JPH02146440U - - Google Patents

Info

Publication number
JPH02146440U
JPH02146440U JP1989055599U JP5559989U JPH02146440U JP H02146440 U JPH02146440 U JP H02146440U JP 1989055599 U JP1989055599 U JP 1989055599U JP 5559989 U JP5559989 U JP 5559989U JP H02146440 U JPH02146440 U JP H02146440U
Authority
JP
Japan
Prior art keywords
electronic component
flange part
head
tip
wall surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989055599U
Other languages
English (en)
Japanese (ja)
Other versions
JPH075636Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989055599U priority Critical patent/JPH075636Y2/ja
Publication of JPH02146440U publication Critical patent/JPH02146440U/ja
Application granted granted Critical
Publication of JPH075636Y2 publication Critical patent/JPH075636Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP1989055599U 1989-05-15 1989-05-15 電子部品のリムーブ治具 Expired - Lifetime JPH075636Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989055599U JPH075636Y2 (ja) 1989-05-15 1989-05-15 電子部品のリムーブ治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989055599U JPH075636Y2 (ja) 1989-05-15 1989-05-15 電子部品のリムーブ治具

Publications (2)

Publication Number Publication Date
JPH02146440U true JPH02146440U (enExample) 1990-12-12
JPH075636Y2 JPH075636Y2 (ja) 1995-02-08

Family

ID=31578692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989055599U Expired - Lifetime JPH075636Y2 (ja) 1989-05-15 1989-05-15 電子部品のリムーブ治具

Country Status (1)

Country Link
JP (1) JPH075636Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05251892A (ja) * 1992-03-06 1993-09-28 Nec Corp テーピング品検査用オートハンドラの不良品取外し装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05251892A (ja) * 1992-03-06 1993-09-28 Nec Corp テーピング品検査用オートハンドラの不良品取外し装置

Also Published As

Publication number Publication date
JPH075636Y2 (ja) 1995-02-08

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