JPH02148791A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH02148791A JPH02148791A JP30178088A JP30178088A JPH02148791A JP H02148791 A JPH02148791 A JP H02148791A JP 30178088 A JP30178088 A JP 30178088A JP 30178088 A JP30178088 A JP 30178088A JP H02148791 A JPH02148791 A JP H02148791A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- printed wiring
- terminal
- wiring board
- ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 239000011347 resin Substances 0.000 claims abstract description 25
- 229920005989 resin Polymers 0.000 claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000011247 coating layer Substances 0.000 abstract description 10
- 230000015572 biosynthetic process Effects 0.000 abstract description 6
- 239000004020 conductor Substances 0.000 abstract description 3
- 239000000976 ink Substances 0.000 description 33
- 238000000034 method Methods 0.000 description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
主粟上圓且■分立
本発明はプリント配線板の製造方法に関し、特に、絶縁
基板上に形成されたプリント配線回路の接続ランド部に
ジャンパー回路等の他の回路部を、銅ペースト等の導電
性インキを被着することにより製造するプリント配線板
の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a printed wiring board, and in particular, to a method for manufacturing a printed wiring board, in particular, connecting other circuit parts such as jumper circuits to connection lands of a printed wiring circuit formed on an insulating substrate. The present invention relates to a method of manufacturing a printed wiring board by applying conductive ink such as copper paste.
従来互侠止
従来のプリント配線板は絶縁基板に銅箔を張設した所謂
銅張積層板のｔｉ４箔を所要の回路に従ってエツチング
処理することにより所要のプリント配線回路を形成する
ことにより製造される。Conventional Interference Conventional printed wiring boards are manufactured by etching TI4 foil, a so-called copper-clad laminate in which copper foil is stretched over an insulating substrate, according to the required circuit to form the required printed wiring circuit. .
また、かかるプリント配線板におけるプリント配線回路
の相互間のジャンパー回路等の回路の形成に当たっては
、第５図に示す如く、プリント配線回路ｌＯの接続用端
子部ｌに接続端子部４ａを電気的に接続せしめたジャン
パー回路部４を銅ペーストあるいはその他の導電性ペー
ストから成る導電性インキをシルク印刷等の手段にて被
着し、これを硬化することにより形成する製造方法が開
発実施され、最近はこの種回路の形成に有効な導電性イ
ンキも種々開発されている。In addition, when forming a circuit such as a jumper circuit between the printed wiring circuits on such a printed wiring board, as shown in FIG. A manufacturing method has been developed and implemented in which the connected jumper circuit section 4 is formed by applying conductive ink made of copper paste or other conductive paste by means such as silk printing and curing it. Various conductive inks that are effective in forming this type of circuit have also been developed.
”° よ゛と る
しかるに銅ペースト等の導電性ペーストの塗布又はシル
ク印刷によって回路を形成する場合に、プリント配線板
上の銅箔の回路端子部１と導電性ペースト即ちインキと
の密着性に問題を生ずる。However, when forming a circuit by applying a conductive paste such as copper paste or by silk printing, the adhesion between the circuit terminal portion 1 of the copper foil on the printed wiring board and the conductive paste, ie, ink, is affected. cause problems.
即ち、導電性ペーストは導電性向上のためにカーボン、
銀又は銅粒子の導電物質を樹脂インキの中に多量に混入
するためｗ４箔端子面との密着力を左右する樹脂分が少
なく、通常の樹脂インキに比較して金属面への密着力が
小さく、ややもすると電気的な接続力が不安定となるば
かりでなく、機械的強度が弱く部品のはんだ付等の際の
熱衝撃によって剥離することがある等、重大な欠点とな
っていた。In other words, the conductive paste contains carbon, carbon, etc. to improve conductivity.
Because a large amount of conductive material such as silver or copper particles is mixed into the resin ink, there is less resin that affects the adhesion to the W4 foil terminal surface, and the adhesion to metal surfaces is smaller than normal resin ink. This has serious drawbacks, such as not only the electrical connection force becoming unstable, but also the mechanical strength being weak and peeling due to thermal shock during soldering of parts.
因って本発明は、導電性ペーストと回路端子部との電気
的２機械的強度の向上を計り得るプリント配線板の製造
方法の提供を目的とするものである。Therefore, an object of the present invention is to provide a method for manufacturing a printed wiring board that can improve the electrical and mechanical strength of the conductive paste and the circuit terminal portion.
