driven in synchronization with the drive source 14. A movable table 31 is disposed above the base member 30 via a plurality of rails 36, and a chuck table 32 for setting and holding a workpiece is disposed on the movable table. The movement of the movable table 31 is also performed by a drive source 31 and a male threaded rod 38, similar to the drive mechanism described above, and this drive source 37 is driven in synchronization with the drive source 10. Therefore, the movement of the moving table 31 contributes to dimensional indexing for cutting the workpiece to a predetermined size. The chuck table 32 has the function of suctioning and holding the workpiece as in the conventional example, and also has the function of holding the workpiece by suction and
It has a rotation function to turn. A signal detection mechanism for accurately controlling the displacement and OJ collapse is disposed at each movable portion of each of the constituent parts. That is, the first signal detection mechanism a detects the amount of movement of the movable table 3 in the cutting dimension indexing direction, and the second signal detection mechanism a detects the amount of movement of the movable table 3 in the cutting direction.
(not shown), a third signal detection mechanism b that detects the amount of movement of the arm member 4 in the vertical direction, and a fourth signal detection mechanism that detects the amount of movement of the base member 30 in the cutting direction. (not shown) and a fifth signal detection mechanism C that detects the movement 8 m of movement of the moving table 31 in the direction of indexing the cutting dimension are respectively arranged close to the moving part. Since these signal detection mechanisms have a configuration similar to that used in the conventional example, one of them, signal detection mechanism a, will be explained, and the main parts will be given the same reference numerals and the details will be explained. is omitted. The signal detection mechanism a detects the rail 2 inside the base 1.
It is composed of a linear scale 40 having a predetermined scale arranged substantially parallel to the linear scale 40 and an optical detector 41 for reading the scale of the linear scale.
is supported at both ends by brackets 43 via elastic members 42. Further, the photoelectric detector 41 is supported by a moving member, in the case of this detection mechanism, an arm 44 attached to the guide member 8 in an implanted state. Incidentally, the scale is, for example, a line having a width of 1 μm arranged at an interval of 1 μm.

