JPH02147973A - Apparatus for inspecting semiconductor - Google Patents

Abstract

PURPOSE:To improve reliability of machines to be provided in a chamber of high and low temperature atmospheres as well as reduce production cost by providing a stretchable mechanism comprising heat-insulating members which stretch according to movement of an inspection stage. CONSTITUTION:In bellows mechanisms 23, 24, a Y-directional bellows 24 stretches along a Y guide rail 25 according to movement of an inspection stage 22 without no gap generated between a heat-insulating wall 2 and the inspection stage 22 when the inspection stage 22 moves along Y direction, while similarly an X-directional bellows 23 stretches along an X guide rail 26 according to movement of the inspection stage 22 without no gap generated between the heat-insulation wall 2 and the inspection stage 22 when the inspection stage moves along X direction. Therefore heat generated on the inspection stage 22 is cut by the Y-directional bellows 24 and the X-directional bellows 23: it prevents thermal influence to an omitted driving mechanism, electrical wiring, etc. provided on lower faces of respective moving stages 19, 20.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a half-body inspection device, and in particular to a one-tray type semiconductor inspection device for inspecting a plurality of semiconductor devices housed in an inspection tray. Regarding equipment.

(Prior Art) Conventionally, in the process of inspecting the electrical characteristics of packaged semiconductor devices, since there are a wide variety of semiconductor device packages, a dedicated inspection device (IC handler) is required to match the order of each package. Perhaps it was necessary, or in response to the recent trend toward high-mix, low-volume production of semiconductor devices, all
A universal handler has been developed that is capable of measuring semiconductor elements of many shapes with one unit by exchanging two parts.

A one-tray type is known as a form of supplying semiconductor elements to such a universal handler.

As shown in FIG. 5, in this one-tray type, a large number of device storage sections 2 are provided on a tray 1, for example, in a lattice shape, and packaged semiconductor devices 3, such as QFP, S
This is a method in which each semiconductor element 3 on the tray 1 is sequentially brought into contact with an inspection terminal such as a probe needle provided on a test head of an IC handler.

In addition, in recent years, in order to test semiconductor cords at predetermined test temperatures, for example in high and low temperature environments, the test section is housed in a high temperature and low temperature chamber. A so-called high-temperature type IC configured to perform
Handler is known.

(Problems to be Solved by the Invention) By the way, due to the recent improvement in the durability of semiconductor elements, they are increasingly being used in environments with severe temperature conditions. In order to test the characteristics of semiconductor devices under such severe temperature conditions, the test temperature settings of semiconductor testing equipment are becoming higher and lower; for example, testing at temperatures between -60°C and 200°C is now necessary. has been done.

However, since the chamber houses equipment such as drive grooves for the tray conveyance system and electrical wiring, which have durability issues when used in high and low temperatures, The problem was that it was not easy to do. Furthermore, there is a problem in that if these devices are made to have a heat-resistant or cold-resistant structure, the cost of the equipment will increase.

The present invention has been made in view of the above-mentioned conventional circumstances,
It is an object of the present invention to provide a semiconductor inspection device that has a simple structure, increases the reliability of equipment installed in a chamber with a high-temperature/low-temperature atmosphere, and can reduce device manufacturing costs.

[Structure of the Invention] (Means for Solving the Problems) The semiconductor inspection apparatus of the present invention includes at least two
An inspection tray containing a plurality of semiconductor devices is placed on an inspection table having a heating or cooling mechanism arranged to be movable in dimension, and each semiconductor device on the tray is placed in a predetermined position while moving the inspection table. In a semiconductor testing device that performs testing at a testing temperature of The device is characterized by being provided with an expansion/contraction mechanism made of a heat insulating member that expands and contracts.

Note that as the expansion/contraction mechanism, a bellows mechanism made of a heat insulating member that expands/contracts following the moving direction of the examination table is suitable. Moreover, it is also possible to provide a configuration in which the heat insulating effect is further enhanced by air purging inside the bellows mechanism.