４ ｎ’ ｆ−の−
本発明プリント配線板の製造方法は、絶縁基板上にプリ
ント配線回路を形成するとともにこのプリント配線回路
のうちの回路端子部に他の回路を銅ペースト等の導電性
インキを被着して形成するプリント配線板の製造方法に
おいて、前記プリント配線回路の回路端子部の端子面の
一部を樹脂インキによって被覆した後前記導電性インキ
を被着して前記プリント配線回路の回路端子部の接続回
路を形成することを特徴とする。4 n' f-- The method for manufacturing a printed wiring board of the present invention involves forming a printed wiring circuit on an insulating substrate, and applying other circuits to the circuit terminals of the printed wiring circuit using conductive ink such as copper paste. In the method of manufacturing a printed wiring board, a part of the terminal surface of the circuit terminal portion of the printed wiring circuit is coated with resin ink, and then the conductive ink is applied to form the printed wiring circuit. It is characterized by forming a connection circuit of the circuit terminal portion.
作■
本発明のプリント配線板の製造方法によれば、導電性イ
ンキによる回路形成に先き立って、プリント配線板のプ
リント配線回路の回路端子部の端子面の一部に樹脂イン
キによる被膜層を形成した後に、前記導電性インキによ
る回路を形成することにより、端子面の一部に形成した
樹脂インキによる被膜層により、導電性インキとの相溶
性による密着作用を得ることができ、前記端子面と導電
性インキによる回路部との密着部の電気的２機械的強度
を向上することができる。According to the method of manufacturing a printed wiring board of the present invention, a coating layer of resin ink is applied to a part of the terminal surface of the circuit terminal portion of the printed wiring circuit of the printed wiring board prior to circuit formation using conductive ink. By forming a circuit using the conductive ink after forming the conductive ink, a coating layer of the resin ink formed on a part of the terminal surface can provide an adhesion effect due to its compatibility with the conductive ink, and the terminal It is possible to improve the electrical and mechanical strength of the contact portion between the surface and the circuit portion formed by the conductive ink.
裏隻孤
本発明プリント配線板の製造方法の実施例を図面につい
て説明する。An embodiment of the method for manufacturing a printed wiring board of the present invention will be described with reference to the drawings.
（第１実施例）
第１図および第２図は本発明プリント配線板の製造方法
の第１実施例を示し、第１図はプリント配線回路におけ
る端子部の端子面に樹脂インキにより多点状の被膜層を
設けた状態を示す拡大平面図、第２図ａＬよ端子部にジ
ャンパー回路を接続して形成した状態を示す拡大平面図
、第２図すは第２図ａのＡ−Ａ線断面図である。(First Example) Figures 1 and 2 show a first example of the method for manufacturing a printed wiring board of the present invention. An enlarged plan view showing the state in which the coating layer is provided, FIG. FIG.
第１図および第２図に示す如く、本発明のプリント配線
板の製造方法においては、絶縁基板２０の上側に形成し
たプリント配線回路１０のうちの端子部１に、他の回路
、例えばジャンパー回路４を形成する場合には、まず第
１図に示す如く、ジャンパー回路４の形成に先き立って
、端子部１の表面に樹脂インキ、例えば、ジャンパー回
路４の形成に使用される導電性ペーストの組成中の導電
材を除いた樹脂インキと同一組成から成る樹脂インキを
使用して印刷等の手段により複数の突起２ａを多点状に
被着した被ＩＩＱ層２を形成する。As shown in FIGS. 1 and 2, in the printed wiring board manufacturing method of the present invention, other circuits, such as jumper circuits, are connected to the terminal portions 1 of the printed wiring circuit 10 formed on the upper side of the insulating substrate 20. 4, as shown in FIG. 1, prior to forming the jumper circuit 4, resin ink, such as a conductive paste used for forming the jumper circuit 4, is applied to the surface of the terminal portion 1. Using a resin ink having the same composition as the resin ink except for the conductive material in the composition, the IIQ layer 2 having a plurality of protrusions 2a adhered at multiple points is formed by means such as printing.
しかる後に、導電性インキを使用してジャンパー回路４
の印刷を施し、これを硬化することにより端子部１に端
子部４ａを電気的に接続したジャンパー回路４を形成す
ることができる。After that, jumper circuit 4 is printed using conductive ink.
By printing and curing this, a jumper circuit 4 in which the terminal portion 4a is electrically connected to the terminal portion 1 can be formed.
また、ジャンパー回路４について５ま、絶縁性のオーバ
ーコート被膜５を被着することにより保ｇＩする。Further, the jumper circuit 4 is maintained by applying an insulating overcoat film 5.
さらに、プリント配線＋ＪＮ２１のジャンパー回路４の
形成に当たっては、プリント配線回路１０との関係上、
他のプリント配線回路１０との絶縁を施す必要がある部
位に対してはあらかじめ絶縁液Ｈ（図示しない）を被着
した後に形成することは言うまでもない。Furthermore, in forming the jumper circuit 4 of printed wiring + JN21, due to the relationship with the printed wiring circuit 10,
It goes without saying that the portions that need to be insulated from other printed wiring circuits 10 are formed after being coated with insulating liquid H (not shown) in advance.
