JPH02146839U - - Google Patents
Info
- Publication number
- JPH02146839U JPH02146839U JP1989054198U JP5419889U JPH02146839U JP H02146839 U JPH02146839 U JP H02146839U JP 1989054198 U JP1989054198 U JP 1989054198U JP 5419889 U JP5419889 U JP 5419889U JP H02146839 U JPH02146839 U JP H02146839U
- Authority
- JP
- Japan
- Prior art keywords
- case
- terminal pin
- connector
- support recess
- pad support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989054198U JPH02146839U (enExample) | 1989-05-11 | 1989-05-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989054198U JPH02146839U (enExample) | 1989-05-11 | 1989-05-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146839U true JPH02146839U (enExample) | 1990-12-13 |
Family
ID=31576049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989054198U Pending JPH02146839U (enExample) | 1989-05-11 | 1989-05-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146839U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11297450A (ja) * | 1998-04-08 | 1999-10-29 | Nippon Abs Ltd | 端子のボンディング面の保護方法および電子機器ハウジング |
-
1989
- 1989-05-11 JP JP1989054198U patent/JPH02146839U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11297450A (ja) * | 1998-04-08 | 1999-10-29 | Nippon Abs Ltd | 端子のボンディング面の保護方法および電子機器ハウジング |