[Method Description 1] To explain the present invention in detail together with an explanation of the operation of the apparatus having the above configuration, when cutting a workpiece 50 such as a semiconductor wafer, for example, the workpiece 50 has the following structure as shown in FIG. As shown, a plurality of cutting lines are provided in a grid pattern. That is, a first set of cutting lines CLX are formed in multiple rows with a constant interval px, and a second set of cutting lines CLy are formed in multiple rows with a constant interval Py in a direction perpendicular to the cutting lines CLx. ing. A large number of rectangular regions R are divided by each cutting line provided in a grid pattern.
A is provided with a required circuit pattern, which itself is a general pattern. The workpiece 50 is placed on the chuck table 32 and held by suction, and the cutting line and the blade 5 are aligned. This positioning may be performed using conventional optical detection means. After this positioning work is completed, the first set of cutting lines CLX is first set using the blade 5 to sequentially cut. In this case, we use the term "cutting" because the wafer is not completely cut away, but may be cut over at least half or more of its thickness. Then, in the sequential cutting of the first set of cutting lines CLx, cutting is performed from the cutting line located at the end thereof, and the blade 5 is sequentially moved to the next cutting line to perform a continuous cutting process. It is. In this cutting process, the blade 5 moves along the cutting line CLx.
When moving between the two, the arm member 4 is lifted to a predetermined height by the driving of the driving source 18, and
and the driving source 37 are driven in synchronization, and the movable base 3 and the moving table 31 simultaneously move a fixed interval px on the cutting line CLx by half width at a time, so that the blade 5 is accurately positioned on the next cutting line CLx. will be located in The movement of the movable table 3 and the movable table 31 is performed by the first signal detection mechanism a and the fifth signal detection mechanism C, respectively, and by sharing the movement duties between them, the movement work can be carried out quickly. , and the cumulative error is also reduced. Next, when cutting, drive the drive source 18 to cut the arm member 4.
The movable table 3 and the base member 30 are lowered to a predetermined position, and the drive sources 14 and 34 are driven synchronously.
and at the same time move in a direction approaching the cutting direction,
Approximately 1/2 of the length of each cutting line CL
By moving the blade 5 beyond the cutting line C
The LX length division workpiece 50 is contacted and cut to a predetermined length. After cutting is performed along this cutting line CLx, when the blade 5 moves to the next cutting line, the arm member 4 is lifted to a predetermined height by the drive of the drive source 18, and the drive source 10 and The drive source 37 is driven synchronously, and the movable base 3 and the moving table 31 are moved along the cutting line CLx.
A direction in which the movable table 3 and the base member 30 are separated from each other with respect to the cutting direction by simultaneously moving the fixed interval Px by a half width at a time, and simultaneously driving the drive source 14 and the drive source 34 in synchronization. By moving the blade 5 and the workpiece 50 at the same time, the blade 5 and the workpiece 50 each return more than approximately 1/2 of the length of the cutting line CLx, so the return movement and time are halved, significantly improving workability in the cutting process. It will improve. In other words, the movement in the indexing direction for indexing the cutting dimension and the movement in the cutting direction for cutting are performed by approximately 1 on the blade side, that is, the cutting means, and on the workpiece side, that is, the holding means.
By simultaneously moving the parts by /2, the time required for each movement is halved, which not only improves work efficiency, but also reduces the cumulative error in the indexing direction. After the cutting of the first set of cutting lines CLx is completed, the chuck table 32 is rotated 90" to cut the second set of cutting lines CLy.
In the case of sequential cutting along , the same cutting process as described above is performed. Effects of the Invention As explained above, the cutting method according to the present invention includes a holding means for holding a workpiece, and a cutting means for cutting the workpiece held by the holding means, By moving the cutting means and the cutting means simultaneously toward or away from each other with respect to the cutting index direction of the workpiece, the indexing time is halved, workability is improved, and the workpiece is Since the side is in a state where it is difficult to be affected by heat, the detection means that controls the amount of movement is always under the optimum temperature condition, and there are various excellent effects such as almost no cumulative error caused by the influence of heat. play. Further, by moving the holding means and the cutting means in the direction toward or away from each other at the same time with respect to the cutting direction of the workpiece, the movement time and time in the cutting direction can be relatively halved, and This also has the excellent effect of significantly improving workability. Further, the cutting device according to the present invention includes a holding means for holding a workpiece, and a cutting means for cutting the workpiece held by the holding means, and the holding means and the cutting means are connected to each other. With respect to the cutting index direction of the workpiece, the structure is such that each workpiece can be moved by 1/2 or more of the maximum index length of the workpiece, and the holding means and the cutting means are moved in the cutting direction of the workpiece. By making the cutting movement possible by more than 1/2 of the maximum cutting quality of each workpiece, the positioning work and cutting work between the workpiece and the cutting tool can be performed quickly and accurately, and the indexing This has the excellent effect of significantly reducing cumulative dimensional errors, thereby increasing precision and production efficiency.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway schematic side view of a cutting device according to the present invention, and FIG. 2 is a plan view showing an example of a workpiece to be cut by the device. A: Cutting means for the workpiece B: Holding means for the workpiece 1: Base 2, 17, 33, 36: Rail 3・・・・・・
...Movable base 4...Arm member 5...
...Blade 6...Horizontal part 7...
...Vertical part 8...Guide member 9...
... Guide rail 10, 14.18.34.37 ... Drive source 11
, 15.19... deceleration mechanism 12, 16.20.
35.38... Male thread rod 13, 22.26
... Bearing member 23 ... Electric motor 24 ...
... Rotating shaft 25 ... Flange portion 30 ... Base member 31 ... Moving table 32 ... Chuck table 40 ...
...Scale 41...Photoelectric detector 5
0...Workpiece a...First signal detection mechanism b...Third signal detection mechanism C...Fifth signal detection mechanism

Claims (4)

[Claims] (1) A holding means for holding a workpiece, and a cutting means for cutting the workpiece held by the holding means, and the holding means and the cutting means are used for indexing the cutting of the workpiece. A cutting method characterized by moving toward or away from each other at the same time. (2) The cutting method according to claim (1), characterized in that the holding means and the cutting means are simultaneously moved toward or away from each other with respect to the cutting direction of the workpiece. (3) A holding means for holding a workpiece, and a cutting means for cutting the workpiece held by the holding means, and the holding means and the cutting means are used for indexing the cutting of the workpiece. Regarding the direction, 1/ of the maximum indexing length of the workpiece, respectively.
A cutting device characterized in that it is capable of moving two or more times. (4) The holding means and the cutting means are each set to 1/1/2 of the maximum cutting length of the workpiece in the cutting direction of the workpiece.
Claim (3) characterized in that two or more cutting movements are possible.
) The cutting device described.