従って、通常は、ジャンパー回路４等の回路形成に先き
立って実施されるプリント配線回路１０上側に被着する
絶縁被膜の形成と同時に、すなわち、絶縁被膜の形成に
当たって実施される絶縁用樹脂インキによるシルク印刷
と同時に、前記端子部１の端子面に対する突起２ａを多
点状に被着する被膜層２の印刷を実施することによって
工程の増加を防止することができる。但し、この際の樹
脂インキについては、当然のことながら、絶縁被膜と同
様の樹脂インキにより突起２ａが形成されることになる
。Therefore, the insulating resin ink is usually applied at the same time as the formation of the insulating film to be applied to the upper side of the printed wiring circuit 10, which is performed prior to the formation of circuits such as the jumper circuit 4, that is, at the time of forming the insulating film. At the same time as silk printing, an increase in the number of steps can be prevented by printing the coating layer 2 that covers the protrusions 2a in multiple points on the terminal surface of the terminal portion 1. However, regarding the resin ink at this time, the protrusions 2a are naturally formed using the same resin ink as the insulating coating.
尚、前記端子部１の被膜層２については、端子面に複数
の突起２ａが被着されて端子面が部分的に被覆され、そ
の他の面が露出する構成となる。The coating layer 2 of the terminal portion 1 has a structure in which a plurality of protrusions 2a are attached to the terminal surface so that the terminal surface is partially covered and the other surface is exposed.
以上の実施例によって明らかな通り本発明のプリント配
線板の製造方法によれば、プリント配線回路ＩＯの形成
後の必要なジャンパー回路４等の回路形成に当り通常の
樹脂インキが金属面に対しても導電性インキに対しても
優れた密着性を有する特性を利用して端子部１の端子面
の一部に樹脂インキを被着した後に導電性インキを被着
してジャンパー回路４等の回路を形成するものである。As is clear from the above embodiments, according to the printed wiring board manufacturing method of the present invention, ordinary resin ink is applied to the metal surface during the formation of necessary circuits such as the jumper circuit 4 after the formation of the printed wiring circuit IO. Taking advantage of the property of having excellent adhesion to conductive ink, a part of the terminal surface of terminal portion 1 is coated with resin ink, and then conductive ink is coated to form a circuit such as jumper circuit 4. It forms the
（第２実施例）
第３図および第４図は本発明プリント配線板の製造方法
の第２実施例を示すもので、第３図は端子部の拡大平面
図、第４図ａは端子部にジャンパー回路を形成した状態
の拡大平面図、第４図すは第４図ａのＢ−Ｂ線断面図で
ある。(Second Embodiment) FIGS. 3 and 4 show a second embodiment of the method for manufacturing a printed wiring board of the present invention. FIG. 3 is an enlarged plan view of the terminal portion, and FIG. 4 a is an enlarged plan view of the terminal portion. FIG. 4 is an enlarged plan view of a state in which a jumper circuit is formed, and FIG. 4 is a sectional view taken along the line B--B of FIG. 4a.
第２実施例のプリント配線板の製造方法は、第１実施例
の多点状の被膜層２に換えて、プリント配線回路１０の
端子部１の端子面に網目３ａ状の被膜層３を、樹脂イン
キをシルク印刷等の手段にて被着することにより形成す
る。The method for manufacturing a printed wiring board according to the second embodiment includes forming a mesh 3a-shaped coating layer 3 on the terminal surface of the terminal portion 1 of the printed wiring circuit 10, in place of the multi-point coating layer 2 of the first embodiment. It is formed by applying resin ink by means such as silk printing.
しかる後、ジャンパー回路４を第１実施例と同様の方法
により形成するものである。Thereafter, the jumper circuit 4 is formed by the same method as in the first embodiment.
その他の製造方法については前記第１実施例と全く同様
であるので、同一部分には同一番号を付してその説明を
省略する。Since the other manufacturing methods are completely the same as those in the first embodiment, the same parts are given the same numbers and the explanation thereof will be omitted.
光匪皇及果
本発明プリント配線板の製造方法によればプリント配線
回路の端子部に、樹脂インキを網目、あるいは多点状と
して端子面に破着させた後、その上に導電性インキによ
るジャンパー回路等の回路を被着して形成することによ
って、端子面とジャンパー回路等の回路接続部における
導電ペーストとの間の剥離を防止し、プリント配線板に
おける欠陥の発生を確実に防止することができる。According to the method of manufacturing a printed wiring board of the present invention, resin ink is applied to the terminals of a printed wiring circuit in the form of a mesh or multi-dots and then broken onto the terminal surface, and then a conductive ink is applied thereon. By depositing and forming a circuit such as a jumper circuit, it is possible to prevent separation between the terminal surface and the conductive paste at the circuit connection part of the jumper circuit, etc., and to reliably prevent the occurrence of defects in the printed wiring board. Can be done.