(Function) According to the semiconductor inspection device having the above configuration, it is possible to improve the reliability of equipment installed in a chamber with a high-temperature/low-temperature atmosphere with a simple structure, and to reduce the cost of manufacturing the device. becomes possible.

(Example) Hereinafter, one example in which the present invention is applied to a high-temperature type semiconductor inspection device will be described with reference to the drawings.

FIG. 1 is a plan view showing the semiconductor inspection apparatus of the embodiment, and the second
The figure is a side view in the A direction of FIG. 1.

A high-temperature chamber 11 containing an inspection section is covered with a heat-insulating wall 12 made of a heat-resistant material, for example, a stainless steel material, and outside the high-temperature chamber 11 is a tray 1 containing semiconductor cords 3 as shown in FIG. A trace stocker 13 containing a large number of stages is provided. The tray 1 used in this example is made of a material with excellent heat conductivity such as stainless steel or aluminum, and its size is approximately 2551 + 1 m x
210+nm x height l0IllIn, 4 lines x 5 on the surface
Independent semiconductor element accommodating portions 3 are formed in a grid pattern in rows.

Each tray 1 accommodated in the trace stocker 13 is taken out one by one by the take-out mechanism 14 in the trace stocker 13, and the trays 1 in the high-temperature chamber 11 are taken out one by one by the take-out mechanism 14 in the trace stocker 13. It is transported to the heating mechanism 16.

The tray 1 conveyed to the tray preheating mechanism 16 is heated to an inspection set temperature, for example, 200°C.

A three-dimensional movement mechanism consisting of an X stage 19, a Y stage 20, and a Z stage (elevating mechanism) 21 is held by a tray loading holder 18a of a tray transport mechanism 17 disposed above the tray preheating mechanism 16. The sample is transferred onto the inspection table 22 which is driven by.

This inspection table 22 has a built-in heater mechanism, for example, a silicon rubber heater, and while the tray 1 on which it is placed is maintained at a set inspection temperature, for example, 200'C, the semiconductor elements in the tray 1 are inspected based on a predetermined inspection procedure. The various electrical characteristics are measured by sequentially bringing each terminal of No. 3 into contact with a probe needle (not shown).

By the way, the moving direction of the X stage 19 and the moving direction of the Y stage 20 are such that the inspection table 2 is moved downwardly into the heat insulating chamber 11.
A heat insulating member, for example, an elastic mechanism made of nylon filament cloth, for example, a bellows mechanism 23, 24, to prevent heat from entering.
covered by.

As shown in FIG. 3, in this bellows mechanism 23 and 24, the X-direction bellows 24 is attached to a pair of Y guide rails 25 provided on both sides of the Y stage 20 in the sliding direction. It completely covers both sides of the inspection table 22 in the Y direction. On the other hand, the X-direction bellows 23 is attached to a pair of X guide rails 26 provided on both sides of the X-stage 19 in the sliding direction below the Y-stage 20, and between the heat-insulating wall 2 and the X-direction side surfaces of the examination table 22. completely covers.

In such a bellows mechanism 23, 24, when the examination table 22 moves in the Y direction, the X direction bellows 24 expands and contracts along the Y guide rail 25 as the examination table 22 moves, and there is a space between the heat insulating wall 2 and the examination table 22. In the same way, the inspection table 22
When moving in the X direction, the X direction bellows 23 moves against the examination table 2.
2, expands and contracts along the X guide rail 26,
There is no gap between the heat insulating wall 2 and the inspection table 22. Therefore, the heat generated by the inspection table 22 is shielded by the Y-direction bellows 24 and the X-direction bellows 23, and each moving stage 19
．． It is possible to prevent thermal effects on the drive mechanism, electrical wiring, etc. (not shown) disposed on the lower surface of the device 20.

The tray 1 that has been inspected is again moved below the tray transport mechanism 17, where it is held by the tray unloading holding part 18b of the tray transport mechanism 17 and transported to the unloading station 27, and then transferred to the unloading port 28. It was then carried out to the outside of the insulation chamber.