第１図および第２図は本発明プリント配線板の製造方法
の第１実施例を示し、第１図はプリント配線回路におけ
る端子部の端子面に樹脂インキにより多点状の被膜層を
設けた状態を示す拡大平面図、第２図ａは端子部にジャ
ンパー回路を接続して形成した状態を示す拡大平面図、
第２図すは第２図ａのＡ−Ａ線断面図、第３図および第
４圓は本発明プリント配線板の製造方法の第２実施例を
示すもので、第３図は端子部の拡大平面図、第４図ａは
端子部にジャンパー回路を形成した状態の拡大平面図、
第４図すは第４図ａのＢ−Ｂ線断面図、第５図は従来の
端子面と導電性インキによるジャンパー回路との接続を
示す部分拡大図である。
１・・・端子部
２．３・・・樹脂インキによる被膜層
４・・・導電性ペーストにより形成したジャンパー回路
１０・・・プリント配線回路 ２０・・・絶縁基板２
１・・・オーバーコート被膜Figures 1 and 2 show a first embodiment of the method for manufacturing a printed wiring board of the present invention, and Figure 1 shows a method in which a multi-dot coating layer is provided with resin ink on the terminal surface of a terminal portion in a printed wiring circuit. An enlarged plan view showing the state; FIG. 2a is an enlarged plan view showing the state in which a jumper circuit is connected to the terminal portion;
Figure 2 is a cross-sectional view taken along the line A-A in Figure 2a, Figures 3 and 4 show a second embodiment of the method for manufacturing a printed wiring board of the present invention, and Figure 3 shows a terminal section. An enlarged plan view, FIG. 4a is an enlarged plan view of a state in which a jumper circuit is formed in the terminal part,
FIG. 4 is a sectional view taken along the line B--B in FIG. 4a, and FIG. 5 is a partially enlarged view showing the connection between a conventional terminal surface and a jumper circuit using conductive ink. 1...Terminal portion 2.3...Coating layer made of resin ink 4...Jumper circuit 10 formed of conductive paste...Printed wiring circuit 20...Insulating substrate 2
1...Overcoat film
Claims (3)
このプリント配線回路のうちの回路端子部に他の回路を
銅ペースト等の導電性インキを被着して形成するプリン
ト配線板の製造方法において、前記プリント配線回路の
回路端子部の端子面の一部を樹脂インキによって被覆し
た後前記導電性インキを被着して前記プリント配線回路
の回路端子部の接続回路を形成することを特徴とするプ
リント配線板の製造方法。1. In a method of manufacturing a printed wiring board, in which a printed wiring circuit is formed on an insulating substrate, and another circuit is formed on the circuit terminal portion of the printed wiring circuit by coating a conductive ink such as copper paste, A printed wiring board characterized in that a part of a terminal surface of a circuit terminal portion of a wiring circuit is coated with resin ink and then the conductive ink is applied to form a connection circuit of the circuit terminal portion of the printed wiring circuit. manufacturing method.
被着して被膜層を形成して成る特許請求の範囲第１項記
載のプリント配線板の製造方法。2. 2. The method of manufacturing a printed wiring board according to claim 1, wherein the terminal surface of the circuit terminal portion is coated with resin ink in a dot pattern to form a film layer.
着して被膜層を形成して成る特許請求の範囲第１項記載
のプリント配線板の製造方法。3. 2. The method of manufacturing a printed wiring board according to claim 1, wherein the terminal surface of the circuit terminal portion is coated with resin ink in multiple points to form a film layer.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30178088A JP2603863B2 (en) | 1988-11-29 | 1988-11-29 | Printed wiring board |
| EP19890121802 EP0375954B1 (en) | 1988-11-29 | 1989-11-25 | Method of manufacturing printed circuit board |
| DE1989613941 DE68913941T2 (en) | 1988-11-29 | 1989-11-25 | Process for the production of a printed circuit board. |
| US07/717,870 US5219607A (en) | 1988-11-29 | 1991-06-12 | Method of manufacturing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30178088A JP2603863B2 (en) | 1988-11-29 | 1988-11-29 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02148791A true JPH02148791A (en) | 1990-06-07 |
| JP2603863B2 JP2603863B2 (en) | 1997-04-23 |
Family
ID=17901084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30178088A Expired - Fee Related JP2603863B2 (en) | 1988-11-29 | 1988-11-29 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2603863B2 (en) |
-
1988
- 1988-11-29 JP JP30178088A patent/JP2603863B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2603863B2 (en) | 1997-04-23 |
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