As shown in FIG. 4, the tray conveyance mechanism 17 includes an upper heat insulating wall 12a1 of the heat insulating chamber 11. : It is attached to the base plate 31 provided along the X direction. A rectangular slide hole 32 is bored in the base plate 31 along the elongated direction.
Slide mechanisms such as LM guide mechanisms 33 are provided on the base plates on both sides of 2, respectively. And this L
A predetermined interval, for example 325 m1, is provided via the M guide mechanism 33.
A slide plate 34 is mounted with a tray carrying-in holding part 18a1 and a tray carrying-out holding part 18b suspended at intervals of m.

The slide plate 34 is configured to move from side to side in the figure along the LM guide mechanism 33 by means of a telescoping mechanism, such as a rotless cylinder 35, provided on the base plate 31.

A pair of guide rails 36 are provided on both inner walls in the longitudinal direction of the slide hole 32, and the guide rails 36 are provided with a heat insulating material that covers the slide holes 32 on both sides in the direction of movement of the slide plate 34 and expands and contracts in the direction of movement of the slide plate 34. Elastic mechanism made of a member such as nylon filament cloth, such as the bellows mechanism 3
7 is installed. With this bellows mechanism 37, the slide hole 32 is always closed even when the slide plate 34 is moved, and heat leakage from the slide hole 32 can be prevented.

As described above, according to the semiconductor inspection apparatus of this embodiment, the heat of the inspection table 22 is disposed on the lower surface of the inspection table 22 so as to cover the horizontal section of the heat insulating chamber, and the heat of the inspection table 22 follows the movement of the inspection table 22. Since the insulating bellows mechanisms 23 and 24 that expand and contract with each other are installed, equipment placed below the examination table, such as the examination table moving mechanism and electrical wiring, can be isolated from the high-temperature atmosphere. The reliability of these devices installed will increase. Further, since there is no need to configure the equipment with expensive heat-resistant members, it is possible to reduce the manufacturing cost of the device.

By the way, in the above-mentioned embodiment, an example was explained in which the present invention is applied to a semiconductor inspection device that performs high-temperature measurements, but the present invention is not limited to this, and can be similarly applied to a semiconductor inspection device that performs low-temperature measurements. It is possible to do so. In this case, a heating mechanism such as a preheating mechanism or an examination table serves as a cooling mechanism.

The tray 1 transported outside the heat insulation chamber is transported to the next processing step, for example, to a sorter mechanism 29 on the side of the heat insulation chamber, where the semiconductor devices 3 are sorted based on the inspection results.

[Effects of the Invention] As explained above, according to the present invention, it is possible to improve the reliability of equipment arranged in a chamber with a high-temperature/low-temperature atmosphere with a simple structure, and to reduce device manufacturing costs. It becomes possible.

[Brief explanation of the drawing]

1 is a front view showing the configuration of a semiconductor inspection apparatus according to an embodiment of the present invention, FIG. 2 is a side view in the direction A of FIG. 1, and FIG. 3 is a plan view showing the configuration of the bellows mechanism of FIG. 1. , a front and side view, FIG. 4 is a plan view and a front view showing the structure of the tray conveyance mechanism of the embodiment, and FIG. 5 is a plan view showing the structure of the tray. 1... Tray 3... Semiconductor element, 1
DESCRIPTION OF SYMBOLS 1... High temperature chamber, 12... Heat insulation wall, 16... Tray preheating mechanism, 17...
...Tray transport mechanism, 19...X stage, 2
0...Y stage, 22...Inspection table,
23...X-direction bellows, 24...Y-direction bellows, 31...base plate, 32...
・Slide hole, 7... Bellows mechanism.

Claims (1)

[Scope of Claims] An inspection tray containing a plurality of semiconductor devices is placed on an inspection table having a heating or cooling mechanism that is disposed movably in at least two dimensions in a chamber, and the inspection table is moved. In a semiconductor testing apparatus for testing each semiconductor element on the tray at a predetermined testing temperature, the chamber is arranged so as to substantially cover at least a two-dimensional moving range of the testing table in a cross section of the testing table in the moving direction. What is claimed is: 1. A semiconductor inspection device comprising: an expansion mechanism made of a heat insulating member that expands and contracts in accordance with the movement of an inspection table;